公开(公告)号：US6121067A

公开(公告)日：2000-09-19

申请号：US017260

申请日：1998-02-02

申请人： Robert L. Canella

发明人： Robert L. Canella

IPC分类号： H01L21/56 ,  H01L23/544 ,  H01L21/00

CPC分类号： H01L23/544 ,  H01L21/56 ,  H01L2223/54406 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2924/0002

摘要： A method for additively de-marking a packaged integrated circuit die bearing engraved marking indicia on an exterior surface thereof. The marked surface is covered with an overlayer of material to fill the engraved markings and provide a surface suitable for re-marking. The covering material may be applied in a flowable state by applicator contact or by non-contact dispensing, or may be applied as a preformed segment. The exterior surface to be covered may be pre-treated to enhance bonding of the covering material. The covering material may be bonded to the marked surface in a post-application curing operation. De-marked integrated circuit packages are also disclosed.

摘要翻译： 一种用于在其外表面上附加地对标记标记标记的封装的集成电路模具进行标记的方法。 标记的表面覆盖有材料覆盖层，以填充雕刻的标记并提供适于重新标记的表面。 覆盖材料可以通过施用器接触或通过非接触分配以可流动状态施加，或者可以作为预成型段施加。 待覆盖的外表面可以被预处理以增强覆盖材料的粘结。 覆盖材料可以在后施加固化操作中结合到标记表面。 还公开了未标记的集成电路封装。

公开(公告)号：US5986235A

公开(公告)日：1999-11-16

申请号：US897774

申请日：1997-07-21

申请人： Robert L. Canella

发明人： Robert L. Canella

IPC分类号： B23K26/08 ,  G06K1/12 ,  H01L21/00 ,  H01L23/544 ,  B23K26/00

CPC分类号： H01L21/67282 ,  B23K26/0838 ,  G06K1/126 ,  H01L23/544 ,  H01L2223/54473 ,  H01L2924/0002

摘要： A laser marking apparatus and method for marking the surface of a singulated article such as a semiconductor chip are described herein. Semiconductor chips are fed along inclined, parallel tracks to a laser marking field where they are subsequently marked by a laser beam. As the laser beam is marking chips associated with one track, chips associated with other tracks that have already been marked are replaced by unmarked chips. In this manner, the laser is continually being used to mark semiconductor chips without having to wait for unmarked chips to move to the marking location.

公开(公告)号：US5937270A

公开(公告)日：1999-08-10

申请号：US590919

申请日：1996-01-24

申请人： Robert L. Canella

发明人： Robert L. Canella

IPC分类号： B23K26/08 ,  G06K1/12 ,  H01L21/00 ,  H01L23/544 ,  H01L21/66

CPC分类号： H01L21/67282 ,  B23K26/0838 ,  G06K1/126 ,  H01L23/544 ,  H01L2223/54473 ,  H01L2924/0002

摘要： A laser marking apparatus and method for marking the surface of a singulated article such as a semiconductor chip are described herein. Semiconductor chips are fed along inclined, parallel tracks to a laser marking field where they are subsequently marked by a laser beam. As the laser beam is marking chips associated with one track, chips associated with other tracks that have already been marked are replaced by unmarked chips. In this manner, the laser is continually being used to mark semiconductor chips without having to wait for unmarked chips to move to the marking location.

公开(公告)号：US5648728A

公开(公告)日：1997-07-15

申请号：US636449

申请日：1996-04-23

申请人： Robert L. Canella

发明人： Robert L. Canella

IPC分类号： B07C5/344 ,  G01R1/073 ,  G01R31/02 ,  G01R31/28 ,  G01R1/00 ,  G01R1/04

CPC分类号： B07C5/344 ,  G01R1/07314 ,  G01R31/2831

摘要： An apparatus for positioning a workpiece comprises a plurality of pedestals each comprising a first portion having a first width, a second portion having a second width greater than the first width, and a chamfered portion interposed between the first and second portions. The inventive apparatus further comprises a support having a plurality of holes therein for receiving the plurality of pedestals, the support further having a plurality of chamfered portions with one the chamfered portion about a periphery of each the hole. A base urges the chamfered portions of the pedestal away from the chamfered portions of the support.

摘要翻译： 一种用于定位工件的装置包括多个基座，每个基座包括具有第一宽度的第一部分，具有大于第一宽度的第二宽度的第二部分和插入在第一和第二部分之间的倒角部分。 本发明的装置还包括其中具有用于容纳多个基座的多个孔的支撑件，所述支撑件还具有多个倒角部分，其中一个倒角部分围绕每个孔的周边。 基座推动基座的倒角部分远离支撑件的倒角部分。

公开(公告)号：US5528603A

公开(公告)日：1996-06-18

申请号：US431952

申请日：1995-05-01

申请人： Robert L. Canella ,  Greg D. Stevenson ,  Dave E. Charlton ,  Scott A. Earnest

发明人： Robert L. Canella ,  Greg D. Stevenson ,  Dave E. Charlton ,  Scott A. Earnest

IPC分类号： G01R31/30 ,  G01R31/3193 ,  G06F11/00 ,  G06F11/26

CPC分类号： G01R31/3193 ,  G01R31/3004 ,  G06F11/076 ,  G06F2201/88

摘要： An integrated circuit testing apparatus and method of testing. In a first embodiment an amplifier amplifies the difference in a reference integrated circuit (RIC) response and a device under test integrated circuit (DUTIC) response to an electrical stimulus. The electrical stimulus is provided at an input of the DUTIC and the RIC by a stimulus circuit. A analog comparator determines when the amplified differences exceeds an adjustable threshold value. The sensitivity of the comparator is adjustable and the desired threshold value is adjusted before testing begins. If the amplified difference exceeds the threshold value of the comparator an error signal is generated. The apparatus of the invention includes a presetable counter which generates a device fail signal if a predetermined number of error signals are generated by the comparator. An initialization circuit loads a selectable value into the counter to provide a variable number of allowable errors before a DUTIC fails the test. In a second embodiment a precision voltage reference potential is adjusted to select a desired minimum potential for a high logic signal and a desired maximum potential for a low logic signal. The integrated circuit testing apparatus of the second embodiment also utilizes a RIC. The DUTIC and the RIC respond to the same electrical stimulus. The responses of the DUTIC and the RIC to the electrical stimulus are compared. If the responses have different logic levels the DUTIC automatically fails the test. If the responses have the same logic levels, the test circuit then compares the value of the DUTIC response to the minimum and maximum potentials of the precision voltage reference potential. If the DUTIC response does not lie either above or below the desired minimum and maximum potentials, respectively, the DUTIC fails the test since its potential falls within a failure window lying between the desired minimum and maximum values. Conversely if the DUTIC response falls above or below either of the desired minimum or maximum values, respectively, and has the same logic state as the RIC the DUTIC passes the test.

公开(公告)号：US20100315806A1

公开(公告)日：2010-12-16

申请号：US12761807

申请日：2010-04-16

申请人： Robert L. Canella

发明人： Robert L. Canella

IPC分类号： F21L4/00

CPC分类号： H01H36/0006 ,  F21L4/00 ,  F21V15/01 ,  F21V23/0414 ,  F21V31/00 ,  F21Y2115/10

摘要： A personal light including a battery power source connected in series with a light-emitting diode (LED) light source and a switching mechanism configured for non-contact actuation are disposed within an environmentally sealed chamber. A reflector is employed to maximize reflection of light emanating from the LED and a lens having an anti-reflective coating thereon associated with the LED opposite the reflector to enhance the light output and magnify the narrow beam of the LED. The switch employs an actuation mechanism exterior to the chamber to activate and deactivate the light.

摘要翻译： 包括与发光二极管（LED）光源串联连接的电池电源和被配置为非接触致动的开关机构的个人灯被设置在环境密封的室内。 使用反射器来最大化从LED发出的光的反射，以及在其上具有与反射器相对的LED的抗反射涂层的透镜，以增强光输出并放大LED的窄光束。 开关采用室外的致动机构来激活和停用光。

公开(公告)号：US07364319B2

公开(公告)日：2008-04-29

申请号：US11246449

申请日：2005-10-06

申请人： Robert L. Canella

发明人： Robert L. Canella

IPC分类号： F21L4/00

CPC分类号： H01H36/0006 ,  F21L4/00 ,  F21V15/01 ,  F21V23/0414 ,  F21V31/00 ,  F21Y2115/10

摘要： A personal light including a battery power source connected in series with a light-emitting diode (LED) light source and a switching mechanism configured for non-contact actuation are disposed within an environmentally sealed chamber. A reflector is employed to maximize reflection of light emanating from the LED and a lens having an anti-reflective coating thereon associated with the LED opposite the reflector to enhance the light output and magnify the narrow beam of the LED. The switch employs an actuation mechanism exterior to the chamber to activate and deactivate the light.

摘要翻译： 包括与发光二极管（LED）光源串联连接的电池电源和被配置为非接触致动的开关机构的个人灯被设置在环境密封的室内。 使用反射器来最大化从LED发出的光的反射，以及在其上具有与反射器相对的LED的抗反射涂层的透镜，以增强光输出并放大LED的窄光束。 开关采用室外的致动机构来激活和停用光。

公开(公告)号：US07279788B2

公开(公告)日：2007-10-09

申请号：US10992424

申请日：2004-11-18

申请人： Robert L. Canella

发明人： Robert L. Canella

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： G01R1/0466 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/325 ,  H05K3/42 ,  H05K2201/09472 ,  H05K2201/09481 ,  H05K2201/10265 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2203/0242 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01004

摘要： A spring contact for establishing electrical contact between a lead element of an IC device and a substrate. The spring contact generally comprises a contact portion and a base portion. The contact portion, which generally comprises a coil-type compression spring, is configured to engage and resiliently bias against a lead element of the IC device. The spring contact is disposed in a mating aperture formed in the substrate. The base portion of the spring contact is configured to secure the spring contact within the mating aperture and to establish electrical contact with the substrate. A plurality of such spring contacts and mating apertures may be arranged on the substrate in an array corresponding to the pin-out of the IC device. A clamping element secures the IC device to the substrate and biases the IC device against the spring contacts.

摘要翻译： 用于在IC器件的引线元件和衬底之间建立电接触的弹簧触点。 弹簧接触件通常包括接触部分和基部。 通常包括线圈型压缩弹簧的接触部分构造成与IC器件的引线元件接合并弹性偏压。 弹簧触点设置在形成在基板中的配合孔中。 弹簧触点的基部构造成将弹簧触头固定在配合孔内并与基底建立电接触。 多个这样的弹簧触点和配合孔可以以对应于IC器件引脚的阵列布置在衬底上。 夹紧元件将IC器件固定到基板上，并使IC器件抵抗弹簧触点偏压。

公开(公告)号：US06244569B1

公开(公告)日：2001-06-12

申请号：US09217032

申请日：1998-12-21

申请人： Robert L. Canella ,  Tony T. Ibarra

发明人： Robert L. Canella ,  Tony T. Ibarra

IPC分类号： B24B4106

CPC分类号： H01L21/67778 ,  B23Q7/005

摘要： A lift mechanism for controlled lifting and lowering, especially suitable for lifting and lowering a tray of ICs. The lift mechanism includes a horizontally movable drive wedge element having an upper inclined surface and a slave wedge element having a lower inclined surface slidingly supported on the drive wedge element upper inclined surface. Horizontal movement of the slave wedge element is constrained while vertical movement is permitted, so that horizontal movement of the drive wedge element raises or lowers the slave wedge element. A lift structure extending upwardly from the slave wedge element may be employed to engage a tray as, for example, when loading or unloading trays from a transport at a shuttle assembly. A dual-action drive mechanism may move the drive wedge element horizontally, while a dual-action stop mechanism may be employed to limit travel of the drive wedge element at a position short of full vertical extension.

摘要翻译： 用于控制提升和降低的提升机构，特别适用于提升和降低IC托盘。 提升机构包括具有上倾斜表面的水平移动的驱动楔形元件和具有滑动地支撑在驱动楔形元件上倾斜表面上的下倾斜表面的从楔形元件。 在允许垂直运动的同时约束从楔形元件的水平移动，使得驱动楔形元件的水平运动升高或降低从楔形元件。 可以采用从从楔形元件向上延伸的提升结构来接合托盘，例如当从托盘组件的运输工具装载或卸载托盘时。 双作用驱动机构可以水平地移动驱动楔形元件，同时可以采用双作用停止机构来限制驱动楔形元件在没有完全垂直延伸的位置上的移动。

公开(公告)号：US6135291A

公开(公告)日：2000-10-24

申请号：US8228

申请日：1998-01-16

申请人： Robert L. Canella

发明人： Robert L. Canella

IPC分类号： B07C5/344 ,  G01R31/28 ,  B07C5/00 ,  B07C7/00

CPC分类号： G01R31/2893 ,  B07C5/344 ,  Y10S414/105 ,  Y10S414/115

摘要： A method for dispensing, receiving, storing, testing or binning packaged integrated circuit devices using at least one vertically-oriented, removable, tubular magazine disposed above a controllably-driven, rod-like indexing element extending from a drive below the magazine. A magazine, with an associated indexing element and drive, is configurable as an individual magazine module. The indexing element, under power of the drive, raises or lowers a vertical stack of devices to a desired level adjacent the top of the magazine to dispense or receive an individual device from a feed mechanism, such as a pick-and-place mechanism. A number of magazine modules may be assembled in a multi-module array, which is particularly suitable for binning tested devices, with a sort category being directed to each magazine.

摘要翻译： 一种用于使用至少一个垂直取向的可拆卸的管状储存器来分配，接收，存储，测试或分类封装的集成电路器件的方法，所述管状杂志架设置在从所述盒下方的驱动器延伸的可控驱动的棒状分度元件之上。 具有相关索引元素和驱动器的杂志可配置为单独的杂志模块。 驱动器的功率下的分度元件将垂直堆叠的装置升高或降低到与料仓顶部相邻的期望水平，以从进给机构（例如拾取和放置机构）分配或接收单个装置。 许多杂志模块可以组装成多模块阵列，其特别适用于分类测试的设备，其中分类类别被引导到每个杂志。