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    IN-SITU PERFORMANCE PREDICTION OF PAD CONDITIONING DISK BY CLOSED LOOP TORQUE MONITORING
    1.
    发明申请
    IN-SITU PERFORMANCE PREDICTION OF PAD CONDITIONING DISK BY CLOSED LOOP TORQUE MONITORING 有权
    通过闭环控制扭矩监测进行调节盘的现场性能预测

    公开(公告)号：US20100035525A1

    公开(公告)日：2010-02-11

    申请号：US12187637

    申请日：2008-08-07

    申请人： SAMEER Deshpande ,  Shou-Sung Chang ,  Hung Chih Chen ,  Roy C. Nangoy ,  Stan D. Tsai

    发明人： SAMEER Deshpande ,  Shou-Sung Chang ,  Hung Chih Chen ,  Roy C. Nangoy ,  Stan D. Tsai

    IPC分类号： B24B53/02

    CPC分类号： B24B49/18 ,  B24B37/005 ,  B24B49/16 ,  B24B53/017

    摘要： Polishing pads used in CMP machines are consumable components that are typically replaced after a specific number of wafers have been processed. The life of a polishing pad is optimized by controlling the rate of material removal from the polishing pad by the conditioning disk. The conditioning disk removes enough material so the polishing surface can properly process the wafers but does not remove any excess material. Preventing excess material removal extends the life of the polishing pad. During CMP processing, the controller receives data concerning the torque applied to the conditioning disk and the torque applied to the arm to sweep the conditioning disk across the polishing pad. Based upon the detected operating conditions, the system can predict the rate of material removal and adjust the forces applied to the conditioning disk so that the life of the polishing pad is optimized.

    摘要翻译： 在CMP机器中使用的抛光垫是可消耗的部件，通常在处理特定数量的晶片之后被替换。 抛光垫的寿命通过控制由调节盘从抛光垫去除的材料的速率被优化。 调节盘移除足够的材料，因此抛光表面可以适当地处理晶片，但不会去除任何多余的材料。 防止多余的材料去除延长了抛光垫的寿命。 在CMP处理期间，控制器接收关于施加到调节盘的扭矩和施加到臂上的扭矩以扫掠经过抛光垫的调节盘的数据。 基于检测到的操作条件，系统可以预测材料去除速率并调节施加到调节盘的力，以便抛光垫的寿命被优化。

    MEASUREMENT OF PAD THICKNESS AND CONTROL OF CONDITIONING
    2.
    发明申请
    MEASUREMENT OF PAD THICKNESS AND CONTROL OF CONDITIONING 审中-公开
    垫厚度的测量和调节控制

    公开(公告)号：US20120270477A1

    公开(公告)日：2012-10-25

    申请号：US13092628

    申请日：2011-04-22

    申请人： Roy C. Nangoy ,  Hung Chih Chen ,  Shou-Sung Chang ,  Erik S. Rondum ,  Sameer Deshpande

    发明人： Roy C. Nangoy ,  Hung Chih Chen ,  Shou-Sung Chang ,  Erik S. Rondum ,  Sameer Deshpande

    IPC分类号： B24B53/02 ,  B24B1/00

    CPC分类号： B24B53/017 ,  B24B37/042 ,  B24B49/105 ,  B24B49/18 ,  G01B7/107

    摘要： A conditioning process includes rotating a polishing pad about an axis of rotation, conditioning the polishing pad by sweeping an abrasive disk in a path across a surface of the polishing pad between an inner radial distance from the axis of rotation and an outer radial distance from the axis of rotation, sweeping a sensor across the polishing pad while conditioning the polishing pad, measuring a thickness of the polishing pad at a plurality of positions between the inner radial distance and the outer radial distance with the sensor, and adjusting at least one of a dwell time or a pressure of the abrasive disk against the polishing pad for a portion of the path based on measurements of the thickness by the sensor such that the polishing pad wears to a more uniform thickness than without such adjustment.

    摘要翻译： 调节过程包括围绕旋转轴线旋转抛光垫，通过在距离旋转轴线的内径向距离和与旋转轴线的外径向距离之间的抛光垫的表面上的路径中扫掠研磨盘来调节抛光垫 旋转轴线，在调整抛光垫的同时扫过传感器，在传感器的内径向距离和外径向距离之间的多个位置处测量抛光垫的厚度，并调整至少一个 基于通过传感器的厚度的测量，研磨盘对于抛光垫的一部分的停留时间或压力抵达抛光垫，使得抛光垫比没有这种调节的磨损更均匀。

    APPARATUS AND METHODS FOR CONDITIONING A POLISHING PAD
    5.
    发明申请
    APPARATUS AND METHODS FOR CONDITIONING A POLISHING PAD 审中-公开
    用于调节抛光垫的装置和方法

    公开(公告)号：US20090036035A1

    公开(公告)日：2009-02-05

    申请号：US12245758

    申请日：2008-10-05

    申请人： Roy C. Nangoy ,  Shou-Sung Chang ,  Donald J.K. Olgado ,  Hung Chih Chen ,  Gerald John Alonzo

    发明人： Roy C. Nangoy ,  Shou-Sung Chang ,  Donald J.K. Olgado ,  Hung Chih Chen ,  Gerald John Alonzo

    IPC分类号： B24B1/00 ,  B24B7/00

    CPC分类号： B24B53/017 ,  B24B53/005 ,  B24B53/12

    摘要： Apparatus and methods for conditioning a polishing pad include a base, an arm pivotally coupled to the base and adapted to support a conditioning disk, and an actuator coupled to the base and the arm. The actuator is adapted to cause the arm to press the conditioning disk against the polishing pad with a linearly variable amount of force. A first force is produced with the actuator. The first force is scaled by a linearly variable amount to a second force that is applied to the polishing pad by a conditioning disk. Numerous other aspects are disclosed.

    摘要翻译： 用于调理抛光垫的装置和方法包括基座，枢转地联接到基座并适于支撑调节盘的臂以及联接到基座和臂的致动器。 致动器适于使臂以线性可变量的力将调节盘压靠抛光垫。 用致动器产生第一力。 第一力通过线性可变量被缩放到通过调节盘施加到抛光垫的第二力。 公开了许多其他方面。

    APPARATUS AND METHODS FOR CONDITIONING A POLISHING PAD
    7.
    发明申请
    APPARATUS AND METHODS FOR CONDITIONING A POLISHING PAD 审中-公开
    用于调节抛光垫的装置和方法

    公开(公告)号：US20070212983A1

    公开(公告)日：2007-09-13

    申请号：US11684969

    申请日：2007-03-12

    申请人： Roy C. Nangoy ,  Shou-Sung Chang ,  Donald J.K. Olgado ,  Hung Chih Chen ,  Gerald John Alonzo

    发明人： Roy C. Nangoy ,  Shou-Sung Chang ,  Donald J.K. Olgado ,  Hung Chih Chen ,  Gerald John Alonzo

    IPC分类号： B24B51/00 ,  B24B1/00 ,  B24B21/18

    CPC分类号： B24B53/017 ,  B24B53/005 ,  B24B53/12

    摘要： Apparatus and methods for conditioning a polishing pad include a base, an arm pivotally coupled to the base and adapted to support a conditioning disk, and an actuator coupled to the base and the arm. The actuator is adapted to cause the arm to press the conditioning disk against the polishing pad with a linearly variable amount of force. A first force is produced with the actuator. The first force is scaled by a linearly variable amount to a second force that is applied to the polishing pad by a conditioning disk. Numerous other aspects are disclosed.

    摘要翻译： 用于调理抛光垫的装置和方法包括基座，枢转地联接到基座并适于支撑调节盘的臂以及联接到基座和臂的致动器。 致动器适于使臂以线性可变量的力将调节盘压靠抛光垫。 用致动器产生第一力。 第一力通过线性可变量被缩放到通过调节盘施加到抛光垫的第二力。 公开了许多其他方面。

    Method and apparatus for fast gas exchange, fast gas switching, and programmable gas delivery
    9.
    发明授权
    Method and apparatus for fast gas exchange, fast gas switching, and programmable gas delivery 有权
    用于快速气体交换，快速气体切换和可编程气体输送的方法和装置

    公开(公告)号：US09305810B2

    公开(公告)日：2016-04-05

    申请号：US13456006

    申请日：2012-04-25

    申请人： Saravjeet Singh ,  Roy C. Nangoy

    发明人： Saravjeet Singh ,  Roy C. Nangoy

    IPC分类号： F17D1/00 ,  H01L21/67

    CPC分类号： H01L21/67017 ,  H01L21/6719 ,  Y10T137/0318 ,  Y10T137/87096

    摘要： Embodiments of the invention relate to a gas delivery system. The gas delivery system includes a fast gas exchange module in fluid communication with one or more gas panels and a process chamber. The fast gas exchange module has first and second sets of flow controllers and each of first and second sets of flow controllers has multiple flow controllers. The flow controller is configured such that each of the flow controllers in the first and second sets of the flow controllers is independently operated to selectively open to divert gas to the process chamber or an exhaust. The first and second sets of flow controllers are operated for synchronized switching of gases in a pre-determined timed sequence of flow controller actuation. The invention enables fast switch of resultant gas flow in the process chamber while having individual flow controller operated at lower switching speed to provide longer service life.

    摘要翻译： 本发明的实施例涉及一种气体输送系统。 气体输送系统包括与一个或多个气体板和处理室流体连通的快速气体交换模块。 快速气体交换模块具有第一和第二组流量控制器，并且第一和第二组流量控制器中的每一个具有多个流量控制器。 流量控制器被配置为使得第一和第二组流量控制器中的每个流量控制器被独立地操作以选择性地打开以将气体转移到处理室或排气口。 第一和第二组流量控制器用于以预定的流量控制器致动的定时顺序同步切换气体。 本发明能够在处理室中快速切换合成气流，同时具有以较低切换速度操作的各个流量控制器以提供更长的使用寿命。