摘要:
Exemplary embodiments of the invention provide a micromechanical electrostatic resonator which designs high frequency, increases a ratio of output voltage to input voltage, and designs low drive voltage or reduced power consumption. A micromechanical electrostatic resonator of exemplary embodiments includes a plate-shaped vibration body, a pair of electrodes arranged oppositely to each other at both sides of the vibration body with a gap from an outer circumferential portion of the vibration body, a feeding device to apply in-phase alternating-current power to the pair of electrodes, and a detecting device to obtain an output corresponding to a change in capacitance between the vibration body and the electrodes. The planar shape of the vibration body takes a shape having a curved outline which comprises a neck portion.
摘要:
Exemplary embodiments of the invention provide a micromechanical electrostatic resonator which designs high frequency, increases a ratio of output voltage to input voltage, and designs low drive voltage or reduced power consumption. A micromechanical electrostatic resonator of exemplary embodiments includes a plate-shaped vibration body, a pair of electrodes arranged oppositely to each other at both sides of the vibration body with a gap from an outer circumferential portion of the vibration body, a feeding device to apply in-phase alternating-current power to the pair of electrodes, and a detecting device to obtain an output corresponding to a change in capacitance between the vibration body and the electrodes. The planar shape of the vibration body takes a shape having a curved outline which comprises a neck portion.
摘要:
An electronic device includes: a vibrator disposed within a cavity on a substrate and electrically driven; an enclosure wall which has electric conductivity and sections the cavity from an insulation layer surrounding the circumference of the cavity; a first wiring and a second wiring which connect with the vibrator and penetrate the enclosure wall; and a liquid flow preventing portion disposed at the position where the first wiring and the second wiring penetrate the enclosure wall to prevent flow of etchant dissolving the insulation layer from the cavity toward the insulation layer and insulate the first wiring and the second wiring from the enclosure wall.
摘要:
An oscillator includes: a plurality of MEMS vibrators formed on a substrate; and an oscillator configuration circuit connected to the plurality of MEMS vibrators, wherein the plurality of MEMS vibrators each have a beam structure, and the respective beam structures are different, whereby their resonant frequencies are different.
摘要:
A MEMS resonator according to the invention includes: a substrate; a first electrode formed above the substrate; and a second electrode having a supporting portion which is formed above the substrate and a beam portion which is supported by the supporting portion and arranged above the first electrode, wherein the beam portion has, in plan view, a shape in which the width monotonically decreases in a direction from the supporting portion toward a tip of the beam portion in a region overlapping the first electrode.
摘要:
A method of manufacturing an MEMS device includes: forming a covering structure having an MEMS structure and a hollow portion, which is located on a periphery of the MEMS structure and is opened to an outside, on a substrate; and performing surface etching for the MEMS structure in a gas phase by supplying an etching gas to the periphery of the MEMS structure from the outside.
摘要:
A MEMS vibrator according to the invention includes: a first electrode fixed to a surface of a substrate; and a second electrode having a beam portion including a second face facing a first face of the first electrode, and a supporting portion supporting the beam portion and fixed to the surface of the substrate. The beam portion has a first portion whose length in a normal direction of the first face of the beam portion monotonically decreases toward a tip of the beam portion.
摘要:
The present invention is related in general to a wafer-level packaging technique for micro-electro-mechanical systems (MEMS). A cap structure is provided encapsulating a MEMS element formed on a base substrate. A channel communicates etching holes provided on said cap structure, for the passage of an etching fluid to a chamber in which the MEMS element is housed. The holes are arranged in such a manner that they do not overlap, which allows the provision of a large number of etching holes above the MEMS element, but prevents a sealing material from reaching the MEMS element. The invention provides a low cost wafer-level packaging technique for MEMS devices, that reduces the total etching time of the sacrificial material and provides a reinforced protective cap structure for the MEMS package.
摘要:
Exemplary embodiments of the invention provide a micro-mechanical electrostatic actuator with a high driving force and a small occupied space and a micro-mechanical electrostatic actuator in which the movable electrode can be easily manufactured. A micro-mechanical electrostatic actuator of the exemplary embodiments of the present invention includes a substrate, a movable electrode supported by the substrate so as to be movable in a plane along a surface of the substrate and having a frame-shape and an opening that penetrates in a vertical direction perpendicular to the plane, drive electrodes provided in the opening of the substrate, a voltage supply applying a voltage between the movable electrode and the drive electrode and a signal output providing an output signal according to displacement of the movable electrode.