AlGaN/GaN hybrid MOS-HFET
    2.
    发明授权
    AlGaN/GaN hybrid MOS-HFET 有权
    AlGaN / GaN混合MOS-HFET

    公开(公告)号:US08653559B2

    公开(公告)日:2014-02-18

    申请号:US13171798

    申请日:2011-06-29

    IPC分类号: H01L29/66 H01L21/338

    摘要: A field effect transistor (FET) includes source and drain electrodes, a channel layer, a barrier layer over the channel layer, a passivation layer covering the barrier layer for passivating the barrier layer, a gate electrode extending through the barrier layer and the passivation layer, and a gate dielectric surrounding a portion of the gate electrode that extends through the barrier layer and the passivation layer, wherein the passivation layer is a first material and the gate dielectric is a second material, and the first material is different than the second material.

    摘要翻译: 场效应晶体管(FET)包括源极和漏极,沟道层,沟道层上的势垒层,覆盖阻挡层以钝化势垒层的钝化层,延伸穿过阻挡层的栅电极和钝化层 以及围绕所述栅电极的延伸穿过所述阻挡层和所述钝化层的部分的栅极电介质,其中所述钝化层是第一材料,并且所述栅极电介质是第二材料,并且所述第一材料不同于所述第二材料 。

    ALGaN/GaN HYBRID MOS-HFET
    3.
    发明申请
    ALGaN/GaN HYBRID MOS-HFET 有权
    ALGaN / GaN混合MOS-HFET

    公开(公告)号:US20130001646A1

    公开(公告)日:2013-01-03

    申请号:US13171798

    申请日:2011-06-29

    IPC分类号: H01L29/778 H01L21/335

    摘要: A field effect transistor (FET) includes source and drain electrodes, a channel layer, a barrier layer over the channel layer, a passivation layer covering the barrier layer for passivating the barrier layer, a gate electrode extending through the barrier layer and the passivation layer, and a gate dielectric surrounding a portion of the gate electrode that extends through the barrier layer and the passivation layer, wherein the passivation layer is a first material and the gate dielectric is a second material, and the first material is different than the second material.

    摘要翻译: 场效应晶体管(FET)包括源极和漏极,沟道层,沟道层上的势垒层,覆盖阻挡层以钝化势垒层的钝化层,延伸穿过阻挡层的栅电极和钝化层 以及围绕所述栅电极的延伸穿过所述阻挡层和所述钝化层的部分的栅极电介质,其中所述钝化层是第一材料,并且所述栅极电介质是第二材料,并且所述第一材料不同于所述第二材料 。

    Two stage plasma etching method for enhancement mode GaN HFET
    4.
    发明授权
    Two stage plasma etching method for enhancement mode GaN HFET 有权
    用于增强型GaN HFET的两级等离子体蚀刻方法

    公开(公告)号:US08124505B1

    公开(公告)日:2012-02-28

    申请号:US12909497

    申请日:2010-10-21

    IPC分类号: H01L21/20 H01L21/36 H01L31/20

    摘要: A two stage plasma etching technique is described that allows the fabrication of an enhancement mode GaN HFET/HEMT. A gate recess area is formed in the Aluminum Gallium Nitride barrier layer of an GaN HFET/HEMT. The gate recess is formed by a two stage etching process. The first stage of the technique uses oxygen to oxidize the surface of the Aluminum Gallium Nitride barrier layer below the gate. Then the second stage uses Boron tricloride to remove the oxidized layer. The result is a self limiting etch process that uniformly thins the Aluminum Gallium Nitride layer below the HFET's gate region such that the two dimensional electron gas is not formed below the gate, thus creating an enhancement mode HFET.

    摘要翻译: 描述了允许制造增强型GaN HFET / HEMT的两级等离子体蚀刻技术。 在GaN HFET / HEMT的氮化镓氮化镓阻挡层中形成栅极凹部。 门槽通过两级蚀刻工艺形成。 该技术的第一阶段使用氧来氧化栅极下方的氮化镓镓屏障层的表面。 然后第二阶段使用三氯化硼去除氧化层。 结果是自限蚀刻工艺,其均匀地使HFET栅极区域下方的氮化镓镓层均匀地沉淀,使得二维电子气体不形成在栅极下方,从而产生增强模式HFET。

    III-Nitride Metal Insulator Semiconductor Field effect Transistor
    5.
    发明申请
    III-Nitride Metal Insulator Semiconductor Field effect Transistor 有权
    III-Nitride金属绝缘子半导体场效应晶体管

    公开(公告)号:US20130026495A1

    公开(公告)日:2013-01-31

    申请号:US13456039

    申请日:2012-04-25

    摘要: A field effect transistor (FET) includes a III-Nitride channel layer, a III-Nitride barrier layer on the channel layer, wherein the barrier layer has an energy bandgap greater than the channel layer, a source electrode electrically coupled to one of the III-Nitride layers, a drain electrode electrically coupled to one of the III-Nitride layers, a gate insulator layer stack for electrically insulating a gate electrode from the barrier layer and the channel layer, the gate insulator layer stack including an insulator layer, such as SiN, and an AlN layer, the gate electrode in a region between the source electrode and the drain electrode and in contact with the insulator layer, and wherein the AlN layer is in contact with one of the III-Nitride layers.

    摘要翻译: 场效应晶体管(FET)包括III-氮化物沟道层,沟道层上的III-氮化物阻挡层,其中该阻挡层具有比该沟道层大的能带隙,该电极与III 氮化物层,电耦合到III族氮化物层之一的漏电极,用于将栅极电极与阻挡层电绝缘的栅极绝缘体层堆叠和沟道层,栅极绝缘体层堆叠包括绝缘体层,例如 SiN和AlN层,栅极电极在源电极和漏电极之间的区域中并与绝缘体层接触,并且其中AlN层与III-氮化物层之一接触。

    III-nitride metal insulator semiconductor field effect transistor
    6.
    发明授权
    III-nitride metal insulator semiconductor field effect transistor 有权
    III族氮化物金属绝缘子半导体场效应晶体管

    公开(公告)号:US08853709B2

    公开(公告)日:2014-10-07

    申请号:US13456039

    申请日:2012-04-25

    IPC分类号: H01L29/778 H01L29/20

    摘要: A field effect transistor (FET) includes a III-Nitride channel layer, a III-Nitride barrier layer on the channel layer, wherein the barrier layer has an energy bandgap greater than the channel layer, a source electrode electrically coupled to one of the III-Nitride layers, a drain electrode electrically coupled to one of the III-Nitride layers, a gate insulator layer stack for electrically insulating a gate electrode from the barrier layer and the channel layer, the gate insulator layer stack including an insulator layer, such as SiN, and an AlN layer, the gate electrode in a region between the source electrode and the drain electrode and in contact with the insulator layer, and wherein the AlN layer is in contact with one of the III-Nitride layers.

    摘要翻译: 场效应晶体管(FET)包括III-氮化物沟道层,沟道层上的III-氮化物阻挡层,其中该阻挡层具有比该沟道层大的能带隙,该电极与III 氮化物层,电耦合到III族氮化物层之一的漏电极,用于将栅极电极与阻挡层电绝缘的栅极绝缘体层堆叠和沟道层,栅极绝缘体层堆叠包括绝缘体层,例如 SiN和AlN层,栅电极在源电极和漏电极之间的区域中并与绝缘体层接触,并且其中AlN层与III-氮化物层之一接触。

    High current high voltage GaN field effect transistors and method of fabricating same
    7.
    发明授权
    High current high voltage GaN field effect transistors and method of fabricating same 有权
    大电流高压GaN场效应晶体管及其制造方法

    公开(公告)号:US08530978B1

    公开(公告)日:2013-09-10

    申请号:US13312406

    申请日:2011-12-06

    IPC分类号: H01L29/66

    摘要: A field effect transistor (FET) having a source contact to a channel layer, a drain contact to the channel layer, and a gate contact on a barrier layer over the channel layer, the FET including a dielectric layer on the barrier layer between the source contact and the drain contact and over the gate contact, and a field plate on the dielectric layer, the field plate connected to the source contact and extending over a space between the gate contact and the drain contact and the field plate comprising a sloped sidewall in the space between the gate contact and the drain contact.

    摘要翻译: 具有到沟道层的源极接触的场效应晶体管(FET),沟道层的漏极接触以及沟道层上的阻挡层上的栅极接触,所述FET包括在源极之间的阻挡层上的介电层 接触和漏极接触以及栅极接触,以及介电层上的场板,场板连接到源极接触并在栅极接触和漏极接触之间的空间上延伸,场板包括倾斜的侧壁 栅极接触和漏极接触之间的空间。

    Gallium nitride switch methodology
    9.
    发明授权
    Gallium nitride switch methodology 有权
    氮化镓开关方法

    公开(公告)号:US07893791B2

    公开(公告)日:2011-02-22

    申请号:US12256321

    申请日:2008-10-22

    IPC分类号: H01P1/10 H01P5/12

    CPC分类号: H01P1/15

    摘要: Devices and systems for using a Gallium Nitride-based (GaN-based) transistor for selectively switching signals are provided. A first transmission line is configured to connect a common connection and a first connection. A first Gallium-Nitride-based (GaN-based) transistor has a first terminal coupled to the first transmission line at a first point, a second terminal coupled to a relative ground, and a third terminal configured to be coupled to a first control connection. A second GaN-based transistor has a first terminal coupled to the first transmission line at a second point, a second terminal configured to be coupled to the relative ground, and a third terminal configured to be coupled to the first control connection.

    摘要翻译: 提供了用于选择性地切换信号的使用基于氮化镓(GaN)的晶体管的器件和系统。 第一传输线被配置为连接公共连接和第一连接。 第一基于氮化镓的(GaN基)晶体管具有在第一点处耦合到第一传输线的第一端子,耦合到相对地的第二端子,以及被配置为耦合到第一控制连接 。 第二GaN基晶体管具有在第二点处耦合到第一传输线的第一端子,被配置为耦合到相对地的第二端子,以及被配置为耦合到第一控制连接的第三端子。