公开(公告)号：US4651172A

公开(公告)日：1987-03-17

申请号：US801950

申请日：1985-11-26

申请人： Ryuji Watanabe ,  Tetsuro Minemura ,  Tetsuo Ito ,  Hisashi Ando ,  Yoshihito Maeda ,  Masaichi Nagai ,  Seiki Shimizu ,  Kiyoshi Konno ,  Toshiki Kaneko

发明人： Ryuji Watanabe ,  Tetsuro Minemura ,  Tetsuo Ito ,  Hisashi Ando ,  Yoshihito Maeda ,  Masaichi Nagai ,  Seiki Shimizu ,  Kiyoshi Konno ,  Toshiki Kaneko

IPC分类号： G11B7/24 ,  G11B7/2403 ,  G11B7/243 ,  G11B7/253 ,  G11B7/2531 ,  G11B7/2533 ,  G11B7/257 ,  G01D15/34 ,  B05D1/36 ,  G03C1/00

CPC分类号： G11B7/252 ,  G11B7/2403 ,  G11B7/243 ,  G11B7/257 ,  G11B2007/24304 ,  G11B2007/24308 ,  G11B2007/25706 ,  G11B2007/25715 ,  G11B7/00454 ,  G11B7/2531 ,  G11B7/2533 ,  Y10S428/913 ,  Y10S430/146

摘要： In an information recording medium having a recording layer for recording information by heating through incoming energy, at least one of an interference layer and an absorption layer for the incoming energy is provided on the energy-incoming side of the recording layer to reduce the reflected energy from the information recording medium and increase the quantity of heat input into the recording layer. The temperature of the recording layer is rapidly enhanced, and rapid writing is made possible thereby. Writing or erasing can be made with less incoming energy, and thus the writing sensitivity or erasing sensitivity of the information recording medium can be increased.

摘要翻译： 在具有用于通过进入能量加热来记录信息的记录层的信息记录介质中，在记录层的能量入射侧提供用于输入能量的干涉层和吸收层中的至少一个，以减少反射能量 并且增加输入到记录层中的热量。 记录层的温度迅速提高，从而可以进行快速写入。 可以以更少的入射能量进行写入或擦除，从而可以增加信息记录介质的写入灵敏度或擦除灵敏度。

公开(公告)号：US4546222A

公开(公告)日：1985-10-08

申请号：US584903

申请日：1984-02-29

申请人： Ryuji Watanabe ,  Akira Wada ,  Hisashi Ando ,  Seiki Shimizu ,  Yukio Kurosawa ,  Kiyoji Iwashita

发明人： Ryuji Watanabe ,  Akira Wada ,  Hisashi Ando ,  Seiki Shimizu ,  Yukio Kurosawa ,  Kiyoji Iwashita

IPC分类号： H01H33/66 ,  H01H1/02 ,  H01H33/664

CPC分类号： H01H33/6644 ,  H01H1/0203

摘要： Disclosed is a vacuum switch having a container and a pair of contact electrodes, and a method of manufacturing the same, in which at least one of the contact electrodes is constituted by a member made up of a skeleton containing cobalt as its principal component with pores into which a copper alloy containing copper as its principal component, silver, and a low melting point and high vapor pressure element having substantially no or very low solid-solubility with respect to the copper at a room temperature is impregnated.

摘要翻译： 公开了一种具有容器和一对接触电极的真空开关及其制造方法，其中至少一个接触电极由包含钴作为主要成分的骨架构成的构件构成，具有孔 浸渍含有铜作为其主要成分的铜合金，银，以及在室温下相对于铜基本上没有或非常低的固溶度的低熔点和高蒸气压元素。

公开(公告)号：US4892986A

公开(公告)日：1990-01-09

申请号：US143119

申请日：1988-01-12

申请人： Ruyji Watanabe ,  Seiki Shimizu ,  Hisashi Ando

发明人： Ruyji Watanabe ,  Seiki Shimizu ,  Hisashi Ando

IPC分类号： H01H33/66 ,  H01H1/02 ,  H01H11/04 ,  H01H33/664 ,  H01H9/30 ,  H01H1/06 ,  H01H33/00

CPC分类号： H01H33/664 ,  H01H1/0203 ,  H01H11/041

摘要： An electrode of a vacuum circuit breaker includes a support electrode, an auxiliary support electrode of Co soldered to the support electrode, and an electric contact portion composed of a sintered porous body of Co sintered to the auxiliary support electrode and a conductive alloy impregnating the sintered porous body. The auxiliary support electrode has a protrusion formed with a flange at its end portion. The auxiliary support electrode thus prepared acts to provide a barrier to a solder during the soldering operation, to increase the joining width between the electrical contact portion and the electrode, and to prevent the characteristics of that alloy from being degraded by the soldering operation.

摘要翻译： 真空断路器的电极包括支撑电极，焊接到支撑电极的Co的辅助支撑电极和由辅助支撑电极烧结的Co的烧结多孔体组成的电接触部分，以及浸渍烧结体的导电合金 多孔体。 辅助支撑电极在其端部具有形成有凸缘的突起。 如此制备的辅助支撑电极用于在焊接操作期间为焊料提供阻挡，以增加电接触部分和电极之间的接合宽度，并且防止该合金的特性由于焊接操作而劣化。

公开(公告)号：US4497875A

公开(公告)日：1985-02-05

申请号：US464945

申请日：1983-02-08

申请人： Hideo Arakawa ,  Keiichi Kuniya ,  Akio Chiba ,  Seiki Shimizu

发明人： Hideo Arakawa ,  Keiichi Kuniya ,  Akio Chiba ,  Seiki Shimizu

IPC分类号： H05K3/44 ,  B23K35/30 ,  B32B15/04 ,  C04B37/00 ,  C04B37/02 ,  H01L21/52 ,  H01L23/14 ,  H01L23/15 ,  H05K3/38 ,  H05K7/20 ,  H05K1/02

CPC分类号： H01L23/142 ,  B23K35/302 ,  C04B37/026 ,  H01L23/15 ,  H05K3/38 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/126 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/38 ,  C04B2237/407 ,  C04B2237/708 ,  C04B2237/86 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  Y10T428/12528 ,  Y10T428/12535

摘要： A ceramic substrate with metal plate, wherein a metal plate consisting mainly of copper is bonded to a ceramic substrate through a brazing layer consisting of a mixture of copper oxide and copper.

摘要翻译： 具有金属板的陶瓷基板，其中主要由铜组成的金属板通过由氧化铜和铜的混合物构成的钎焊层与陶瓷基板接合。

公开(公告)号：US4482912A

公开(公告)日：1984-11-13

申请号：US344976

申请日：1982-02-02

申请人： Akio Chiba ,  Seiki Shimizu ,  Keiichi Kuniya ,  Jin Onuki

发明人： Akio Chiba ,  Seiki Shimizu ,  Keiichi Kuniya ,  Jin Onuki

IPC分类号： H01L21/52 ,  B32B15/14 ,  C22C49/14 ,  H01L21/58 ,  H01L23/373 ,  H01L23/492 ,  H01L31/0392 ,  H01L23/14 ,  H01L23/18 ,  H01L23/54

CPC分类号： H01L24/83 ,  B32B15/14 ,  C22C49/14 ,  H01L23/3733 ,  H01L23/4922 ,  H01L24/29 ,  H01L24/32 ,  H01L31/03921 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/15747 ,  Y02E10/50 ,  Y10T428/12444 ,  Y10T428/12486

摘要： Herein disclosed is a stacked or laminated structure which is rigidly integrated by sandwiching a metal layer between a first matrix-fiber composite layer prepared to have as a whole a thermal expansion coefficient and a second matrix-fiber layer prepared to have as a whole another thermal expansion coefficient different from that of the first matrix-fiber composite layer. The intervening metal layer acts as a buffer for the first and second matrix-fiber composite layers. The stacked structure according to the present invention can by used as the chip carrier of a semiconductor device, for example.

摘要翻译： 本文公开了一种层叠或层压结构，其通过将金属层夹在准备具有整体热膨胀系数的第一基质 - 纤维复合材料层和制备成具有另一种热膨胀系数的第二基质 - 纤维层之间而被刚性地整合 膨胀系数与第一基质纤维复合层不同。 中间金属层用作第一和第二基质 - 纤维复合层的缓冲剂。 根据本发明的堆叠结构可以例如用作半导体器件的芯片载体。