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1.
公开(公告)号:US20080006938A1
公开(公告)日:2008-01-10
申请号:US11484544
申请日:2006-07-10
申请人: Robert Patti , Sangki Hong , Ramasamy Chockalingam
发明人: Robert Patti , Sangki Hong , Ramasamy Chockalingam
IPC分类号: H01L23/48
CPC分类号: H01L23/585 , H01L21/76898 , H01L23/481 , H01L24/03 , H01L24/05 , H01L24/80 , H01L25/0657 , H01L25/50 , H01L2224/03 , H01L2224/05572 , H01L2224/80895 , H01L2224/9202 , H01L2225/06513 , H01L2225/06541 , H01L2924/0002 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2924/30105 , H01L2924/351 , H01L2224/05552 , H01L2924/00
摘要: A basic building block for wafer scale stacked integrated circuits is disclosed. The building block includes an integrated circuit device having an integrated circuit substrate having a circuit layer sandwiched between a buffer layer and a dielectric layer. The dielectric layer has a top side and a bottom side, the bottom side being in contact with the circuit layer. The top surface of the dielectric layer includes a plurality of pads. Each pad extends above the top surface by a predetermined distance. The pads have dimensions that reduce irregularities in the top surface of the pads. In addition, the pads are arranged in a manner to promote planarization of the surface of the wafer via CMP.
摘要翻译: 公开了一种用于晶片级堆叠集成电路的基本构建块。 构成块包括具有集成电路基板的集成电路装置,该集成电路基板具有夹在缓冲层和电介质层之间的电路层。 电介质层具有顶侧和底侧,底侧与电路层接触。 电介质层的顶表面包括多个焊盘。 每个垫片在顶部表面上延伸预定距离。 垫具有减小垫顶表面不规则性的尺寸。 此外,焊盘以通过CMP促进晶片表面的平坦化的方式布置。
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2.
公开(公告)号:US08183127B2
公开(公告)日:2012-05-22
申请号:US12786273
申请日:2010-05-24
申请人: Robert Patti , Sangki Hong , Ramasamy Chockalingam
发明人: Robert Patti , Sangki Hong , Ramasamy Chockalingam
IPC分类号: H01L21/30
CPC分类号: H01L23/585 , H01L21/76898 , H01L23/481 , H01L24/03 , H01L24/05 , H01L24/80 , H01L25/0657 , H01L25/50 , H01L2224/03 , H01L2224/05572 , H01L2224/80895 , H01L2224/9202 , H01L2225/06513 , H01L2225/06541 , H01L2924/0002 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2924/30105 , H01L2924/351 , H01L2224/05552 , H01L2924/00
摘要: A basic building block for wafer scale stacked integrated circuits is disclosed. The building block includes an integrated circuit device having an integrated circuit substrate having a circuit layer sandwiched between a buffer layer and a dielectric layer. The dielectric layer has a top side and a bottom side, the bottom side being in contact with the circuit layer. The top surface of the dielectric layer includes a plurality of pads. Each pad extends above the top surface by a predetermined distance. The pads have dimensions that reduce irregularities in the top surface of the pads. In addition, the pads are arranged in a manner to promote planarization of the surface of the wafer via CMP.
摘要翻译: 公开了一种用于晶片级堆叠集成电路的基本构建块。 构成块包括具有集成电路基板的集成电路装置,该集成电路基板具有夹在缓冲层和电介质层之间的电路层。 电介质层具有顶侧和底侧,底侧与电路层接触。 电介质层的顶表面包括多个焊盘。 每个垫片在顶部表面上延伸预定距离。 垫具有减小垫顶表面不规则性的尺寸。 此外,焊盘以通过CMP促进晶片表面的平坦化的方式布置。
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3.
公开(公告)号:US20100233850A1
公开(公告)日:2010-09-16
申请号:US12786273
申请日:2010-05-24
申请人: Robert Patti , Sangki Hong , Ramasamy Chockalingam
发明人: Robert Patti , Sangki Hong , Ramasamy Chockalingam
IPC分类号: H01L21/50
CPC分类号: H01L23/585 , H01L21/76898 , H01L23/481 , H01L24/03 , H01L24/05 , H01L24/80 , H01L25/0657 , H01L25/50 , H01L2224/03 , H01L2224/05572 , H01L2224/80895 , H01L2224/9202 , H01L2225/06513 , H01L2225/06541 , H01L2924/0002 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2924/30105 , H01L2924/351 , H01L2224/05552 , H01L2924/00
摘要: A basic building block for wafer scale stacked integrated circuits is disclosed. The building block includes an integrated circuit device having an integrated circuit substrate having a circuit layer sandwiched between a buffer layer and a dielectric layer. The dielectric layer has a top side and a bottom side, the bottom side being in contact with the circuit layer. The top surface of the dielectric layer includes a plurality of pads. Each pad extends above the top surface by a predetermined distance. The pads have dimensions that reduce irregularities in the top surface of the pads. In addition, the pads are arranged in a manner to promote planarization of the surface of the wafer via CMP.
摘要翻译: 公开了一种用于晶片级堆叠集成电路的基本构建块。 构成块包括具有集成电路基板的集成电路装置,该集成电路基板具有夹在缓冲层和电介质层之间的电路层。 电介质层具有顶侧和底侧,底侧与电路层接触。 电介质层的顶表面包括多个焊盘。 每个垫片在顶部表面上延伸预定距离。 垫具有减小垫顶表面不规则性的尺寸。 此外,焊盘以通过CMP促进晶片表面的平坦化的方式布置。
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4.
公开(公告)号:US07750488B2
公开(公告)日:2010-07-06
申请号:US11484544
申请日:2006-07-10
申请人: Robert Patti , Sangki Hong , Ramasamy Chockalingam
发明人: Robert Patti , Sangki Hong , Ramasamy Chockalingam
IPC分类号: H01L21/00
CPC分类号: H01L23/585 , H01L21/76898 , H01L23/481 , H01L24/03 , H01L24/05 , H01L24/80 , H01L25/0657 , H01L25/50 , H01L2224/03 , H01L2224/05572 , H01L2224/80895 , H01L2224/9202 , H01L2225/06513 , H01L2225/06541 , H01L2924/0002 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2924/30105 , H01L2924/351 , H01L2224/05552 , H01L2924/00
摘要: A basic building block for wafer scale stacked integrated circuits is disclosed. The building block includes an integrated circuit device having an integrated circuit substrate having a circuit layer sandwiched between a buffer layer and a dielectric layer. The dielectric layer has a top side and a bottom side, the bottom side being in contact with the circuit layer. The top surface of the dielectric layer includes a plurality of pads. Each pad extends above the top surface by a predetermined distance. The pads have dimensions that reduce irregularities in the top surface of the pads. In addition, the pads are arranged in a manner to promote planarization of the surface of the wafer via CMP.
摘要翻译: 公开了一种用于晶片级堆叠集成电路的基本构建块。 构成块包括具有集成电路基板的集成电路装置,该集成电路基板具有夹在缓冲层和电介质层之间的电路层。 电介质层具有顶侧和底侧,底侧与电路层接触。 电介质层的顶表面包括多个焊盘。 每个垫片在顶部表面上延伸预定距离。 垫具有减小垫顶表面不规则性的尺寸。 此外,焊盘以通过CMP促进晶片表面的平坦化的方式布置。
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公开(公告)号:US07898095B2
公开(公告)日:2011-03-01
申请号:US11385941
申请日:2006-03-20
申请人: Robert Patti , Sangki Hong , Chockalingam Ramasamy
发明人: Robert Patti , Sangki Hong , Chockalingam Ramasamy
IPC分类号: H01L23/544
CPC分类号: H01L23/544 , H01L21/76898 , H01L23/481 , H01L24/80 , H01L25/0657 , H01L25/50 , H01L2223/54426 , H01L2223/54453 , H01L2223/5446 , H01L2224/0401 , H01L2224/05572 , H01L2224/08145 , H01L2224/80895 , H01L2224/81121 , H01L2224/81203 , H01L2224/81801 , H01L2225/06513 , H01L2225/06541 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/12 , H01L2224/05552
摘要: A method for stacking integrated circuit substrates and the substrates used therein are disclosed. In the method, an integrated circuit substrate having top and bottom surfaces is provided. The substrate is divided vertically into a plurality of layers including an integrated circuit layer having integrated circuit elements constructed therein and a buffer layer adjacent to the bottom surface. An alignment fiducial mark extending from the top surface of the wafer into the substrate to a depth below that of the circuit layer is constructed. The vias are arranged in a pattern that provides a fiducial mark when viewed from the bottom surface of the substrate. The pattern can be chosen such that it is recognized by a commercial stepper/scanner/contact mask aligner when viewed from said backside of said wafer. After the substrate is thinned, the alignment fiducial mark is then used to position a mask used in subsequent processing.
摘要翻译: 公开了集成电路基板和其中使用的基板的堆叠方法。 在该方法中,提供具有顶表面和底表面的集成电路基板。 衬底被垂直分割成多个层,包括其中构成有集成电路元件的集成电路层和与底表面相邻的缓冲层。 构建从晶片的顶表面延伸到衬底到比电路层的深度更深的对准基准。 通孔布置成当从基板的底表面观察时提供基准标记的图案。 可以选择图案,使得当从所述晶片的所述背面观察时,商业步进/扫描器/接触掩模对准器被识别。 在基板变薄之后,然后使用对准基准标记来定位在后续处理中使用的掩模。
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公开(公告)号:US20110117701A1
公开(公告)日:2011-05-19
申请号:US13004642
申请日:2011-01-11
申请人: Robert Patti , Sangki Hong , Chockalingam Ramasamy
发明人: Robert Patti , Sangki Hong , Chockalingam Ramasamy
IPC分类号: H01L21/50
CPC分类号: H01L23/544 , H01L21/76898 , H01L23/481 , H01L24/80 , H01L25/0657 , H01L25/50 , H01L2223/54426 , H01L2223/54453 , H01L2223/5446 , H01L2224/0401 , H01L2224/05572 , H01L2224/08145 , H01L2224/80895 , H01L2224/81121 , H01L2224/81203 , H01L2224/81801 , H01L2225/06513 , H01L2225/06541 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/12 , H01L2224/05552
摘要: A method for stacking integrated circuit substrates and the substrates used therein are disclosed. In the method, an integrated circuit substrate having top and bottom surfaces is provided. The substrate is divided vertically into a plurality of layers including an integrated circuit layer having integrated circuit elements constructed therein and a buffer layer adjacent to the bottom surface. An alignment fiducial mark extending from the top surface of the wafer into the substrate to a depth below that of the circuit layer is constructed. The vias are arranged in a pattern that provides a fiducial mark when viewed from the bottom surface of the substrate. The pattern can be chosen such that it is recognized by a commercial steeper/scanner/contact mask aligner when viewed from said backside of said wafer. After the substrate is thinned, the alignment fiducial mark is then used to position a mask used in subsequent processing.
摘要翻译: 公开了集成电路基板和其中使用的基板的堆叠方法。 在该方法中,提供具有顶表面和底表面的集成电路基板。 衬底被垂直分割成多个层,包括其中构成集成电路元件的集成电路层和与底表面相邻的缓冲层。 构建从晶片的顶表面延伸到衬底到比电路层的深度更深的对准基准。 通孔布置成当从基板的底表面观察时提供基准标记的图案。 可以选择图案,使得当从所述晶片的所述背面观察时,其被商业陡峭/扫描仪/接触掩模对准器识别。 在基板变薄之后,然后使用对准基准标记来定位在后续处理中使用的掩模。
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公开(公告)号:US08222121B2
公开(公告)日:2012-07-17
申请号:US13004642
申请日:2011-01-11
申请人: Robert Patti , Sangki Hong , Chockalingam Ramasamy
发明人: Robert Patti , Sangki Hong , Chockalingam Ramasamy
IPC分类号: H01L21/00
CPC分类号: H01L23/544 , H01L21/76898 , H01L23/481 , H01L24/80 , H01L25/0657 , H01L25/50 , H01L2223/54426 , H01L2223/54453 , H01L2223/5446 , H01L2224/0401 , H01L2224/05572 , H01L2224/08145 , H01L2224/80895 , H01L2224/81121 , H01L2224/81203 , H01L2224/81801 , H01L2225/06513 , H01L2225/06541 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/12 , H01L2224/05552
摘要: A method for stacking integrated circuit substrates and the substrates used therein are disclosed. In the method, an integrated circuit substrate having top and bottom surfaces is provided. The substrate is divided vertically into a plurality of layers including an integrated circuit layer having integrated circuit elements constructed therein and a buffer layer adjacent to the bottom surface. An alignment fiducial mark extending from the top surface of the wafer into the substrate to a depth below that of the circuit layer is constructed. The vias are arranged in a pattern that provides a fiducial mark when viewed from the bottom surface of the substrate. The pattern can be chosen such that it is recognized by a commercial stepper/scanner/contact mask aligner when viewed from said backside of said wafer. After the substrate is thinned, the alignment fiducial mark is then used to position a mask used in subsequent processing.
摘要翻译: 公开了集成电路基板和其中使用的基板的堆叠方法。 在该方法中,提供具有顶表面和底表面的集成电路基板。 衬底被垂直分割成多个层,包括其中构成集成电路元件的集成电路层和与底表面相邻的缓冲层。 构建从晶片的顶表面延伸到衬底到比电路层的深度更深的对准基准。 通孔布置成当从基板的底表面观察时提供基准标记的图案。 可以选择图案,使得当从所述晶片的所述背面观察时,商业步进/扫描器/接触掩模对准器被识别。 在基板变薄之后,然后使用对准基准标记来定位在后续处理中使用的掩模。
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公开(公告)号:US20070216041A1
公开(公告)日:2007-09-20
申请号:US11385941
申请日:2006-03-20
申请人: Robert Patti , Sangki Hong , Chockalingam Ramasamy
发明人: Robert Patti , Sangki Hong , Chockalingam Ramasamy
IPC分类号: H01L23/544
CPC分类号: H01L23/544 , H01L21/76898 , H01L23/481 , H01L24/80 , H01L25/0657 , H01L25/50 , H01L2223/54426 , H01L2223/54453 , H01L2223/5446 , H01L2224/0401 , H01L2224/05572 , H01L2224/08145 , H01L2224/80895 , H01L2224/81121 , H01L2224/81203 , H01L2224/81801 , H01L2225/06513 , H01L2225/06541 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/12 , H01L2224/05552
摘要: A method for stacking integrated circuit substrates and the substrates used therein are disclosed. In the method, an integrated circuit substrate having top and bottom surfaces is provided. The substrate is divided vertically into a plurality of layers including an integrated circuit layer having integrated circuit elements constructed therein and a buffer layer adjacent to the bottom surface. An alignment fiducial mark extending from the top surface of the wafer into the substrate to a depth below that of the circuit layer is constructed. The vias are arranged in a pattern that provides a fiducial mark when viewed from the bottom surface of the substrate. The pattern can be chosen such that it is recognized by a commercial steeper/scanner/contact mask aligner when viewed from said backside of said wafer. After the substrate is thinned, the alignment fiducial mark is then used to position a mask used in subsequent processing.
摘要翻译: 公开了集成电路基板和其中使用的基板的堆叠方法。 在该方法中,提供具有顶表面和底表面的集成电路基板。 衬底被垂直分割成多个层,包括其中构成有集成电路元件的集成电路层和与底表面相邻的缓冲层。 构建从晶片的顶表面延伸到衬底到比电路层的深度更深的对准基准。 通孔布置成当从基板的底表面观察时提供基准标记的图案。 可以选择图案,使得当从所述晶片的所述背面观察时,其被商业陡峭/扫描仪/接触掩模对准器识别。 在基板变薄之后,然后使用对准基准标记来定位在后续处理中使用的掩模。
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公开(公告)号:US06400612B1
公开(公告)日:2002-06-04
申请号:US09802715
申请日:2001-03-08
申请人: Robert Patti
发明人: Robert Patti
IPC分类号: G11C700
CPC分类号: G11C11/405
摘要: A memory organized as a two-dimensional array of data storage cells having a plurality of rows and columns. Each data storage cell has first, second, third, and fourth terminals, each data storage cell sinking a current between the first and second terminals indicative of a charge stored therein when the third terminal is at a first potential. The memory has a plurality of bit lines, one corresponding to each column. The first terminal of each data storage cell in each column is connected to the bit line corresponding to that column when the third terminal is at the first potential and each data storage cell is disconnected from that bit line when the third terminal is at a second potential. The memory also includes a plurality of column select lines and row select lines. There is one column select line corresponding to each column and one additional column select line adjacent to either the first or last column. The fourth terminal of each data storage cell in each column is connected to the column select line corresponding to that column. Similarly, there are row select lines, one corresponding to each row, the third terminal of each data storage cell in each row being connected to the row select line corresponding to that row. The second terminal of each data storage cell in each column is connected to the column select line of an adjacent column. The charge stored by each data storage cell is determined by the potential difference between the first and second terminals of that data storage cell when the third and fourth terminals of that data storage cell are held at a first potential.
摘要翻译: 存储器,其被组织为具有多个行和列的数据存储单元的二维阵列。 每个数据存储单元具有第一,第二,第三和第四端子,当第三端子处于第一电位时,每个数据存储单元吸收指示存储在其中的电荷的第一和第二端子之间的电流。 存储器具有多个位线,一个对应于每列。 当第三终端处于第一电位时,每列中的每个数据存储单元的第一端子连接到与该列相对应的位线,并且当第三端子处于第二电位时,每个数据存储单元与该位线断开连接 。 存储器还包括多个列选择线和行选择线。 对应于每列和一列与第一列或最后一列相邻的附加列选择行,有一列列选择行。 每列中每个数据存储单元的第四个终端连接到与该列对应的列选择行。 类似地,存在行选择线,一行对应于每行,每行中每个数据存储单元的第三端连接到与该行对应的行选择行。 每列中每个数据存储单元的第二个终端连接到相邻列的列选择行。 当数据存储单元的第三和第四端子保持在第一电位时,由每个数据存储单元存储的电荷由该数据存储单元的第一和第二端子之间的电位差决定。
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公开(公告)号:US06300660B1
公开(公告)日:2001-10-09
申请号:US09476624
申请日:1999-12-31
申请人: Robert Patti
发明人: Robert Patti
IPC分类号: H01L2976
CPC分类号: H01L29/72 , H01L27/0738
摘要: A variable conductance device having a first source region and a first drain region in a semiconductor substrate. A first channel region connects the first source and the first drain regions. A first resistive layer overlies the first channel region and has first and second electrical contacts spaced apart from one another thereon. The conductance of the path between the first source region and the first drain region depends on the current flowing between the first and second electrical contacts. By adding a FET having its gate and source shorted together to the variable conductance device, a device having the current gain characteristics of a bipolar transistor is obtained. The first drain region is connected to the drain of the FET and the source of the FET is connected to the second electrical contact. The precise form of the current transfer function can be altered by connecting a number of variable conductance devices according to the present invention in parallel.
摘要翻译: 一种在半导体衬底中具有第一源极区域和第一漏极区域的可变电导器件。 第一沟道区域连接第一源极和第一漏极区域。 第一电阻层覆盖在第一沟道区上并具有彼此间隔开的第一和第二电接触。 第一源极区域和第一漏极区域之间的路径的电导取决于在第一和第二电触头之间流动的电流。 通过将其栅极和源极短路的FET添加到可变电导器件,获得具有双极晶体管的电流增益特性的器件。 第一漏区连接到FET的漏极,FET的源极连接到第二电触点。 可以通过并联连接本发明的多个可变电导装置来改变电流传递函数的精确形式。
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