公开(公告)号：US5440805A

公开(公告)日：1995-08-15

申请号：US127975

申请日：1993-09-27

申请人： Robert C. Daigle ,  W. David Smith ,  John A. Olenick ,  David J. Arthur ,  Gwo S. Swei

发明人： Robert C. Daigle ,  W. David Smith ,  John A. Olenick ,  David J. Arthur ,  Gwo S. Swei

IPC分类号： H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02 ,  H05K3/20 ,  H05K3/24 ,  H05K3/28 ,  H05K3/32 ,  H05K3/42 ,  H05K3/46 ,  H05K3/36

CPC分类号： H05K3/4632 ,  H01L21/4857 ,  H01L23/49894 ,  H01L23/5383 ,  H05K3/205 ,  H05K3/4617 ,  H05K3/4647 ,  H05K3/4682 ,  H01L2221/68345 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K1/0289 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/09563 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K2203/1189 ,  H05K3/20 ,  H05K3/243 ,  H05K3/28 ,  H05K3/328 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4658 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： In accordance with the present invention, a circuit assembly is manufactured in an additive process using at least one layer of a fluoropolymer composite material and a conductive material. The conductive layers are plated, and the fluoropolymer composite layers are laminated. The use of the filled fluoropolymeric composite eliminates the need for a barrier metal layer between the insulation and the conductors. A plurality of these circuit assemblies are stacked, one on top of the other. At least, selected exposed locations of the conductive material comprise a diffusible conductive material (e.g., gold). Once stacked the circuit assemblies are subjected to lamination under heat and pressure to simultaneously fuse adjacent fluoropolymer composite material and diffuse adjacent diffusible conductive material together to form an integral multilayer circuit having solid conductive interconnects.

摘要翻译： 根据本发明，使用至少一层含氟聚合物复合材料和导电材料的添加工艺制造电路组件。 对导电层进行电镀，层压含氟聚合物复合层。 使用填充的氟聚合物复合材料消除了在绝缘体和导体之间的阻挡金属层的需要。 多个这些电路组件一个在另一个之上堆叠。 至少，导电材料的选定的暴露位置包括可扩散的导电材料（例如金）。 一旦堆叠，电路组件在热和压力下进行层压以同时熔化相邻的含氟聚合物复合材料并将相邻的可扩散导电材料扩散在一起以形成具有固体导电互连的整体多层电路。

公开(公告)号：US5287619A

公开(公告)日：1994-02-22

申请号：US847895

申请日：1992-03-09

申请人： W. David Smith ,  John A. Olenick ,  Carlos L. Barton ,  Jane L. Cercena ,  Daniel J. Navarro ,  Kathleen R. Olenick ,  Angela M. Kneeland ,  Thomas S. Kneeland ,  Mark F. Sylvester ,  Curtis H. Kempton ,  Scott E. Derosier ,  Lynn E. Burdick ,  Richard T. Traskos ,  Robert B. Huntington ,  James S. Rivers ,  Samuel Gazit ,  Jeffrey B. Ott ,  William P. Harper

发明人： W. David Smith ,  John A. Olenick ,  Carlos L. Barton ,  Jane L. Cercena ,  Daniel J. Navarro ,  Kathleen R. Olenick ,  Angela M. Kneeland ,  Thomas S. Kneeland ,  Mark F. Sylvester ,  Curtis H. Kempton ,  Scott E. Derosier ,  Lynn E. Burdick ,  Richard T. Traskos ,  Robert B. Huntington ,  James S. Rivers ,  Samuel Gazit ,  Jeffrey B. Ott ,  William P. Harper

IPC分类号： H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02 ,  H05K3/20 ,  H05K3/24 ,  H05K3/28 ,  H05K3/32 ,  H05K3/42 ,  H05K3/46 ,  H01K3/10

CPC分类号： H05K3/4682 ,  H01L21/4857 ,  H01L23/49894 ,  H01L23/5383 ,  H05K3/205 ,  H05K3/4617 ,  H05K3/4632 ,  H05K3/4647 ,  H01L2221/68345 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K1/0289 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/09563 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K2203/1189 ,  H05K3/20 ,  H05K3/243 ,  H05K3/28 ,  H05K3/328 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4658 ,  Y10S428/901 ,  Y10T29/49165

摘要： In accordance with the present invention, an MCM substrate product is manufactured in an additive process using multiple layers of a fluoropolymer composite material and copper. The copper layers are plated, and the fluoropolymer composite layers are laminated. A seeding process promotes reliable bonding between the fluoropolymer composite material and the plated copper. The use of the filled fluoropolymeric composite eliminates the need for a barrier metal layer between the insulation and the conductors. The MCM substrate device of the present invention may have multiple metal layers and multiple dielectric layers; four or five, or more, of each in a single structure would be easily achieved and is typical. The structure would include lead lines in separate mutually orthogonal planes (sometimes referred to as "x" and "y" lead lines) sandwiched between ground and power voltage planes of copper. The MCM substrate device of the present invention also has solid copper vias, which may be used either as electrical interconnection between layers of the MCM substrate and/or to the I/C's to be packaged in the module, or as thermal vias for heat conduction for thermal management. The manufacturing process of the present invention makes it possible to start or stop any via in any layer of the device.

摘要翻译： 根据本发明，使用多层含氟聚合物复合材料和铜的添加工艺制造MCM基板产品。 镀铜层，层压含氟聚合物复合层。 接种工艺促进了氟聚合物复合材料和镀铜之间的可靠接合。 使用填充的氟聚合物复合材料消除了在绝缘体和导体之间的阻挡金属层的需要。 本发明的MCM衬底器件可以具有多个金属层和多个电介质层; 单个结构中的四个或五个或更多个将容易实现并且是典型的。 该结构将包括夹在铜的接地和电源电压平面之间的分开的相互正交的平面（有时称为“x”和“y”引线）中的引线。 本发明的MCM衬底器件还具有固体铜通孔，其可以用作MCM衬底的层和/或要封装在模块中的I / C之间的电互连，或者用作用于热传导的热通孔 用于热管理。 本发明的制造过程使得可以在设备的任何层中启动或停止任何通孔。