公开(公告)号：US5170931A

公开(公告)日：1992-12-15

申请号：US644528

申请日：1991-01-23

申请人： Kishor V. Desai ,  Nelson P. Franchak ,  Robert H. Katyl ,  Harold Kohn ,  Tamar A. Sholtes ,  Vilakkudi G. Veeraraghavan ,  Charles G. Woychik

发明人： Kishor V. Desai ,  Nelson P. Franchak ,  Robert H. Katyl ,  Harold Kohn ,  Tamar A. Sholtes ,  Vilakkudi G. Veeraraghavan ,  Charles G. Woychik

IPC分类号： H01L21/98 ,  H01L23/498 ,  H01L23/538 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC分类号： H01L25/50 ,  H01L23/4985 ,  H01L23/5385 ,  H05K3/3478 ,  H05K3/363 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15321 ,  H05K1/141 ,  H05K2201/0215 ,  H05K2201/049 ,  H05K2201/10234 ,  H05K2201/10477 ,  H05K2201/10681 ,  H05K2201/10734 ,  H05K2201/10984 ,  H05K2203/0165 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/0557

摘要： Method and apparatus are disclosed for mounting a flexible film semiconductor chip carrier on a second level electronic package. The resulting electronic packaging structure includes electrically conductive spacers, such as solder balls or solder coated copper balls, which electrically interconnect outer lead bonding pads on the flexible film semiconductor chip carrier and corresponding bonding pads on the second level electronic package, and which physically support the flexible film of the semiconductor chip carrier substantially in a plane above the surface of the second level electronic package. This electronic packaging structure is made using a special assembly fixture comprising a base plate, a pressure insert with a resilient member, and a top plate. The flexible film semiconductor chip carrier with the spacers attached thereto is placed over the resilient member of the pressure insert which is clamped together with the second level electronic package between the top and base plates. Then, this assembly is heated to reflow the solder of the spacers, and the assembly fixture is disassembled, leaving the flexible film semiconductor chip carrier mounted on the second level electronic package with the flexible film of the carrier having a planar geometry as desired. The spacers may be attached to the flexible film semiconductor chip carrier using a special template having a pattern of openings corresponding to the pattern of outer lead bonding pads on the flexible film semiconductor chip carrier.

公开(公告)号：US5201451A

公开(公告)日：1993-04-13

申请号：US727047

申请日：1991-07-09

申请人： Kishor V. Desai ,  Nelson P. Franchak ,  Robert H. Katyl ,  Harold Kohn ,  Endwell ,  Tamar A. Sholtes ,  Vilakkudi G. Veeraraghavan ,  Charles G. Woychik

发明人： Kishor V. Desai ,  Nelson P. Franchak ,  Robert H. Katyl ,  Harold Kohn ,  Endwell ,  Tamar A. Sholtes ,  Vilakkudi G. Veeraraghavan ,  Charles G. Woychik

IPC分类号： H01L21/98 ,  H01L23/498 ,  H01L23/538 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC分类号： H01L25/50 ,  H01L23/4985 ,  H01L23/5385 ,  H05K3/3478 ,  H05K3/363 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H05K1/141 ,  H05K2201/0215 ,  H05K2201/049 ,  H05K2201/10234 ,  H05K2201/10477 ,  H05K2201/10681 ,  H05K2201/10734 ,  H05K2201/10984 ,  H05K2203/0165 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/0557

摘要： Method and apparatus are disclosed for mounting a flexible film semiconductor chip carrier on a second level electronic package. The resulting electronic packaging structure includes electrically conductive spacers, such as solder balls or solder coated copper balls, which electrically interconnect outer lead bonding pads on the flexible film semiconductor chip carrier and corresponding bonding pads on the second level electronic package, and which physically support the flexible film of the semiconductor chip carrier substantially in a plane above the surface of the second level electronic package. This electronic packaging structure is made using a special assembly fixture comprising a base plate, a pressure insert with a resilient member, and a top plate. The flexible film semiconductor chip carrier with the spacers attached thereto is placed over the resilient member of the pressure insert which is clamped together with the second level electronic package between the top and base plates. Then, this assembly is heated to reflow the solder of the spacers, and the assembly fixture is disassembled,; leaving the flexible film semiconductor chip carrier mounted on the second level electronic package with the flexible film of the carrier having a planar geometry as desired.

摘要翻译： 公开了用于将柔性膜半导体芯片载体安装在第二级电子封装上的方法和装置。 所得到的电子封装结构包括导电间隔物，例如焊球或焊料涂覆的铜球，其将柔性膜半导体芯片载体上的外引线接合焊盘和第二级电子封装上的对应焊盘电互连，并且物理地支撑 所述半导体芯片载体的柔性膜基本上在所述第二级电子封装的表面上方的平面中。 该电子包装结构使用特殊的组装夹具制成，该组装夹具包括基板，具有弹性构件的压力插入件和顶板。 具有附接到其上的间隔物的柔性膜半导体芯片载体被放置在压力插入件的弹性构件上，该压力插入件与顶层和底板之间的第二级电子封装夹紧在一起。 然后，将该组件加热以回流间隔件的焊料，并拆卸组装夹具。 留下安装在第二级电子封装上的柔性膜半导体芯片载体，其中载体的柔性膜具有所需的平面几何形状。

公开(公告)号：US5159535A

公开(公告)日：1992-10-27

申请号：US365326

申请日：1989-06-13

申请人： Kishor V. Desai ,  Nelson P. Franchak ,  Robert H. Katyl ,  Harold Kohn ,  Tamar A. Sholtes ,  Vilakkudi G. Veeraraghavan ,  Charles G. Woychik

发明人： Kishor V. Desai ,  Nelson P. Franchak ,  Robert H. Katyl ,  Harold Kohn ,  Tamar A. Sholtes ,  Vilakkudi G. Veeraraghavan ,  Charles G. Woychik

IPC分类号： H01L21/98 ,  H01L23/498 ,  H01L23/538 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC分类号： H01L25/50 ,  H01L23/4985 ,  H01L23/5385 ,  H05K3/3478 ,  H05K3/363 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15321 ,  H05K1/141 ,  H05K2201/0215 ,  H05K2201/049 ,  H05K2201/10234 ,  H05K2201/10477 ,  H05K2201/10681 ,  H05K2201/10734 ,  H05K2201/10984 ,  H05K2203/0165 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/0557

摘要： Method and apparatus are disclosed for mounting a flexible film semiconductor chip carrier on a second level electronic package. The resulting electronic packaging structure includes electrically conductive spacers, such as solder balls or solder coated copper balls, which electrically interconnect outer lead bonding pads on the flexible film semiconductor chip carrier and corresponding bonding pads on the second level electronic package, and which physically support the flexible film of the semiconductor chip carrier substantially in a plane above the surface of the second level electronic package. This electronic packaging structure is made using a special assembly fixture comprising a base plate, a pressure insert with a resilient member, and a top plate. The flexible film semiconductor chip carrier with the spacers attached thereto is placed over the resilient member of the pressure insert which is clamped together with the second level electronic package between the top and base plates. Then, this assembly is heated to reflow the solder of the spacers, and the assembly fixture is disassembled, leaving the flexible film semiconductor chip carrier mounted on the second level electronic package with the flexible film of the carrier having a planar geometry as desired. The spacers may be attached to the flexible film semiconductor chip carrier using a special template having a pattern of openings corresponding to the pattern of outer lead bonding pads on the flexible film semiconductor chip carrier.

摘要翻译： 公开了用于将柔性膜半导体芯片载体安装在第二级电子封装上的方法和装置。 所得到的电子封装结构包括导电间隔物，例如焊球或焊料涂覆的铜球，其将柔性膜半导体芯片载体上的外引线接合焊盘和第二级电子封装上的对应焊盘电互连，并且物理地支撑 所述半导体芯片载体的柔性膜基本上在所述第二级电子封装的表面上方的平面中。 该电子包装结构使用特殊的组装夹具制成，该组装夹具包括基板，具有弹性构件的压力插入件和顶板。 具有附接到其上的间隔物的柔性膜半导体芯片载体被放置在压力插入件的弹性构件上，该压力插入件与顶层和底板之间的第二级电子封装夹紧在一起。 然后，将该组件加热以回流间隔件的焊料，并且组装夹具被拆卸，使得柔性膜半导体芯片载体安装在第二层电子封装上，其中载体的柔性膜根据需要具有平面几何形状。 可以使用具有对应于柔性膜半导体芯片载体上的外引线接合焊盘的图案的开口图案的特殊模板将间隔件附接到柔性膜半导体芯片载体。

公开(公告)号：US4670325A

公开(公告)日：1987-06-02

申请号：US881586

申请日：1986-07-02

申请人： Peter Bakos ,  Russell E. Darrow ,  Nelson P. Franchak ,  Joseph Funari

发明人： Peter Bakos ,  Russell E. Darrow ,  Nelson P. Franchak ,  Joseph Funari

IPC分类号： H01L23/498 ,  H05K1/00 ,  H05K1/03 ,  H05K3/46

CPC分类号： H01L23/49883 ,  H05K3/4676 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K3/467 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31681

摘要： A structure comprising on a substrate successive layers of metal circuitry having therebetween as a dielectric a cured polyimide composition containing a polyimide and aluminum oxide or zinc oxide or mixtures thereof.The structure is produced by a method including the following process steps:blanket screen printing a mixture containing a polyamido carboxylic acid, aluminum oxide or zinc oxide or mixtures thereof and a detackifier with the rest being a solvent on a substrate with a layer of metal circuitry thereon,drying the deposited layer at a temperature between about 25.degree. and about 120.degree. C.,selectively etching holes into the deposited layer where vias between adjacent layers of metal circuitry are needed,curing the deposited layer at a temperature between about 300.degree. and about 400.degree. C. andforming another layer of metal circuitry.

摘要翻译： 一种结构，其包括在基底上连续的金属电路层，其间具有包含聚酰亚胺和氧化铝或氧化锌或其混合物的固化的聚酰亚胺组合物作为电介质。 该结构通过包括以下方法步骤的方法制备：将丝网印刷包含聚酰胺羧酸，氧化铝或氧化锌或其混合物的混合物，和其它的脱粘剂，其中的溶剂在具有金属电路层的基材上 在其上在约25℃至约120℃的温度下干燥沉积层，选择性地将孔蚀刻到需要金属电路相邻层之间的通孔的沉积层中，在约300°和 约400℃，形成另一层金属电路。

公开(公告)号：US4334949A

公开(公告)日：1982-06-15

申请号：US210193

申请日：1980-11-25

申请人： Joseph G. Ameen ,  Nelson P. Franchak ,  John Rasile ,  Dennis L. Rivenburgh

发明人： Joseph G. Ameen ,  Nelson P. Franchak ,  John Rasile ,  Dennis L. Rivenburgh

IPC分类号： C09K13/04 ,  B01J41/04 ,  C01D1/28 ,  C08J7/02 ,  C08J7/12 ,  C09K13/02 ,  H01L21/311 ,  H05K3/06 ,  B29C17/08 ,  B01D15/04

CPC分类号： C09K13/02 ,  B01J41/04 ,  C01D1/28 ,  H01L21/31133

摘要： A method for reducing the concentration of carbonate in an aqueous solution which includes contacting the aqueous solution with a strongly basic ion-exchange resin.

摘要翻译： 一种降低水溶液中碳酸盐浓度的方法，包括使水溶液与强碱性离子交换树脂接触。