公开(公告)号：US20180122553A1

公开(公告)日：2018-05-03

申请号：US15618585

申请日：2017-06-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Soo Yeol KIM ,  Jong Seok BAE ,  Se Woong PAENG

IPC: H01F27/28 ,  H01F41/04 ,  H01F41/12

Abstract: An inductor includes a body in which is disposed a coil connecting a plurality of coil patterns by a via. The via includes a first conductive layer and a second conductive layer disposed on the first conductive layer, and the via has an upper portion having a transverse cross-sectional area that is greater than a transverse cross-sectional area of a lower portion thereof. An interlayer contact area of coils may be increased, thereby improving electrical characteristics and connection reliability.

公开(公告)号：US20170200551A1

公开(公告)日：2017-07-13

申请号：US15276269

申请日：2016-09-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Se Woong PAENG ,  Soo Hyun LYOO ,  Jong Seok BAE

IPC: H01F27/28 ,  H01F41/04

CPC classification number: H01F41/041 ,  H01F17/0013 ,  H01F2017/002

Abstract: An inductor includes a body including a coil, the coil including a plurality of coil patterns connected by a via, is disposed, wherein the via includes a first conductive layer and a second conductive layer, formed on the first conductive layer, and the second conductive layer includes a conductive powder and an organic material.

公开(公告)号：US20180301277A1

公开(公告)日：2018-10-18

申请号：US15716579

申请日：2017-09-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Se Woong PAENG ,  Jong Seok BAE ,  Soo Yeol KIM

IPC: H01F27/29 ,  H01F41/04 ,  H01F41/10

Abstract: An inductor includes a body in which is disposed a coil formed as a plurality of coil patterns connected by one or more via(s). Each via includes a first conductive layer and a second conductive layer formed on the first conductive layer, and a distance between portions of coil patterns connected by the via in the body is greater than a distance between other portions of the coil patterns in the body. Methods of forming inductors having vias including first and second conductive layers are also provided.

公开(公告)号：US20140185254A1

公开(公告)日：2014-07-03

申请号：US13845020

申请日：2013-03-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jee Soo MOK ,  Jong Seok BAE ,  Soon Jin CHO ,  Duck Young MAENG

IPC: H05K1/02 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K3/28 ,  H01L21/563 ,  H01L23/3114 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/26175 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83104 ,  H01L2224/92225 ,  H01L2924/12042 ,  H05K3/3452 ,  H05K2201/09909 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Disclosed herein is a printed circuit board including: a base substrate in which a connection pad is formed; a solder resist layer formed on the base substrate and comprising a trench exposing a surface of the base substrate; and a dam formed on the solder resist layer and burying the inside of the trench.

Abstract translation: 这里公开了一种印刷电路板，包括：基底，其中形成连接垫; 阻焊层，形成在所述基底基板上并且包括暴露所述基底基板的表面的沟槽; 以及形成在阻焊层上并埋设沟槽内部的坝。