公开(公告)号：US20160249445A1

公开(公告)日：2016-08-25

申请号：US15050606

申请日：2016-02-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae-Hong MIN ,  Myung-Sam KANG ,  Jung-Han LEE ,  Young-Gwan KO

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0206 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0207 ,  H05K1/0218 ,  H05K1/111 ,  H05K1/181 ,  H05K1/183 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/0338 ,  H05K2201/066 ,  H05K2201/10416

Abstract: A circuit board is disclosed. In addition to insulating layers, the circuit board includes a structure for heat transfer that includes a first layer that is formed of graphite or graphene, a second layer that is formed of metallic material and disposed on one surface of the first layer, and a third layer that is formed of metallic material and disposed on the other surface of the first layer, and at least a portion of the structure for heat transfer is inserted into an insulation layer. Such a circuit board provides improved heat management. Also disclosed is a method of manufacturing the circuit board.

Abstract translation: 公开了一种电路板。 除了绝缘层之外，电路板还包括用于传热的结构，其包括由石墨或石墨烯形成的第一层，由金属材料形成并设置在第一层的一个表面上的第二层，以及第三层 层，其由金属材料形成并且设置在第一层的另一表面上，并且用于传热的结构的至少一部分插入绝缘层中。 这种电路板提供改进的热管理。 还公开了一种制造电路板的方法。

公开(公告)号：US20170079142A1

公开(公告)日：2017-03-16

申请号：US15078452

申请日：2016-03-23

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae-Ean LEE ,  Jung-Han LEE ,  Jin-Ho PARK ,  Jung-Hyun CHO ,  Yong-Ho BAEK

IPC: H05K1/18 ,  H05K3/00 ,  H05K1/09 ,  H05K3/46 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/183 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/10674 ,  H05K2203/308

Abstract: A printed circuit board and a manufacturing method thereof are provided. A printed circuit board may include a first insulating layer comprising a photosensitive material on a core layer, a second insulating layer comprising a material comprising a reinforcing material on the first insulating layer, and a cavity formed in the first insulating layer and the second insulating layer.

Abstract translation: 提供一种印刷电路板及其制造方法。 印刷电路板可以包括在芯层上包括感光材料的第一绝缘层，包括在第一绝缘层上包含增强材料的材料的第二绝缘层和形成在第一绝缘层和第二绝缘层中的空腔 。

公开(公告)号：US20160143132A1

公开(公告)日：2016-05-19

申请号：US14937625

申请日：2015-11-10

Applicant: Samsung Electro-Mechanics Co., Ltd

Inventor： Tae-Hong MIN ,  Myung-Sam KANG ,  Jung-Han LEE ,  Young-Gwan KO

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/18 ,  H05K1/11

CPC classification number: H05K1/0207 ,  H05K1/0272 ,  H05K3/002 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/064 ,  H05K2201/09136 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2203/1105 ,  H05K2203/1338 ,  H05K2203/1361 ,  H05K2203/1572 ,  H05K2203/308

Abstract: A circuit board includes: a core portion comprising a fluid path, the fluid path being open toward an outside of the circuit board to allow a fluid outside the circuit board to pass through the fluid path; and insulation layers disposed above and below the core portion.

Abstract translation: 电路板包括：芯部，包括流体路径，所述流体路径朝向所述电路板的外部开口，以允许所述电路板外部的流体通过所述流体路径; 以及设置在芯部上方和下方的绝缘层。

公开(公告)号：US20170251548A1

公开(公告)日：2017-08-31

申请号：US15594085

申请日：2017-05-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae-Hong MIN ,  Myung-Sam KANG ,  Jung-Han LEE ,  Young-Gwan KO

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0206 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0207 ,  H05K1/0218 ,  H05K1/111 ,  H05K1/181 ,  H05K1/183 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/0338 ,  H05K2201/066 ,  H05K2201/10416

Abstract: A circuit board is disclosed. In addition to insulating layers, the circuit board includes a structure for heat transfer that includes a first layer that is formed of graphite or graphene, a second layer that is formed of metallic material and disposed on one surface of the first layer, and a third layer that is formed of metallic material and disposed on the other surface of the first layer, and at least a portion of the structure for heat transfer is inserted into an insulation layer. Such a circuit board provides improved heat management. Also disclosed is a method of manufacturing the circuit board.

公开(公告)号：US20160192488A1

公开(公告)日：2016-06-30

申请号：US14962428

申请日：2015-12-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae-Hong MIN ,  Myung-Sam KANG ,  Jung-Han LEE ,  Young-Gwan KO

IPC: H05K1/11 ,  H05K3/00 ,  H05K1/02

CPC classification number: H05K1/115 ,  H05K1/0212 ,  H05K3/0017 ,  H05K3/0047 ,  H05K2201/09854 ,  H05K2201/10378

Abstract: Disclosed is a circuit board that includes a core portion having a first via disposed therein in the general shape of an hourglass. The circuit board implements a finer via that penetrates a core and improves heat dissipation performance. The circuit board includes a core portion including a first core and a second core made of a metallic material, the first core and the second core being disposed adjacent to each other, and a first via penetrating the core portion.

Abstract translation: 公开了一种电路板，其包括具有以沙漏的大致形状设置在其中的第一通孔的芯部。 电路板实现了更细的通孔，穿透芯体并提高散热性能。 电路板包括：芯部，包括第一芯和由金属材料制成的第二芯，第一芯和第二芯彼此相邻设置，第一通孔穿透芯部。