公开(公告)号：US06471789B1

公开(公告)日：2002-10-29

申请号：US08440575

申请日：1995-05-18

申请人： S. Leslie Ames ,  Vilakkudi G. Veeraraghavan ,  Stephen D. Washko

发明人： S. Leslie Ames ,  Vilakkudi G. Veeraraghavan ,  Stephen D. Washko

IPC分类号： H01F1153

CPC分类号： H01F1/15308 ,  B22D11/0611 ,  Y10T428/12431

摘要： An amorphous metal alloy strip is disclosed having a width greater than about one inch and a thickness less than about 0.003 inch, this alloy consists essentially of 77 to 80 atomic percent iron, 12 to 16 atomic percent boron and 5 to 10 atomic percent silicon with incidental impurities. The strip has a 60 cycle per second core loss of less than about 0.100 watts per pound at 12.6 kilogauss, saturation magnetization of at least 15 kilogauss, and a coercive force of less than about 0.04 oersteds. Such alloy is further characterized by increased castability and the strip produced therefrom exhibits at least singular ductility. A method of producing such optimum strip is also disclosed.

摘要翻译： 公开了一种非晶金属合金带，其宽度大于约1英寸，厚度小于约0.003英寸，该合金基本上由77至80原子％的铁，12至16原子％的硼和5至10原子％的硅组成， 附带杂质。 该条具有每秒60秒的循环，每秒12.6千兆瓦，饱和磁化强度至少为15千克，矫顽力小于约0.04奥斯特。 这种合金的进一步特征在于浇铸性能的提高，由此产生的带材至少具有单一的延展性。 还公开了一种生产这种最佳条带的方法。

公开(公告)号：US06296948B1

公开(公告)日：2001-10-02

申请号：US06235064

申请日：1981-02-17

申请人： S. Leslie Ames ,  Vilakkudi G. Veeraraghavan ,  Stephen D. Washko

发明人： S. Leslie Ames ,  Vilakkudi G. Veeraraghavan ,  Stephen D. Washko

IPC分类号： B21C3700

CPC分类号： H01F1/15308 ,  B22D11/0611 ,  Y10T428/12431

摘要： An amorphous metal alloy strip is disclosed having a width greater than about one inch and a thickness less than about 0.003 inch, this alloy consists essentially of 77 to 80 atomic percent iron, 12 to 16 atomic percent boron and 5 to 10 atomic percent silicon with incidental impurities. The strip has a 60 cycle per second core loss of less than about 0.100 watts per pound at 12.6 kilogauss, saturation magnetization of at least 15 kilogauss, and a coercive force of less than about 0.04 oersteds. Such alloy is further characterized by increased castability and the strip produced therefrom exhibits at least singular ductility. A method of producing such optimum strip is also disclosed.

公开(公告)号：US06277212B1

公开(公告)日：2001-08-21

申请号：US06425143

申请日：1982-09-27

申请人： S. Leslie Ames ,  Vilakkudi G. Veeraraghavan ,  Stephen D. Washko

发明人： S. Leslie Ames ,  Vilakkudi G. Veeraraghavan ,  Stephen D. Washko

IPC分类号： H01E1153

CPC分类号： H01F1/15308 ,  B22D11/0611 ,  Y10T428/12431

摘要： An amorphous metal alloy strip is disclosed having a width greater than about one inch and a thickness less than about 0.003 inch, this alloy consists essentially of 77 to 80 atomic percent iron, 12 to 16 atomic percent boron and 5 to 10 atomic percent silicon with incidental impurities. The strip has a 60 cycle per second core loss of less than about 0.100 watts per pound at 12.6 kilogauss, saturation magnetization of at least 15 kilogauss, and a coercive force of less than about 0.04 oersteds. Such alloy is further characterized by increased castability and the strip produced therefrom exhibits at least singular ductility. A method of producing such optimum strip is also disclosed.

摘要翻译： 公开了一种非晶金属合金带，其宽度大于约1英寸，厚度小于约0.003英寸，该合金基本上由77至80原子％的铁，12至16原子％的硼和5至10原子％的硅组成， 附带杂质。 该条具有每秒60秒的循环，每秒12.6千兆瓦，饱和磁化强度至少为15千克，矫顽力小于约0.04奥斯特。 这种合金的进一步特征在于浇铸性能的提高，由此产生的带材至少具有单一的延展性。 还公开了一种生产这种最佳条带的方法。

公开(公告)号：US5370749A

公开(公告)日：1994-12-06

申请号：US922459

申请日：1992-07-30

申请人： S. Leslie Ames ,  Vilakkudi G. Veeraraghavan

发明人： S. Leslie Ames ,  Vilakkudi G. Veeraraghavan

IPC分类号： B22D11/00 ,  B22D11/06 ,  C22C33/00 ,  C22C38/02 ,  C22C45/02 ,  H01F1/153 ,  H01F1/16

CPC分类号： H01F1/15308 ,  B22D11/0611 ,  Y10T428/12431

摘要： An amorphous metal alloy strip is disclosed having a width greater than about one inch and a thickness less than about 0.003 inch, this alloy consists essentially of 77 to 80 atomic percent iron, 12 to 16 atomic percent boron and 5 to 10 atomic percent silicon with incidental impurities. The strip has a 60 cycle per second core loss of less than about 0.100 watts per pound at 12.6 kilogauss, saturation magnetization of at least 15 kilogauss, and a coercive force of less than about 0.04 oersteds. Such alloy is further characterized by increased castability and the strip produced therefrom exhibits at least singular ductility. A method of producing such optimum strip is also disclosed.

摘要翻译： 公开了一种非晶金属合金带，其宽度大于约1英寸，厚度小于约0.003英寸，该合金基本上由77至80原子％的铁，12至16原子％的硼和5至10原子％的硅组成， 附带杂质。 该条具有每秒60秒的循环，每秒12.6千兆瓦，饱和磁化强度至少为15千克，矫顽力小于约0.04奥斯特。 这种合金的进一步特征在于浇铸性能的提高，由此产生的带材至少具有单一的延展性。 还公开了一种生产这种最佳条带的方法。

公开(公告)号：US5170931A

公开(公告)日：1992-12-15

申请号：US644528

申请日：1991-01-23

申请人： Kishor V. Desai ,  Nelson P. Franchak ,  Robert H. Katyl ,  Harold Kohn ,  Tamar A. Sholtes ,  Vilakkudi G. Veeraraghavan ,  Charles G. Woychik

发明人： Kishor V. Desai ,  Nelson P. Franchak ,  Robert H. Katyl ,  Harold Kohn ,  Tamar A. Sholtes ,  Vilakkudi G. Veeraraghavan ,  Charles G. Woychik

IPC分类号： H01L21/98 ,  H01L23/498 ,  H01L23/538 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC分类号： H01L25/50 ,  H01L23/4985 ,  H01L23/5385 ,  H05K3/3478 ,  H05K3/363 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15321 ,  H05K1/141 ,  H05K2201/0215 ,  H05K2201/049 ,  H05K2201/10234 ,  H05K2201/10477 ,  H05K2201/10681 ,  H05K2201/10734 ,  H05K2201/10984 ,  H05K2203/0165 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/0557

摘要： Method and apparatus are disclosed for mounting a flexible film semiconductor chip carrier on a second level electronic package. The resulting electronic packaging structure includes electrically conductive spacers, such as solder balls or solder coated copper balls, which electrically interconnect outer lead bonding pads on the flexible film semiconductor chip carrier and corresponding bonding pads on the second level electronic package, and which physically support the flexible film of the semiconductor chip carrier substantially in a plane above the surface of the second level electronic package. This electronic packaging structure is made using a special assembly fixture comprising a base plate, a pressure insert with a resilient member, and a top plate. The flexible film semiconductor chip carrier with the spacers attached thereto is placed over the resilient member of the pressure insert which is clamped together with the second level electronic package between the top and base plates. Then, this assembly is heated to reflow the solder of the spacers, and the assembly fixture is disassembled, leaving the flexible film semiconductor chip carrier mounted on the second level electronic package with the flexible film of the carrier having a planar geometry as desired. The spacers may be attached to the flexible film semiconductor chip carrier using a special template having a pattern of openings corresponding to the pattern of outer lead bonding pads on the flexible film semiconductor chip carrier.

公开(公告)号：US4166756A

公开(公告)日：1979-09-04

申请号：US892142

申请日：1978-03-31

申请人： Robert P. Geyer ,  Kenneth F. Veasman ,  Vilakkudi G. Veeraraghavan

发明人： Robert P. Geyer ,  Kenneth F. Veasman ,  Vilakkudi G. Veeraraghavan

IPC分类号： C22C33/08 ,  B05B9/08 ,  B05B11/00 ,  C21D5/00 ,  C22C37/00

CPC分类号： C22C37/00

摘要： A process for the manufacture of railroad car truck components with high wear resistant qualities involves an alloy of specific composition, dumping from the sand mold above a specific temperature and being allowed to cool in air, resulting in an "as cast" acicular microstructure having very little amounts of Pearlite and carbides. This process eliminates the heat treating, quenching and draw operations normally associated with the production of wear resistant, acicular castings.

摘要翻译： 用于制造具有高耐磨性质的铁路车辆车辆部件的方法涉及特定组成的合金，从砂模倾倒高于特定温度并允许在空气中冷却，导致“铸造”针状微结构具有非常高的 少量的珠光体和碳化物。 该方法消除了通常与生产耐磨针针状铸件相关的热处理，淬火和拉伸作业。

公开(公告)号：US5201451A

公开(公告)日：1993-04-13

申请号：US727047

申请日：1991-07-09

申请人： Kishor V. Desai ,  Nelson P. Franchak ,  Robert H. Katyl ,  Harold Kohn ,  Endwell ,  Tamar A. Sholtes ,  Vilakkudi G. Veeraraghavan ,  Charles G. Woychik

发明人： Kishor V. Desai ,  Nelson P. Franchak ,  Robert H. Katyl ,  Harold Kohn ,  Endwell ,  Tamar A. Sholtes ,  Vilakkudi G. Veeraraghavan ,  Charles G. Woychik

IPC分类号： H01L21/98 ,  H01L23/498 ,  H01L23/538 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC分类号： H01L25/50 ,  H01L23/4985 ,  H01L23/5385 ,  H05K3/3478 ,  H05K3/363 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H05K1/141 ,  H05K2201/0215 ,  H05K2201/049 ,  H05K2201/10234 ,  H05K2201/10477 ,  H05K2201/10681 ,  H05K2201/10734 ,  H05K2201/10984 ,  H05K2203/0165 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/0557

摘要： Method and apparatus are disclosed for mounting a flexible film semiconductor chip carrier on a second level electronic package. The resulting electronic packaging structure includes electrically conductive spacers, such as solder balls or solder coated copper balls, which electrically interconnect outer lead bonding pads on the flexible film semiconductor chip carrier and corresponding bonding pads on the second level electronic package, and which physically support the flexible film of the semiconductor chip carrier substantially in a plane above the surface of the second level electronic package. This electronic packaging structure is made using a special assembly fixture comprising a base plate, a pressure insert with a resilient member, and a top plate. The flexible film semiconductor chip carrier with the spacers attached thereto is placed over the resilient member of the pressure insert which is clamped together with the second level electronic package between the top and base plates. Then, this assembly is heated to reflow the solder of the spacers, and the assembly fixture is disassembled,; leaving the flexible film semiconductor chip carrier mounted on the second level electronic package with the flexible film of the carrier having a planar geometry as desired.

摘要翻译： 公开了用于将柔性膜半导体芯片载体安装在第二级电子封装上的方法和装置。 所得到的电子封装结构包括导电间隔物，例如焊球或焊料涂覆的铜球，其将柔性膜半导体芯片载体上的外引线接合焊盘和第二级电子封装上的对应焊盘电互连，并且物理地支撑 所述半导体芯片载体的柔性膜基本上在所述第二级电子封装的表面上方的平面中。 该电子包装结构使用特殊的组装夹具制成，该组装夹具包括基板，具有弹性构件的压力插入件和顶板。 具有附接到其上的间隔物的柔性膜半导体芯片载体被放置在压力插入件的弹性构件上，该压力插入件与顶层和底板之间的第二级电子封装夹紧在一起。 然后，将该组件加热以回流间隔件的焊料，并拆卸组装夹具。 留下安装在第二级电子封装上的柔性膜半导体芯片载体，其中载体的柔性膜具有所需的平面几何形状。

公开(公告)号：US5159535A

公开(公告)日：1992-10-27

申请号：US365326

申请日：1989-06-13

申请人： Kishor V. Desai ,  Nelson P. Franchak ,  Robert H. Katyl ,  Harold Kohn ,  Tamar A. Sholtes ,  Vilakkudi G. Veeraraghavan ,  Charles G. Woychik

发明人： Kishor V. Desai ,  Nelson P. Franchak ,  Robert H. Katyl ,  Harold Kohn ,  Tamar A. Sholtes ,  Vilakkudi G. Veeraraghavan ,  Charles G. Woychik

IPC分类号： H01L21/98 ,  H01L23/498 ,  H01L23/538 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC分类号： H01L25/50 ,  H01L23/4985 ,  H01L23/5385 ,  H05K3/3478 ,  H05K3/363 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15321 ,  H05K1/141 ,  H05K2201/0215 ,  H05K2201/049 ,  H05K2201/10234 ,  H05K2201/10477 ,  H05K2201/10681 ,  H05K2201/10734 ,  H05K2201/10984 ,  H05K2203/0165 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/0557

摘要： Method and apparatus are disclosed for mounting a flexible film semiconductor chip carrier on a second level electronic package. The resulting electronic packaging structure includes electrically conductive spacers, such as solder balls or solder coated copper balls, which electrically interconnect outer lead bonding pads on the flexible film semiconductor chip carrier and corresponding bonding pads on the second level electronic package, and which physically support the flexible film of the semiconductor chip carrier substantially in a plane above the surface of the second level electronic package. This electronic packaging structure is made using a special assembly fixture comprising a base plate, a pressure insert with a resilient member, and a top plate. The flexible film semiconductor chip carrier with the spacers attached thereto is placed over the resilient member of the pressure insert which is clamped together with the second level electronic package between the top and base plates. Then, this assembly is heated to reflow the solder of the spacers, and the assembly fixture is disassembled, leaving the flexible film semiconductor chip carrier mounted on the second level electronic package with the flexible film of the carrier having a planar geometry as desired. The spacers may be attached to the flexible film semiconductor chip carrier using a special template having a pattern of openings corresponding to the pattern of outer lead bonding pads on the flexible film semiconductor chip carrier.

摘要翻译： 公开了用于将柔性膜半导体芯片载体安装在第二级电子封装上的方法和装置。 所得到的电子封装结构包括导电间隔物，例如焊球或焊料涂覆的铜球，其将柔性膜半导体芯片载体上的外引线接合焊盘和第二级电子封装上的对应焊盘电互连，并且物理地支撑 所述半导体芯片载体的柔性膜基本上在所述第二级电子封装的表面上方的平面中。 该电子包装结构使用特殊的组装夹具制成，该组装夹具包括基板，具有弹性构件的压力插入件和顶板。 具有附接到其上的间隔物的柔性膜半导体芯片载体被放置在压力插入件的弹性构件上，该压力插入件与顶层和底板之间的第二级电子封装夹紧在一起。 然后，将该组件加热以回流间隔件的焊料，并且组装夹具被拆卸，使得柔性膜半导体芯片载体安装在第二层电子封装上，其中载体的柔性膜根据需要具有平面几何形状。 可以使用具有对应于柔性膜半导体芯片载体上的外引线接合焊盘的图案的开口图案的特殊模板将间隔件附接到柔性膜半导体芯片载体。