-
公开(公告)号：US5511985A
公开(公告)日：1996-04-30
申请号：US260881
申请日：1994-06-16
IPC分类号： H01R13/633 , H01R12/70 , H01R12/71 , H01R13/62
CPC分类号： H01R12/7005 , H01R12/716
摘要： A card edge connector comprising a housing, electrical contacts, and ejectors. The housing has a middle section with a card edge receiving area, two guide projections at opposite ends of the middle section, and a keeper section. The electrical contacts extend from the middle section, through the keeper, to a bottom of the housing. The housing is suitably configured to receive a daughter printed circuit board at an angle of about 30.degree. relative to a mother printed circuit board. The ejectors are adapted to lock the daughter board to the connector and, eject the daughter board from the connector.
摘要翻译： 一种卡边缘连接器，包括壳体，电触点和喷射器。 壳体具有中间部分，其具有卡片边缘接收区域，在中间部分的相对端处具有两个引导突出部和保持部分。 电触点从中间部分通过保持器延伸到壳体的底部。 壳体适当地构造成相对于母版印刷电路板以大约30度的角度接收子印刷电路板。 喷射器适于将子板锁定到连接器上，并将子板从连接器中弹出。
-
公开(公告)号：US5035631A
公开(公告)日：1991-07-30
申请号：US532300
申请日：1990-06-01
IPC分类号： H01R13/648 , H01R3/00 , H01R12/50 , H01R12/72 , H01R13/658 , H01R43/00
CPC分类号： H01R12/721 , H01R13/65802 , H01R23/688
摘要： A card edge connector of the type used to connect a daughter printed circuit board with a mother printed circuit board. The connector has a housing, a plurality of signal contacts, and an electromagnetic grounding shield to prevent electromagnetic impulses from generating or degrading signals in the signal contacts.
-
公开(公告)号：US5184961A
公开(公告)日：1993-02-09
申请号：US718130
申请日：1991-06-20
IPC分类号： H01R12/50 , H01R12/72 , H01R12/79 , H01R13/432 , H01R13/518 , H01R13/73 , H01R13/74
CPC分类号： H01R13/74 , H01R13/518 , H01R23/70 , H01R12/721 , H01R12/79 , H01R13/432 , H01R13/73
摘要： A combined electrical connector and connector nesting assembly has a frame with a first section adapted to receive an edge of a printed circuit board and a second section adapted to receive a connector of a cable assembly. The first section has a card edge receiving slot and spring contacts can be inserted thereinto. The second section is located parallel to, but offset from the first section such that when a printed circuit board is inserted into the assembly, a connector located in the second section can receive contact pins projecting from the printed circuit board. The assembly frame can be snap-locked into an electronic component chassis and the connector can be snap-locked into the second section of the frame.
摘要翻译： 组合的电连接器和连接器嵌套组件具有框架，其具有适于接收印刷电路板的边缘的第一部分和适于接收电缆组件的连接器的第二部分。 第一部分具有卡边缘接收槽，弹簧触点可插入其中。 第二部分平行于第一部分偏移，使得当印刷电路板插入组件中时，位于第二部分中的连接器可以接收从印刷电路板突出的接触针。 组装框架可以卡扣锁定到电子部件底盘中，并且连接器可以卡扣锁定到框架的第二部分中。
-
公开(公告)号：US06610253B2
公开(公告)日：2003-08-26
申请号：US09777784
申请日：2001-02-05
IPC分类号： B01L302
CPC分类号： B01L3/0244 , B01J19/0046 , B01J2219/00387 , B01J2219/00527 , B01J2219/00585 , B01J2219/00596 , B01J2219/00605 , B01J2219/00621 , B01J2219/00659 , C40B60/14 , G01N35/1074 , G01N2035/1037 , Y10T436/2575
摘要： Several pin transfer assemblies are disclosed that utilize the surface tension of liquids for picking up and dispensing minute volumes of liquid from wells in a first well plate to a flat substrate surface or into wells in a second well plate. In one embodiment, a plurality of pins reciprocate through complementary arrays of holes in a base plate and an overlying spring plate biased apart by coil springs located around the periphery of the base plate. A foam layer sits on top of the spring plate and a weight plate sits on top of the foam layer. A single coil spring is positioned between a center of the weight plate and the cover to push the weight plate downwardly. The periphery of the cover guides the vertical movement of the weight plate and is connected to the periphery of the base plate. The periphery of the base plate is supported by a frame used to register the pin assembly in a receptacle of a manual or automated liquid transfer apparatus.
摘要翻译： 公开了几种销传送组件，其利用液体的表面张力来从第一孔板中的井到平坦衬底表面或第二孔板中的孔中拾取和分配微小体积的液体。 在一个实施例中，多个销通过基板中的孔的互补阵列往复运动，以及由位于基板周边的螺旋弹簧偏置的上覆弹簧板。 泡沫层位于弹簧板的顶部，重量板位于泡沫层的顶部。 单个螺旋弹簧位于配重板的中心和盖之间，以向下推动配重板。 盖的周边引导重物板的垂直运动并连接到基板的周边。 基板的周边由用于将销组件对准在手动或自动液体输送装置的容器中的框架支撑。
-
公开(公告)号：US06579499B1
公开(公告)日：2003-06-17
申请号：US09584616
申请日：2000-05-31
IPC分类号： B01L302
CPC分类号： B01L3/0244 , B01J19/0046 , B01J2219/00387 , B01J2219/00527 , B01J2219/00585 , B01J2219/00596 , B01J2219/00605 , B01J2219/00659 , C40B60/14 , G01N35/1074 , G01N2035/1037 , Y10T436/2575
摘要： A pin replicator is disclosed for dispensing minute volumes of liquid onto a substrate surface in an array in connection with drug discovery, diagnostic analysis, and other applications. The pin replicator comprises a base plate, a plurality of pins reciprocable through corresponding holes in the base plate, and a free floating weight plate resting on top of the upper ends of the pins. The weight plate biases the pins toward their fully extended lowered positions. A cover attaches to the base plate, encloses the pins and weight plate and guides the weight plate during vertical movement thereof. The pin replicator can be moved downwardly toward a first micro titer plate so that a lower end of each of the pins contacts the sample liquid in the corresponding well a sufficient amount to pick up and retain a small quantity of the sample liquid due to surface tension. The pin replicator can thereafter be moved downwardly toward a second micro titer plate so that the lower end of each of the pins is sufficiently close to a corresponding well of the second micro titer plate so that the small quantity of the sample liquid on the lower end of each of the pins contacts an upper surface of the corresponding well of the second micro titer plate.
摘要翻译： 公开了一种销复制器，其用于将药物发现，诊断分析和其它应用与微量体积的液体分配到阵列中的基底表面上。 销复制器包括基板，可通过基板中的相应孔往复运动的多个销，以及搁置在销的上端顶部的自由浮动重物板。 重量板将销朝向完全伸出的下降位置偏压。 盖子连接到基板上，包围销和配重板，并在其垂直运动期间引导重物板。 销复制器可以向下移动朝向第一微型滴定板，使得每个销的下端与对应的井中的样品液体接触足够的量以吸收并保持少量的样品液体，由于表面张力 。 然后，针式复制器可以向下移动到第二微型滴定板，使得每个销的下端足够靠近第二微量滴定板的对应孔，使得少量的下端的样品液体 的每个销接触第二微量滴定板的相应孔的上表面。
-
公开(公告)号：US5800186A
公开(公告)日：1998-09-01
申请号：US816091
申请日：1997-03-13
IPC分类号： H01R9/09
CPC分类号： H01R12/721 , H01R12/7005
摘要： A printed circuit board assembly which comprises a plurality of primary printed circuit boards, a plurality of card edge connectors, at least one secondary printed circuit board and means for predictable separation of the boards from each other. Each of the card edge connectors is fixedly mounted to a respective primary printed circuit board. The secondary printed circuit board is directly removably connected between two card edge connectors. The secondary printed circuit board has an aperture at an edge which is inserted into a card edge connector. The aperture is contacted by a spring element in the card edge connector providing the means for predictable separation of the boards from each other.
摘要翻译： 一种印刷电路板组件，其包括多个主印刷电路板，多个卡缘连接器，至少一个次级印刷电路板和用于彼此可预测地分离电路板的装置。 每个卡缘连接器固定地安装到相应的主印刷电路板上。 二次印刷电路板可直接可拆卸地连接在两个卡缘连接器之间。 二次印刷电路板在边缘具有插入卡缘连接器的孔。 光圈通过卡边缘连接器中的弹簧元件接触，提供用于彼此可预测地分离电路板的装置。
-
7.发明授权Hybrid solder ball and pin grid array circuit board interconnect system and method 失效混合焊球和针阵阵列电路板互连系统及方法公开(公告)号：US06272741B1
公开(公告)日：2001-08-14
申请号：US09122225
申请日：1998-07-24
IPC分类号： H05K336
CPC分类号： H01R12/523 , H01L2224/16225 , H01L2924/00014 , H01L2924/15312 , H01R4/02 , H05K3/3426 , H05K3/3436 , H05K7/1092 , H05K2201/10318 , H05K2201/10704 , H05K2203/041 , Y02P70/613 , Y10T29/49126 , Y10T29/49149 , H01L2224/0401
摘要： A circuit board interconnect system includes a carrier board with a hybrid solder ball and pin grid array. A plurality of electrically conductive pins extend through the carrier board and are arranged in rows and columns to form a grid array. A first circuit board such as a multi-chip module (MCM) board has a plurality of conductive pads or traces formed on a lower surface thereof that are arranged to form a complementary grid array, i.e. the spacing and location of the conductive pads or traces corresponds to the spacing and location of the pins. A plurality of solder balls are provided with each ball being positioned on top of a corresponding pin so that each solder ball forms a solder connection between a pin and a corresponding conductive pad or trace. A second circuit board such as a computer mother board has a pin connector mounted on an upper surface thereof for individually receiving and providing electrical connection with each of the pins. After reflow, the solder balls wrap around the side walls of the heads of the pins and the side walls of the pads. The resulting generally spherical solder connections are therefore much stronger than conventional elongated fillet connections.
摘要翻译： 电路板互连系统包括具有混合焊球和引脚格栅阵列的载板。 多个导电针延伸穿过载板并且以行和列布置以形成网格阵列。 诸如多芯片模块（MCM）板的第一电路板具有形成在其下表面上的多个导电焊盘或迹线，其布置成形成互补的栅格阵列，即导电焊盘或迹线的间隔和位置 对应于销的间距和位置。 设置多个焊球，每个球位于相应销的顶部，使得每个焊球在销和相应的导电焊盘或迹线之间形成焊接连接。 诸如计算机母板的第二电路板具有安装在其上表面上的引脚连接器，用于单独地接收并提供与每个引脚的电连接。 在回流之后，焊球围绕销的头部的侧壁和垫的侧壁。 因此，所得到的大体上球形的焊接连接比传统的细长圆角连接强得多。
-
-
-
-
-
-
搜索结果
7 条记录 (耗时 0.018 秒)
