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公开(公告)号：US11096286B2
公开(公告)日：2021-08-17
申请号：US16812640
申请日：2020-03-09
发明人： Jung Hyun Park , Yong Ho Baek , Jae Hoon Choi
摘要： There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.
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公开(公告)号：US10129982B2
公开(公告)日：2018-11-13
申请号：US14815868
申请日：2015-07-31
发明人： Jae Hoon Choi , Jung Hyun Park , Yong Ho Baek , Hea Sung Kim , Jung Hyun Cho , Il Jong Seo
摘要： An embedded board includes an insulating layer and an electronic device embedded in the insulating layer. A first circuit pattern is embedded to contact a bottom surface of the insulating layer, and a second circuit pattern protrudes from the bottom surface of the insulating layer. A via is bonded to the device and the second circuit pattern.
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公开(公告)号：US20150214466A1
公开(公告)日：2015-07-30
申请号：US14582182
申请日：2014-12-24
IPC分类号： H01L41/09 , H01L41/053
CPC分类号： H01L41/0973 , B06B1/0603 , B06B1/14 , G06F3/016 , H01L41/053
摘要： The vibration generating apparatus includes: a diaphragm formed of a metal; a piezoelectric plate mounted on at least one surface of the diaphragm; a fixed member coupled to the diaphragm along an outer circumference of the diaphragm to fix the diaphragm; and wherein the fixed member is formed of a material having a Young's modulus lower than that of steel.
摘要翻译： 振动发生装置包括：由金属制成的隔膜; 安装在隔膜的至少一个表面上的压电板; 固定构件，其沿着所述隔膜的外周耦合到所述隔膜以固定所述隔膜; 并且其中所述固定构件由具有低于钢的杨氏模量的材料形成。
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4.发明授权Method of manufacturing a ball grid array substrate or a semiconductor chip package 有权制造球栅阵列基板或半导体芯片封装的方法公开(公告)号：US08945993B2
公开(公告)日：2015-02-03
申请号：US14028837
申请日：2013-09-17
发明人： Jung Hyun Park , Nam Keun Oh , Sang Duck Kim , Jong Gyu Choi , Young Ji Kim , Ji Eun Kim , Myung Sam Kang
IPC分类号： H01L21/332 , H01L21/768 , H01L23/13 , H01L23/00 , H01L21/02 , H01L23/31
CPC分类号： H01L21/76885 , H01L21/02112 , H01L23/13 , H01L23/3128 , H01L24/48 , H01L24/97 , H01L2224/451 , H01L2224/48091 , H01L2224/4824 , H01L2224/48465 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H01L2924/12042 , H01L2924/15311 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A method of manufacturing a ball grid array substrate includes: forming a first circuit pattern and a second circuit pattern on a first metal carrier and a second metal carrier, respectively; stacking a first insulating layer and a second insulating layer with a separable material interposed therebetween, wherein each of the first and second insulating layers has first and second surfaces opposing each other, and the first surface contacts the separable material; burying the first and second circuit patterns in the second surfaces of the first and second insulating layers, respectively; removing the first and second metal carriers; removing the separable material to separate the first and second insulating layers from each other; and forming an opening in each of the first and second insulating layers to connect the first and second surfaces with each other. The method may also be part of a process for manufacturing a semiconductor package.
摘要翻译： 制造球栅阵列基板的方法包括：分别在第一金属载体和第二金属载体上形成第一电路图案和第二电路图案; 堆叠具有插入其间的可分离材料的第一绝缘层和第二绝缘层，其中第一和第二绝缘层中的每一个具有彼此相对的第一和第二表面，并且第一表面接触可分离材料; 将第一和第二电路图案分别埋在第一和第二绝缘层的第二表面中; 去除所述第一和第二金属载体; 去除可分离材料以将第一和第二绝缘层彼此分离; 以及在所述第一绝缘层和所述第二绝缘层的每一个中形成开口以将所述第一表面和所述第二表面彼此连接。 该方法也可以是用于制造半导体封装的工艺的一部分。
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公开(公告)号：US11487133B2
公开(公告)日：2022-11-01
申请号：US17201257
申请日：2021-03-15
发明人： Jung Hyun Park , Seok Cheon Lee
摘要： A camera module includes a housing, a carrier, a frame, a lens holder, an autofocusing (AF) ball bearing, and an optical image stabilization (OIS) ball bearing. The carrier is coupled to the housing and configured to move in an optical axis direction. The frame is coupled to the carrier and configured to move in a first axis direction, perpendicular to the optical axis direction. The lens holder is coupled to the frame and configured to move in a second axis direction, perpendicular to the optical axis and the first axis. The AF ball bearing is disposed between the housing and the carrier. The OIS ball bearing is disposed on either one or both of the carrier and the frame, and the frame and the lens holder. Either one or both of the AF ball bearing and the OIS ball bearing have an elastic modulus of 20 GPa or less.
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公开(公告)号：US10674608B2
公开(公告)日：2020-06-02
申请号：US16033427
申请日：2018-07-12
发明人： Jung Hyun Park , Yong Ho Baek , Jae Hoon Choi
摘要： There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.
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公开(公告)号：US09831415B2
公开(公告)日：2017-11-28
申请号：US14575701
申请日：2014-12-18
发明人： Dong Sun Park , Jung Hyun Park , Jong Woo Hong , Dong Woohn Kim
CPC分类号： H01L41/0933 , B06B1/0648 , B06B1/14
摘要： Embodiments of the invention provide a piezoelectric vibration module, including a vibration plate mounted with a piezoelectric element, which generates a vibration force in a vertical direction by being repeatedly expanded and contracted depending on external power applied thereto, and a lower case coupled with both ends of the vibration plate so as to be spaced apart from the vibration plate. The piezoelectric vibration module further includes a bar-shaped weight body increasing the vibration force of the piezoelectric element, and an elastic member interposed between the vibration plate and the weight body.
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公开(公告)号：US11812556B2
公开(公告)日：2023-11-07
申请号：US17374409
申请日：2021-07-13
发明人： Jung Hyun Park , Yong Ho Baek , Jae Hoon Choi
CPC分类号： H05K1/185 , H05K3/4682 , H05K2201/0195 , H05K2203/1469
摘要： There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.
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公开(公告)号：US10631411B2
公开(公告)日：2020-04-21
申请号：US16033427
申请日：2018-07-12
发明人： Jung Hyun Park , Yong Ho Baek , Jae Hoon Choi
摘要： There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.
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公开(公告)号：US10076038B2
公开(公告)日：2018-09-11
申请号：US14794632
申请日：2015-07-08
发明人： Jung Hyun Park , Yong Ho Baek , Jae Hoon Choi
CPC分类号： H05K1/185 , H05K3/4682 , H05K2201/0195 , H05K2203/1469
摘要： There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.
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