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1.发明申请METHOD FOR ATTACHING A FLEXIBLE STRUCTURE TO A DEVICE AND A DEVICE HAVING A FLEXIBLE STRUCTURE 有权将柔性结构连接到装置的方法和具有柔性结构的装置公开(公告)号：US20120279763A1
公开(公告)日：2012-11-08
申请号：US13549489
申请日：2012-07-15
IPC分类号： H05K1/00
CPC分类号： H05K1/0393 , B81C3/008 , G02B6/43 , H01L27/14618 , H01L2924/0002 , H05K1/189 , H05K3/4691 , H05K2201/0108 , H05K2203/308 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49171 , H01L2924/00
摘要： Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first substrate and the flexible structure, adjoining the first and second substrate such that the flexible structure is attached at the first substrate by means of the bonding layer, and detaching the second substrate in such a way that the flexible structure remains on the first substrate.
摘要翻译： 用于生产连接到装置的柔性结构的技术。 一个实施例包括以下步骤：提供第一基板，为第二基板提供可释放地附接的柔性结构，在第一基板和柔性结构中的至少一个上提供接合层，邻接第一和第二基板，使得柔性结构 通过结合层附着在第一基板上，并且以使弹性结构保留在第一基板上的方式分离第二基板。
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公开(公告)号：US08286345B2
公开(公告)日：2012-10-16
申请号：US12416620
申请日：2009-04-01
CPC分类号： H05K1/0393 , B81C3/008 , G02B6/43 , H01L27/14618 , H01L2924/0002 , H05K1/189 , H05K3/4691 , H05K2201/0108 , H05K2203/308 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49171 , H01L2924/00
摘要： Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first substrate and the flexible structure, adjoining the first and second substrate such that the flexible structure is attached at the first substrate by means of the bonding layer, and detaching the second substrate in such a way that the flexible structure remains on the first substrate.
摘要翻译： 用于生产连接到装置的柔性结构的技术。 一个实施例包括以下步骤：提供第一基板，为第二基板提供可释放地附接的柔性结构，在第一基板和柔性结构中的至少一个上提供接合层，邻接第一和第二基板，使得柔性结构 通过结合层附着在第一基板上，并且以使弹性结构保留在第一基板上的方式分离第二基板。
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3.发明申请METHOD FOR ATTACHING A FLEXIBLE STRUCTURE TO A DEVICE AND A DEVICE HAVING A FLEXIBLE STRUCTURE 失效将柔性结构连接到装置的方法和具有柔性结构的装置公开(公告)号：US20090188108A1
公开(公告)日：2009-07-30
申请号：US12416620
申请日：2009-04-01
IPC分类号： H01R9/00
CPC分类号： H05K1/0393 , B81C3/008 , G02B6/43 , H01L27/14618 , H01L2924/0002 , H05K1/189 , H05K3/4691 , H05K2201/0108 , H05K2203/308 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49171 , H01L2924/00
摘要： Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first substrate and the flexible structure, adjoining the first and second substrate such that the flexible structure is attached at the first substrate by means of the bonding layer, and detaching the second substrate in such a way that the flexible structure remains on the first substrate.
摘要翻译： 用于生产连接到装置的柔性结构的技术。 一个实施例包括以下步骤：提供第一基板，为第二基板提供可释放地附接的柔性结构，在第一基板和柔性结构中的至少一个上提供接合层，邻接第一和第二基板，使得柔性结构 通过结合层附着在第一基板上，并且以使弹性结构保留在第一基板上的方式分离第二基板。
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4.发明授权公开(公告)号：US09055681B2
公开(公告)日：2015-06-09
申请号：US13549489
申请日：2012-07-15
CPC分类号： H05K1/0393 , B81C3/008 , G02B6/43 , H01L27/14618 , H01L2924/0002 , H05K1/189 , H05K3/4691 , H05K2201/0108 , H05K2203/308 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49171 , H01L2924/00
摘要： Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first substrate and the flexible structure, adjoining the first and second substrate such that the flexible structure is attached at the first substrate by means of the bonding layer, and detaching the second substrate in such a way that the flexible structure remains on the first substrate.
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5.发明授权Method for attaching a flexible structure to a device and a device having a flexible structure 失效将柔性结构附接到装置和具有柔性结构的装置的方法公开(公告)号：US07523547B2
公开(公告)日：2009-04-28
申请号：US11469336
申请日：2006-08-31
CPC分类号： H05K1/0393 , B81C3/008 , G02B6/43 , H01L27/14618 , H01L2924/0002 , H05K1/189 , H05K3/4691 , H05K2201/0108 , H05K2203/308 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49171 , H01L2924/00
摘要： Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first substrate and the flexible structure, adjoining the first and second substrate such that the flexible structure is attached at the first substrate by means of the bonding layer, and detaching the second substrate in such a way that the flexible structure remains on the first substrate.
摘要翻译： 用于生产连接到装置的柔性结构的技术。 一个实施例包括以下步骤：提供第一基板，为第二基板提供可释放地附接的柔性结构，在第一基板和柔性结构中的至少一个上提供接合层，邻接第一和第二基板，使得柔性结构 通过结合层附着在第一基板上，并且以使弹性结构保留在第一基板上的方式分离第二基板。
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公开(公告)号：US08444328B2
公开(公告)日：2013-05-21
申请号：US12876543
申请日：2010-09-07
IPC分类号： G02B6/36
CPC分类号： G02B6/42 , G02B6/13 , G02B6/3885 , G02B6/4214 , G02B6/43 , G02B2006/12166 , H05K1/0274 , H05K1/184 , H05K1/189 , H05K3/3405 , H05K13/00 , H05K2201/09081 , H05K2201/10121 , H05K2201/10674 , H05K2203/0195 , Y10T29/49002 , Y10T29/49037 , Y10T29/49124 , Y10T29/49826 , Y10T29/53
摘要： A flip-chip bonder fabricates an optical assembly by horizontally positioning a flexible portion of a substrate including a waveguide with the waveguide exposed at one end edge of the substrate; bending a portion of the flexible substrate to place the waveguide exposed end in approximately a vertical position; vertically positioning a bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide; and fixably mounting the optical component to the substrate edge.
摘要翻译： 倒装式连接器通过水平地定位包括波导的基板的柔性部分来制造光学组件，波导在基板的一个端部边缘处露出; 弯曲柔性基板的一部分以将波导暴露端放置在大致垂直的位置; 将包含光学部件的接合头垂直地定位在波导暴露的衬底边缘上以将光学部件与暴露的波导光学匹配; 并将光学部件可固定地安装到基板边缘。
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公开(公告)号：US20110138600A1
公开(公告)日：2011-06-16
申请号：US12876543
申请日：2010-09-07
CPC分类号： G02B6/42 , G02B6/13 , G02B6/3885 , G02B6/4214 , G02B6/43 , G02B2006/12166 , H05K1/0274 , H05K1/184 , H05K1/189 , H05K3/3405 , H05K13/00 , H05K2201/09081 , H05K2201/10121 , H05K2201/10674 , H05K2203/0195 , Y10T29/49002 , Y10T29/49037 , Y10T29/49124 , Y10T29/49826 , Y10T29/53
摘要： A flip-chip bonder fabricates an optical assembly by horizontally positioning a flexible portion of a substrate including a waveguide with the waveguide exposed at one end edge of the substrate; bending a portion of the flexible substrate to place the waveguide exposed end in approximately a vertical position; vertically positioning a bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide; and fixably mounting the optical component to the substrate edge.
摘要翻译： 倒装式连接器通过水平地定位包括波导的基板的柔性部分来制造光学组件，波导在基板的一个端部边缘处露出; 弯曲柔性基板的一部分以将波导暴露端放置在大致垂直的位置; 将包含光学部件的接合头垂直地定位在波导暴露的衬底边缘上以将光学部件与暴露的波导光学匹配; 并将光学部件可固定地安装到基板边缘。
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公开(公告)号：US07470069B1
公开(公告)日：2008-12-30
申请号：US12051886
申请日：2008-03-20
CPC分类号： G02B6/43 , H01L2224/16225 , H01L2924/15311 , H05K1/141 , H05K1/181 , H05K1/182 , H05K3/3436 , H05K2201/10121 , H05K2203/1572
摘要： A structure for electronics package for module packaging and a method of manufacturing a single chip module (SCM) or multi-chip module (MCM) for an opto-electronic package having an improved structure for heat dissipation and testing is disclosed. The optical transceivers are ideally located on a surface opposite to the electrical portion of the package. Variations on the module package include pluggable or socketed optical transceivers and card pacers that allow for the installation of multiple optical transceivers.
摘要翻译： 公开了一种用于模块封装的电子封装的结构以及用于具有改进的散热和测试结构的光电封装的单芯片模块（SCM）或多芯片模块（MCM）的制造方法。 光收发器理想地位于与封装的电气部分相对的表面上。 模块封装的变化包括可插拔或插座的光收发器和卡片夹，允许安装多个光收发器。
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公开(公告)号：US06483966B2
公开(公告)日：2002-11-19
申请号：US09727845
申请日：2000-12-01
IPC分类号： G02B626
CPC分类号： G02B6/12007 , G02B6/26 , G02B2006/12119 , G02B2006/12195
摘要： A singlemode lightwaveguide-coupling element is positioned between an initial waveguide section which there has a basic final width (W0f) and a final waveguide section which there has a basic initial width (Wn+1i) which is bigger than the basic final width (W0f). The lightwave directions of both waveguide sections are inclined at a predetermined total angle (&Dgr;&agr;) towards each other. Starting from the initial waveguide section, the lightwaveguide element comprises intermediate waveguide sections each of which at its end has a lightwave direction which is inclined towards the lightwave direction at its opposite end at an inclination angle (&Dgr;&agr;v), such that the sum of all inclination angles equals the predetermined total angle (&Dgr;&agr;).
摘要翻译： 单模光波导耦合元件位于具有基本最终宽度（W0f）的初始波导部分和具有大于基本最终宽度（W0 + 1i）的基本初始宽度（Wn + 1i）的最终波导部分之间 ）。 两个波导段的光波方向相对于彼此以预定的总角度（DELTAalpha）倾斜。 从初始波导部分开始，光波导元件包括中间波导部分，每个波导部分的端部具有在其相对端以倾斜角（DELTAalphav）朝向光波方向倾斜的光波方向，使得所有倾斜度的和 角度等于预定的总角度（DELTAalpha）。
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公开(公告)号：US20090284684A1
公开(公告)日：2009-11-19
申请号：US12119748
申请日：2008-05-13
IPC分类号： G02F1/13357 , G02B6/43
CPC分类号： G02B6/1221 , G02B6/0036 , G02F1/133615 , G02F1/133621
摘要： An optical coupling device for coupling light with an optical waveguide comprises a mirror formed within an optical waveguide. The mirror comprises a first material, a first reflective end, and a second reflective end. The first material is light conducting and has a first refractive index. The first and second reflective ends reflect and transmit light. The mirror has an axis line. The optical coupling device is useful for extracting light from a waveguide and providing a backlight for a liquid crystal display.
摘要翻译： 用于将光耦合到光波导的光耦合装置包括形成在光波导内的反射镜。 反射镜包括第一材料，第一反射端和第二反射端。 第一种材料是导光的并且具有第一折射率。 第一和第二反射端反射和透射光。 镜子有一条轴线。 光耦合器件可用于从波导管提取光并为液晶显示器提供背光源。
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