摘要:
Disclosed is a positive photoresist. The photoresist has as its polymeric component a substantially water and base insoluble, photolabile polymer. The photoresist further includes a photo acid generator that is capable of forming a strong acid. This photo acid generator may be a sulfonate ester derived from a N-hydroxyamide, or a N-hydroxyimide. Finally, the photoresist composition includes an appropriate photosensitizer.
摘要:
A positive acting photoresist comprising a film forming reactive polymer; an iodonium initiator or a non-ionic compound that generates triflic acid upon exposure to radiation; and a multifunctional organic carboxylic acid is provided as well as use thereof.
摘要:
A positive acting photoresist comprising a film forming reactive polymer; an iodonium initiator or a non-ionic compound that generates triflic acid upon exposure to radiation; and a multifunctional organic carboxylic acid is provided as well as use thereof.
摘要:
A method and composition are shown for producing a positive-acting photoimagible epoxy resin. In addition to the epoxy resin, the compositions include a dual component cross-linking system which combines a basic curing agent with an onium or arylonium salt. The onium or arylonium salt produces a protic acid upon exposure to irradiation causing a reaction with the basic curing agent which renders the agent ineffective as an epoxy curing agent during subsequent heating. During a subsequent bake operation, only the unexposed regions of the epoxy will cross-link. As a result, the exposed areas wash away, leaving only the cured reverse image.
摘要:
A method of reworking a printed circuit board having a surface including areas needing to be reworked including the steps of covering the surface with a dielectric leaving uncovered at least the areas of the surface to be reworked, and selectively providing corrective circuitry on the dielectric interconnected to the uncovered areas of the surface needing to be reworked. In addition, a printed circuit board having a surface including reworked areas including a dielectric covering the surface leaving uncovered at least the reworked areas, and corrective circuitry on the dielectric interconnected to the uncovered reworked areas.