摘要:
A method for stacking integrated circuit substrates and the substrates used therein are disclosed. In the method, an integrated circuit substrate having top and bottom surfaces is provided. The substrate is divided vertically into a plurality of layers including an integrated circuit layer having integrated circuit elements constructed therein and a buffer layer adjacent to the bottom surface. An alignment fiducial mark extending from the top surface of the wafer into the substrate to a depth below that of the circuit layer is constructed. The vias are arranged in a pattern that provides a fiducial mark when viewed from the bottom surface of the substrate. The pattern can be chosen such that it is recognized by a commercial stepper/scanner/contact mask aligner when viewed from said backside of said wafer. After the substrate is thinned, the alignment fiducial mark is then used to position a mask used in subsequent processing.
摘要:
A method for stacking integrated circuit substrates and the substrates used therein are disclosed. In the method, an integrated circuit substrate having top and bottom surfaces is provided. The substrate is divided vertically into a plurality of layers including an integrated circuit layer having integrated circuit elements constructed therein and a buffer layer adjacent to the bottom surface. An alignment fiducial mark extending from the top surface of the wafer into the substrate to a depth below that of the circuit layer is constructed. The vias are arranged in a pattern that provides a fiducial mark when viewed from the bottom surface of the substrate. The pattern can be chosen such that it is recognized by a commercial steeper/scanner/contact mask aligner when viewed from said backside of said wafer. After the substrate is thinned, the alignment fiducial mark is then used to position a mask used in subsequent processing.
摘要:
A memory organized as a two-dimensional array of data storage cells having a plurality of rows and columns. Each data storage cell has first, second, third, and fourth terminals, each data storage cell sinking a current between the first and second terminals indicative of a charge stored therein when the third terminal is at a first potential. The memory has a plurality of bit lines, one corresponding to each column. The first terminal of each data storage cell in each column is connected to the bit line corresponding to that column when the third terminal is at the first potential and each data storage cell is disconnected from that bit line when the third terminal is at a second potential. The memory also includes a plurality of column select lines and row select lines. There is one column select line corresponding to each column and one additional column select line adjacent to either the first or last column. The fourth terminal of each data storage cell in each column is connected to the column select line corresponding to that column. Similarly, there are row select lines, one corresponding to each row, the third terminal of each data storage cell in each row being connected to the row select line corresponding to that row. The second terminal of each data storage cell in each column is connected to the column select line of an adjacent column. The charge stored by each data storage cell is determined by the potential difference between the first and second terminals of that data storage cell when the third and fourth terminals of that data storage cell are held at a first potential.
摘要:
A variable conductance device having a first source region and a first drain region in a semiconductor substrate. A first channel region connects the first source and the first drain regions. A first resistive layer overlies the first channel region and has first and second electrical contacts spaced apart from one another thereon. The conductance of the path between the first source region and the first drain region depends on the current flowing between the first and second electrical contacts. By adding a FET having its gate and source shorted together to the variable conductance device, a device having the current gain characteristics of a bipolar transistor is obtained. The first drain region is connected to the drain of the FET and the source of the FET is connected to the second electrical contact. The precise form of the current transfer function can be altered by connecting a number of variable conductance devices according to the present invention in parallel.
摘要:
A basic building block for wafer scale stacked integrated circuits is disclosed. The building block includes an integrated circuit device having an integrated circuit substrate having a circuit layer sandwiched between a buffer layer and a dielectric layer. The dielectric layer has a top side and a bottom side, the bottom side being in contact with the circuit layer. The top surface of the dielectric layer includes a plurality of pads. Each pad extends above the top surface by a predetermined distance. The pads have dimensions that reduce irregularities in the top surface of the pads. In addition, the pads are arranged in a manner to promote planarization of the surface of the wafer via CMP.
摘要:
A circuit having an interconnect network and plurality of processing blocks is disclosed. The interconnect network has a plurality of network nodes arranged in a two-dimensional array on a first substrate. Each network node has a plurality of communication ports and is connected to each adjacent network node by a communication bus that connects only those two network nodes and processing blocks adjacent to that communication bus. A programmable switch within each node connects one of the input ports to one of the output ports in response to connection information stored in a memory in that node. Three-dimensional embodiments can be constructed by including a second substrate that overlies the first substrate and includes a second such interconnect network that is connected vertically through one or more nodes. The circuit easily accommodates spare processing blocks that can be substituted for defective blocks by altering the connection information.
摘要:
An integrated circuit wafer element and an improved method for bonding the same to produce a stacked integrated circuit. Plugs that extend from one surface of the wafer into the wafer are used to provide vertical connections and to bond the wafers together. A stacked integrated circuit is constructed by bonding the front side of a new wafer to a wafer in the stack and then thinning the backside of the new wafer to a thickness that leaves a portion of the plugs extending above the surface of the backside of the thinned wafer. The elevated plug ends can then be used to bond another wafer by bonding to pads on the front side of that wafer. The mating bonding pads can include depressed regions that mate to the elevated plug ends.
摘要:
An integrated circuit wafer element and an improved method for bonding the same to produce a stacked integrated circuit. Plugs that extend from one surface of the wafer into the wafer are used to provide vertical connections and to bond the wafers together. A stacked integrated circuit is constructed by bonding the front side of a new wafer to a wafer in the stack and then thinning the backside of the new wafer to a thickness that leaves a portion of the plugs extending above the surface of the backside of the thinned wafer. The elevated plug ends can then be used to bond another wafer by bonding to pads on the front side of that wafer. The mating bonding pads can include depressed regions that mate to the elevated plug ends.
摘要:
A non-volatile memory based on a unique EEPROM memory. The non-volatile memory includes a plurality of data memory cells, a data programming circuit, and a first data line. Each data memory cell includes an EEPROM cell having a separate programming electrode and first and second isolation transistors. The programming electrode is coupled to the floating gate by a tunneling window. The first isolation transistor connects the EEPROM cell to the first data line. The second isolation transistor connects the programming electrode to the data programming circuit in response to a write enable signal. The data programming circuit programs a selected data memory cell by receiving a data value to be stored in that data memory cell and generating and coupling a programming signal to the second isolation transistors, the programming signal having a duration that is determined by the received data value. The memory also includes a plurality of first reference memory cells, a first reference programming circuit, and a first reference line, each first reference memory cell is structurally the same as the data memory cells. There is one first reference memory cell corresponding to each data memory cell, and that first reference cell is programmed with a predetermined value each time the corresponding data memory cell is programmed. A data memory cell is read by comparing the conductance of the first data line to the first reference line. The data reading circuit generates an output value that depends on the compared conductances. In embodiments of the invention using multiple reference cells, the various reference cells are programmed with different fixed values each time the corresponding data memory cell is programmed. The values in these reference cells are interpolated during the reading operation to determine the data value stored in the corresponding data memory cell.
摘要:
A method for stacking integrated circuit substrates and the substrates used therein are disclosed. In the method, an integrated circuit substrate having top and bottom surfaces is provided. The substrate is divided vertically into a plurality of layers including an integrated circuit layer having integrated circuit elements constructed therein and a buffer layer adjacent to the bottom surface. An alignment fiducial mark extending from the top surface of the wafer into the substrate to a depth below that of the circuit layer is constructed. The vias are arranged in a pattern that provides a fiducial mark when viewed from the bottom surface of the substrate. The pattern can be chosen such that it is recognized by a commercial stepper/scanner/contact mask aligner when viewed from said backside of said wafer. After the substrate is thinned, the alignment fiducial mark is then used to position a mask used in subsequent processing.