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    MEASUREMENT OF PAD THICKNESS AND CONTROL OF CONDITIONING
    1.
    发明申请
    MEASUREMENT OF PAD THICKNESS AND CONTROL OF CONDITIONING 审中-公开
    垫厚度的测量和调节控制

    公开(公告)号：US20120270477A1

    公开(公告)日：2012-10-25

    申请号：US13092628

    申请日：2011-04-22

    申请人： Roy C. Nangoy ,  Hung Chih Chen ,  Shou-Sung Chang ,  Erik S. Rondum ,  Sameer Deshpande

    发明人： Roy C. Nangoy ,  Hung Chih Chen ,  Shou-Sung Chang ,  Erik S. Rondum ,  Sameer Deshpande

    IPC分类号： B24B53/02 ,  B24B1/00

    CPC分类号： B24B53/017 ,  B24B37/042 ,  B24B49/105 ,  B24B49/18 ,  G01B7/107

    摘要： A conditioning process includes rotating a polishing pad about an axis of rotation, conditioning the polishing pad by sweeping an abrasive disk in a path across a surface of the polishing pad between an inner radial distance from the axis of rotation and an outer radial distance from the axis of rotation, sweeping a sensor across the polishing pad while conditioning the polishing pad, measuring a thickness of the polishing pad at a plurality of positions between the inner radial distance and the outer radial distance with the sensor, and adjusting at least one of a dwell time or a pressure of the abrasive disk against the polishing pad for a portion of the path based on measurements of the thickness by the sensor such that the polishing pad wears to a more uniform thickness than without such adjustment.

    摘要翻译： 调节过程包括围绕旋转轴线旋转抛光垫，通过在距离旋转轴线的内径向距离和与旋转轴线的外径向距离之间的抛光垫的表面上的路径中扫掠研磨盘来调节抛光垫 旋转轴线，在调整抛光垫的同时扫过传感器，在传感器的内径向距离和外径向距离之间的多个位置处测量抛光垫的厚度，并调整至少一个 基于通过传感器的厚度的测量，研磨盘对于抛光垫的一部分的停留时间或压力抵达抛光垫，使得抛光垫比没有这种调节的磨损更均匀。

    Systems and methods for substrate polishing end point detection using improved friction measurement
    2.
    发明授权
    Systems and methods for substrate polishing end point detection using improved friction measurement 有权
    使用改进摩擦测量的基板抛光终点检测的系统和方法

    公开(公告)号：US09061394B2

    公开(公告)日：2015-06-23

    申请号：US13459079

    申请日：2012-04-28

    申请人： Shou-Sung Chang ,  Hung Chih Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rondum

    发明人： Shou-Sung Chang ,  Hung Chih Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rondum

    IPC分类号： B24B1/00 ,  B24B37/013 ,  B24B49/16

    CPC分类号： B24B37/013 ,  B24B49/16

    摘要： Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.

    摘要翻译： 提供了用于抛光衬底的方法，装置和系统。 本发明包括上压板; 耦合到上压板的扭矩/应变测量仪器; 以及耦合到扭矩/应变测量仪器并适于驱动上压板旋转通过扭矩/应变测量仪器的下压板。 在其他实施例中，本发明包括一个上部托架; 耦合到上部托架的侧向力测量仪器; 以及耦合到所述侧向力测量仪器并适于支撑抛光头的下托架。 公开了许多附加方面。

    SYSTEMS AND METHODS FOR SUBSTRATE POLISHING END POINT DETECTION USING IMPROVED FRICTION MEASUREMENT
    3.
    发明申请
    SYSTEMS AND METHODS FOR SUBSTRATE POLISHING END POINT DETECTION USING IMPROVED FRICTION MEASUREMENT 有权
    使用改进的摩擦测量的基板抛光端点检测的系统和方法

    公开(公告)号：US20130122782A1

    公开(公告)日：2013-05-16

    申请号：US13459071

    申请日：2012-04-27

    申请人： Shou-Sung Chang ,  Hung Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rondum

    发明人： Shou-Sung Chang ,  Hung Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rondum

    IPC分类号： B24B49/16

    CPC分类号： B24B37/013 ,  B24B49/16

    摘要： Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.

    摘要翻译： 提供了用于抛光衬底的方法，装置和系统。 本发明包括上压板; 耦合到上压板的扭矩/应变测量仪器; 以及耦合到扭矩/应变测量仪器并适于驱动上压板旋转通过扭矩/应变测量仪器的下压板。 在其他实施例中，本发明包括一个上部托架; 耦合到上部托架的侧向力测量仪器; 以及耦合到所述侧向力测量仪器并适于支撑抛光头的下托架。 公开了许多附加方面。

    Materials for chemical mechanical polishing
    6.
    发明授权
    Materials for chemical mechanical polishing 有权
    化学机械抛光材料

    公开(公告)号：US07429210B2

    公开(公告)日：2008-09-30

    申请号：US11626014

    申请日：2007-01-23

    申请人： Benjamin A. Bonner ,  Peter McReynolds ,  Gregory E. Menk ,  Anand N. Iyer ,  Gopalakrishna B. Prabhu ,  Erik S. Rondum ,  Robert L. Jackson ,  Garlen Leung

    发明人： Benjamin A. Bonner ,  Peter McReynolds ,  Gregory E. Menk ,  Anand N. Iyer ,  Gopalakrishna B. Prabhu ,  Erik S. Rondum ,  Robert L. Jackson ,  Garlen Leung

    IPC分类号： B24D11/00

    CPC分类号： B24D11/00 ,  B24B7/228 ,  B24D2203/00

    摘要： A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.

    摘要翻译： 公开了一种用于制造用于化学机械抛光工艺的抛光制品的抛光制品和方法。 抛光制品具有由在抛光材料中或通过抛光材料形成的凹槽分开的多个抛光材料砖，并且可以粘合地结合到基膜上。 抛光制品可以包括在抛光材料中形成的各种多边形瓦片和椭圆形形状，其允许增强的浆料保持性并且容易地从研磨材料供给辊滚动到卷筒纸型压板组件中的卷取辊上。 抛光制品还可以包括适于最小化抛光制品的不适于抛光的区域中的分层应力的上载体薄膜。 还公开了用于制造抛光制品和替换供应辊的各种实施例的方法和装置。