摘要:
In a novel rewriteable nonvolatile memory cell formed above a substrate, a diode is paired with a reversible resistance-switching material, preferably a metal oxide or nitride such as, for example, NiO, Nb2O5, TiO2, HfO2, Al2O3, MgOx, CrO2, VO, BN, and AlN. In preferred embodiments, the diode is formed as a vertical pillar disposed between conductors. Multiple memory levels can be stacked to form a monolithic three dimensional memory array. In some embodiments, the diode comprises germanium or a germanium alloy, which can be deposited and crystallized at relatively low temperatures, allowing use of aluminum or copper in the conductors.
摘要翻译:在形成于基板上方的新型可重写非易失性存储单元中,二极管与可逆电阻切换材料配对,优选为金属氧化物或氮化物,例如NiO,Nb 2 O > 5,TiO 2,HfO 2,Al 2 O 3,MgO, xO,CrO 2,VO,BN和AlN。 在优选实施例中,二极管形成为设置在导体之间的垂直支柱。 可以堆叠多个存储器级别以形成单片三维存储器阵列。 在一些实施例中,二极管包括锗或锗合金,其可以在相对低的温度下沉积和结晶,从而允许在导体中使用铝或铜。
摘要:
A method of operating a nonvolatile memory cell includes providing the nonvolatile memory cell comprising a diode which is fabricated in a first resistivity, unprogrammed state, and applying a forward bias to the diode having a magnitude greater than a minimum voltage required for programming the diode to switch the diode to a second resistivity, programmed state. The second resistivity state is lower than the first resistivity state.
摘要:
The invention provides for a vertically oriented junction diode having a contact-antifuse unit in contact with one of its electrodes. The contact-antifuse unit is formed either above or below the junction diode, and comprises a silicide with a dielectric antifuse layer formed on and in contact with it. In preferred embodiments, the silicide is cobalt silicide, and the antifuse is preferably silicon oxide, silicon nitride, or silicon oxynitride grown on the cobalt silicide. The junction diode and contact-antifuse unit can be used as a memory cell, which is advantageously used in a monolithic three dimensional memory array.
摘要:
In a novel nonvolatile memory cell formed above a substrate, a diode is paired with a reversible resistance-switching material, preferably a metal oxide or nitride such as, for example, NixOy, NbxOy, TixOy, HFxOy, AlxOy, MgxOy, CoxOy, CrxOy, VxOy, ZnxOy, ZrxOy, BxNy, and AlxNy. In preferred embodiments, the diode is formed as a vertical pillar disposed between conductors. Multiple memory levels can be stacked to form a monolithic three dimensional memory array. In some embodiments, the diode comprises germanium or a germanium alloy, which can be deposited and crystallized at relatively low temperatures, allowing use of aluminum or copper in the conductors. The memory cell of the present invention can be used as a rewriteable memory cell or a one-time-programmable memory cell, and can store two or more data states.
摘要翻译:在形成在衬底上方的新型非易失性存储单元中,二极管与可逆电阻切换材料配对,优选地为金属氧化物或氮化物,例如Ni x O y O y, 铌,x O y,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,SUB,SUB 其中,O x Y y O y,Y x O y,Y O x O x,X x O,O x O,X x O, y,x,x,y,y,x,y,x,y,x, / SUB> Y>和< N> N< / SUB>。 在优选实施例中,二极管形成为设置在导体之间的垂直支柱。 可以堆叠多个存储器级别以形成单片三维存储器阵列。 在一些实施例中,二极管包括锗或锗合金,其可以在相对低的温度下沉积和结晶,从而允许在导体中使用铝或铜。 本发明的存储单元可以用作可重写存储单元或一次可编程存储单元,并且可以存储两个或多个数据状态。
摘要:
A nonvolatile memory cell comprising a diode formed of semiconductor material can store memory states by changing the resistance of the semiconductor material by application of a set pulse (decreasing resistance) or a reset pulse (increasing resistance.) In preferred embodiments, set pulses are applied with the diode under forward bias, while reset pulses are applied with the diode in reverse bias. By switching resistivity of the semiconductor material of the diode, a memory cell can be either one-time programmable or rewriteable, and can achieve two, three, four, or more distinct data states.
摘要:
A nonvolatile memory cell comprising a switchable resistor memory element and a thin-film three-terminal switching device, preferably a MOSFET, in series. The switchable resistor memory element has the property of having at least two stable resistance states, for example a high-resistance state and a low-resistance state. It is switched between the two states, and its resistance state (and thus the data state of the cell) is sensed by providing appropriate current through the three-terminal switching device. Preferred embodiments of the present invention include a highly dense monolithic three dimensional memory array in which multiple memory levels of such memory cells are formed above a single substrate such as a monocrystalline silicon wafer.
摘要:
An integrated circuit is provided including at least one memory cell. Such memory cell, in turn, includes a transistor and a capacitor. The transistor includes a source, a drain, and a gate. Further, the capacitor includes a well and a gate. The gate of the transistor remains in communication with the gate of the capacitor. In various other embodiments, the memory cell includes a transistor and a capacitor including wells of differing types (e.g. P-type, N-type). In such embodiments, the well of the transistor abuts the well of the capacitor. In still further embodiments, for a more compact design, a diffusion region of the transistor is situated less than 2.5 μm from a diffusion region of the capacitor.
摘要:
There is provided a monolithic three dimensional TFT mask ROM array. The array includes a plurality of device levels. Each of the plurality of device levels contains a first set of enabled TFTs and a second set of partially or totally disabled TFTs.
摘要:
The present invention relates to a solid-state bi-stable circuit functioning as a six-bulk transistor static memory cell, the circuit comprising a plurality of bitlines and at least a first and second reference line, all of which are positioned in parallel with a plurality of wordlines. The circuit further comprises a plurality of transistors including a first and second load transistor, a first and a second pull-down transistor and a first and a second access transistor, in which each of the plurality of transistors includes a gate, source and drain. The gates of the plurality of transistors are positioned in parallel to minimize area usage.
摘要:
A method of forming a three-dimensional, non-volatile memory array utilizing damascene fabrication techniques is disclosed. A bottom set of conductors is formed and a set of first pillar shaped elements of heavily doped semiconductor material as formed thereon. A mold is formed of insulating material having pillar shaped openings self-aligned with the first pillar shaped elements and a second semiconductor is deposited over the mold to form second pillar shaped elements aligned with the first pillar shaped elements. The pillar elements formed may be further processed by forming another mold of insulating material having trench openings aligned with the pillar shaped elements and then filling the trenches with conductive material to form conductors coupled to the pillar shaped elements.