公开(公告)号：US20130161808A1

公开(公告)日：2013-06-27

申请号：US13724606

申请日：2012-12-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Min Sung Kim ,  Sang Duck Kim

IPC: H01L23/00

CPC classification number: H01L24/09 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/15311 ,  H01L2924/014

Abstract: Disclosed herein are a semiconductor package and a method of manufacturing the same. According to a preferred embodiment of the present invention, the semiconductor package includes: a first package having a first semiconductor element mounted on an upper portion thereof and at least one solder ball formed on a lower portion thereof; a second package stacked on the upper portion of the first package; and an interposer formed between the first package and the second package.

Abstract translation: 这里公开了一种半导体封装及其制造方法。 根据本发明的优选实施例，半导体封装包括：第一封装，其具有安装在其上部的第一半导体元件和形成在其下部的至少一个焊球; 第二包装，堆叠在第一包装的上部; 以及形成在第一封装和第二封装之间的插入件。

公开(公告)号：US08945993B2

公开(公告)日：2015-02-03

申请号：US14028837

申请日：2013-09-17

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jung Hyun Park ,  Nam Keun Oh ,  Sang Duck Kim ,  Jong Gyu Choi ,  Young Ji Kim ,  Ji Eun Kim ,  Myung Sam Kang

IPC: H01L21/332 ,  H01L21/768 ,  H01L23/13 ,  H01L23/00 ,  H01L21/02 ,  H01L23/31

CPC classification number: H01L21/76885 ,  H01L21/02112 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A method of manufacturing a ball grid array substrate includes: forming a first circuit pattern and a second circuit pattern on a first metal carrier and a second metal carrier, respectively; stacking a first insulating layer and a second insulating layer with a separable material interposed therebetween, wherein each of the first and second insulating layers has first and second surfaces opposing each other, and the first surface contacts the separable material; burying the first and second circuit patterns in the second surfaces of the first and second insulating layers, respectively; removing the first and second metal carriers; removing the separable material to separate the first and second insulating layers from each other; and forming an opening in each of the first and second insulating layers to connect the first and second surfaces with each other. The method may also be part of a process for manufacturing a semiconductor package.

Abstract translation: 制造球栅阵列基板的方法包括：分别在第一金属载体和第二金属载体上形成第一电路图案和第二电路图案; 堆叠具有插入其间的可分离材料的第一绝缘层和第二绝缘层，其中第一和第二绝缘层中的每一个具有彼此相对的第一和第二表面，并且第一表面接触可分离材料; 将第一和第二电路图案分别埋在第一和第二绝缘层的第二表面中; 去除所述第一和第二金属载体; 去除可分离材料以将第一和第二绝缘层彼此分离; 以及在所述第一绝缘层和所述第二绝缘层的每一个中形成开口以将所述第一表面和所述第二表面彼此连接。 该方法也可以是用于制造半导体封装的工艺的一部分。