公开(公告)号：US20170073546A1

公开(公告)日：2017-03-16

申请号：US15261624

申请日：2016-09-09

申请人： Syed Taymur Ahmad ,  Bruce Acton

发明人： Syed Taymur Ahmad ,  Bruce Acton

IPC分类号： C09D183/04 ,  H05K7/14 ,  C09D133/16 ,  H04M1/02 ,  H04M1/18 ,  H05K3/28 ,  H05K1/03

CPC分类号： C09D183/04 ,  C09D133/16 ,  H01R12/716 ,  H05K1/0353 ,  H05K3/282 ,  H05K3/284 ,  H05K3/285 ,  H05K3/40 ,  H05K7/1427 ,  H05K2201/0162 ,  H05K2201/0187 ,  H05K2203/1173 ,  H05K2203/121 ,  H05K2203/1322 ,  H05K2203/1338 ,  H05K2203/1361 ,  H05K2203/1366 ,  H05K2203/1572

摘要： Methods for protecting an electronic device from contaminants by applying different polymeric materials to different vital components of a device are disclosed. In one embodiment, the method comprises applying a first polymer, such as an acrylic-based polymer, to one or more connectors and components located on the printed circuit board of the device. The method further comprises applying a second polymer, such as a silicone-based polymer, to different connectors and components on the printed circuit board. The method leads to different components being coated with a different polymers, without the need for multilayer coatings on any component. Electronic devices that are protected by such polymeric, hydrophobic coatings are also disclosed. Non-limiting examples of such devices include smart phones, computers, and gaming devices.

摘要翻译： 公开了通过将不同的聚合物材料施加到装置的不同重要部件来保护电子装置免受污染物的方法。 在一个实施例中，该方法包括将第一聚合物（例如基于丙烯酸的聚合物）施加到位于设备的印刷电路板上的一个或多个连接器和部件。 该方法还包括将第二聚合物（例如硅氧烷基聚合物）施加到印刷电路板上的不同连接器和部件上。 该方法导致不同的组分被不同的聚合物涂覆，而不需要任何组分上的多层涂层。 还公开了由这种聚合物疏水涂层保护的电子器件。 这种设备的非限制性示例包括智能电话，计算机和游戏设备。

公开(公告)号：US08691683B2

公开(公告)日：2014-04-08

申请号：US13046151

申请日：2011-03-11

申请人： Koichi Hirano ,  Seiji Karashima ,  Takashi Ichiryu ,  Yoshihiro Tomita ,  Seiichi Nakatani

发明人： Koichi Hirano ,  Seiji Karashima ,  Takashi Ichiryu ,  Yoshihiro Tomita ,  Seiichi Nakatani

IPC分类号： H01L21/56

CPC分类号： H01L21/563 ,  B23K35/0244 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/133 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83815 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/18161 ,  H01L2924/30105 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2203/1361 ,  Y02P70/613 ,  Y10T29/53178 ,  H01L2224/05599

摘要： [Means for Solving Problem] A semiconductor chip 20 having a plurality of electrode terminals 12 is held to oppose a circuit board 21 having a plurality of connection terminals 11 with a given gap provided therebetween, and the semiconductor chip 20 and the circuit board 21 in this state are dipped in a dipping bath 40 containing a melted resin 14 including melted solder particles for a given period of time. In this dipping process, the melted solder particles self-assemble between the connection terminals 11 of the circuit board 21 and the electrode terminals 12 of the semiconductor chip 20, so as to form connectors 22 between these terminals. Thereafter, the semiconductor chip 20 and the circuit board 21 are taken out of the dipping bath 40, and the melted resin 14 having permeated into the gap between the semiconductor chip 20 and the circuit board 21 is cured, so as to complete a flip-chip mounting body.

摘要翻译： 解决问题的手段具有多个电极端子12的半导体芯片20被保持为具有多个连接端子11的电路板21，其间设置有给定的间隙，半导体芯片20和电路板21 将该状态浸渍在包含熔融的焊料颗粒的熔融树脂14的浸渍浴40中一段给定的时间。 在该浸渍过程中，熔融的焊料颗粒自组装在电路板21的连接端子11和半导体芯片20的电极端子12之间，从而在这些端子之间形成连接器22。 此后，半导体芯片20和电路板21从浸渍浴40中取出，并且已经渗透到半导体芯片20和电路板21之间的间隙中的熔融树脂14固化， 芯片安装体。

公开(公告)号：US07752751B2

公开(公告)日：2010-07-13

申请号：US12058912

申请日：2008-03-31

申请人： Christopher James Kapusta ,  Donald Cunningham ,  Richard Joseph Saia

发明人： Christopher James Kapusta ,  Donald Cunningham ,  Richard Joseph Saia

IPC分类号： H01K3/10

CPC分类号： H05K9/0039 ,  C23C14/046 ,  H01L23/29 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/19105 ,  H05K1/0204 ,  H05K3/284 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/09872 ,  H05K2203/1311 ,  H05K2203/1361 ,  H05K2203/1366 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： A system and method for providing shielding to an electrical system is disclosed. A conformal shield is formed by applying a conformal insulating coating to an electrical system. A plurality of openings are formed in the insulating coating at desired locations and a first metallic layer is deposited over the insulating coating and in each of the plurality of openings, the first metallic layer being electrically connected with the circuit board at the desired locations. A second metallic layer is then deposited onto the first metallic layer to increase a thickness of the metallic layers.

摘要翻译： 公开了一种用于向电气系统提供屏蔽的系统和方法。 通过将适形绝缘涂层施加到电气系统来形成保形屏蔽。 在绝缘涂层中在所需位置处形成多个开口，并且第一金属层沉积在绝缘涂层上方，并且在多个开口中的每一个中，第一金属层在所需位置处与电路板电连接。 然后将第二金属层沉积到第一金属层上以增加金属层的厚度。

公开(公告)号：US20090140426A1

公开(公告)日：2009-06-04

申请号：US11965365

申请日：2007-12-27

申请人： Woong Sun LEE ,  Il Hwan CHO ,  Myung Geun PARK ,  Cheol Ho JOH ,  Eun Hye DO ,  Ki Young KIM ,  Ji Eun KIM ,  Jong Hyun NAM

发明人： Woong Sun LEE ,  Il Hwan CHO ,  Myung Geun PARK ,  Cheol Ho JOH ,  Eun Hye DO ,  Ki Young KIM ,  Ji Eun KIM ,  Jong Hyun NAM

IPC分类号： H01L23/48 ,  H01L21/02

CPC分类号： H01L23/49811 ,  H01L21/563 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81395 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12044 ,  H05K3/282 ,  H05K2201/10674 ,  H05K2203/0568 ,  H05K2203/1361 ,  H05K2203/1554 ,  H01L2924/00 ,  H01L2224/05599

摘要： A flip chip package includes a substrate and a semiconductor chip. The substrate includes a substrate body, a metal wiring having a terminal part some of which is disposed in the substrate body, a solder resist pattern formed on the substrate body with an opening for exposing the terminal part, and an organic anti-oxidation layer for covering the terminal part. The semiconductor chip has a bump formed through (e.g., penetrates) the organic anti-oxidation layer and is electrically connected to the terminal part. The present invention prevents oxidation of the terminal part and allows easy coupling of a bump of a semiconductor chip and the terminal part of the substrate, since an anti-oxidation layer including an organic matter is formed over a surface of a terminal part including copper which is easily oxidized.

摘要翻译： 倒装芯片封装包括衬底和半导体芯片。 基板包括基板主体，具有端子部分的金属布线，其中一部分设置在基板主体中，形成在基板主体上的阻焊图案具有用于暴露端子部分的开口，以及有机抗氧化层， 覆盖终端部分。 半导体芯片具有穿过（例如，穿透）有机抗氧化层并且电连接到端子部分的凸块。 本发明防止了端子部分的氧化，并且容易地将半导体芯片的凸起与基板的端子部分耦合，因为包括有机物的抗氧化层在包括铜的端子部分的表面上形成 容易氧化。

公开(公告)号：US20180311889A1

公开(公告)日：2018-11-01

申请号：US15770638

申请日：2016-10-25

申请人： EV Group E. Thallner GmbH

发明人： Gerald Mittendorfer

IPC分类号： B29C63/00 ,  B32B27/28 ,  B32B27/30

CPC分类号： B29C63/0013 ,  B29C2063/006 ,  B32B3/30 ,  B32B7/06 ,  B32B7/12 ,  B32B9/04 ,  B32B27/06 ,  B32B27/08 ,  B32B27/16 ,  B32B27/281 ,  B32B27/283 ,  B32B27/285 ,  B32B27/308 ,  B32B27/34 ,  B32B27/38 ,  B32B2250/44 ,  B32B2307/51 ,  B32B2307/714 ,  B32B2307/748 ,  B32B2457/14 ,  H01L23/3135 ,  H05K3/007 ,  H05K3/0079 ,  H05K3/0085 ,  H05K3/0097 ,  H05K2203/0769 ,  H05K2203/1361 ,  H05K2203/1366 ,  H05K2203/1383 ,  H05K2203/1545 ,  H05K2203/1563

摘要： A method for treating a substrate having millimeter and/or micrometer and/or nanometer structures. The method includes applying at least one protective material to the structures, wherein the at least one protective material can be dissolved in a solvent, and the structures are produced by an imprinting process.

公开(公告)号：US20140216784A1

公开(公告)日：2014-08-07

申请号：US13757913

申请日：2013-02-04

申请人： Yongcai Wang ,  Paul Matthew Hoderlein ,  John Andrew Lebens ,  Hwei-Ling Yau ,  David Paul Trauernicht

发明人： Yongcai Wang ,  Paul Matthew Hoderlein ,  John Andrew Lebens ,  Hwei-Ling Yau ,  David Paul Trauernicht

IPC分类号： H05K1/02

CPC分类号： C09D11/52 ,  C09D11/322 ,  H05K1/097 ,  H05K3/1258 ,  H05K2201/09036 ,  H05K2201/09681 ,  H05K2203/1361

摘要： A method of making a conductive article includes providing a substrate having a surface with one or more micro-channels having a width of less than 12 μm. A composition is provided over the substrate and in the one or more micro-channels. The composition includes water and silver nanoparticles dispersed in the water and he weight percentage of silver in the composition is greater than 70% and the viscosity of the composition is in a range from 10 to 10,000 centipoise. The composition is removed from the surface of the substrate. The composition provided in the micro-channels is dried and converted to form one or more electrically conductive micro-wires.

摘要翻译： 制造导电制品的方法包括提供具有一个或多个宽度小于12μm的微通道的表面的基底。 组合物提供在衬底上和在一个或多个微通道中。 组合物包括分散在水中的水和银纳米颗粒，组合物中银的重量百分数大于70％，组合物的粘度在10至10,000厘泊的范围内。 从基材的表面除去组合物。 提供在微通道中的组合物被干燥并转化成一个或多个导电微细线。

公开(公告)号：US08544713B2

公开(公告)日：2013-10-01

申请号：US12646777

申请日：2009-12-23

申请人： Issaku Sato ,  Akira Takaguchi

发明人： Issaku Sato ,  Akira Takaguchi

IPC分类号： B23K1/20

CPC分类号： B23K3/082 ,  B23K1/0016 ,  B23K1/203 ,  B23K3/087 ,  B23K2101/42 ,  H05K3/3447 ,  H05K3/3489 ,  H05K2203/0763 ,  H05K2203/1361

摘要： An apparatus coats flux on a projection of a part mounted on a printed circuit board. The projection passes through the printed circuit board and projects from the printed circuit board. The apparatus contains a printed-circuit-board-holding member that holds the printed circuit board, a nozzle having an opening through which the projection comes in the nozzle and comes off the nozzle, a nozzle-moving member that moves the nozzle to a predetermined position, and a flux-supplying member that supplies the flux to the nozzle. The flux is coated on at least the projection by dipping the projection in the flux contained in the nozzle through the opening.

摘要翻译： 一种装置在安装在印刷电路板上的部件的突起上涂覆通量。 投影通过印刷电路板并从印刷电路板突出。 该装置包括保持印刷电路板的印刷电路板保持部件，具有突起从喷嘴离开喷嘴的开口的喷嘴，将喷嘴移动到预定的喷嘴移动部件， 位置，以及向焊嘴供给焊剂的焊剂供给部件。 通过将突起浸入通过开口的喷嘴中所含的焊剂中，将焊剂至少涂覆在突起上。

公开(公告)号：US20110256363A1

公开(公告)日：2011-10-20

申请号：US13141988

申请日：2009-12-08

申请人： Masataka Satou

发明人： Masataka Satou

IPC分类号： B32B3/10 ,  H05K3/06 ,  B32B15/04 ,  B32B5/00 ,  B05D5/12

CPC分类号： H05K3/387 ,  H05K3/064 ,  H05K3/067 ,  H05K2201/0191 ,  H05K2203/0709 ,  H05K2203/1361 ,  H05K2203/1366 ,  Y10T428/12451 ,  Y10T428/12472 ,  Y10T428/24917 ,  Y10T428/265 ,  Y10T428/31678

摘要： A surface metal film material including, in this order, a substrate, a polymer layer that receives a plating catalyst or a precursor thereof, and a metal film formed by plating, wherein, when x μm represents surface roughness (Ra) at the interface between the substrate and the polymer layer, and y μm represents surface roughness (Ra) at the interface between the polymer layer and the metal film, x>y and 5 μm>x>0.1 μm, and wherein, when T μm represents a thickness of the polymer layer, T and x satisfy the relationship 2x≦T.

摘要翻译： 一种表面金属膜材料，其依次包括基板，接收电镀催化剂或其前体的聚合物层和通过电镀形成的金属膜，其中当x m表示在电镀之前的界面处的表面粗糙度（Ra） 基板和聚合物层，y m表示聚合物层和金属膜之间的界面处的表面粗糙度（Ra），x> y且5μm> x>0.1μm，并且其中，当Tμm表示 聚合物层T和x满足关系2x＆nlE; T。

公开(公告)号：US20170086312A1

公开(公告)日：2017-03-23

申请号：US15268373

申请日：2016-09-16

申请人： Syed Taymur Ahmad ,  Bruce Acton

发明人： Syed Taymur Ahmad ,  Bruce Acton

IPC分类号： H05K5/00 ,  G06F1/16 ,  H04B1/3888 ,  H05K3/28

CPC分类号： H04B1/3888 ,  G06F1/1616 ,  G06F1/1626 ,  H05K3/28 ,  H05K3/284 ,  H05K2201/015 ,  H05K2201/0162 ,  H05K2201/09872 ,  H05K2203/1361 ,  H05K2203/1366

摘要： Methods for protecting an electronic device from contaminants by applying different polymeric materials to different vital components of a device are disclosed. In one embodiment, the method comprises applying an electrically insulating polymer, such as an acrylic-based polymer, to one or more connectors and components located on the printed circuit board of the device. The method further comprises applying a polymer capable of carrying a charge, such as a silicone-based polymer, to different connectors and components on the printed circuit board. The method leads to different components being coated with a different polymers. Electronic devices that are protected by such polymeric, hydrophobic coatings are also disclosed, such as smart phones, computers, and gaming devices.

公开(公告)号：US09328253B2

公开(公告)日：2016-05-03

申请号：US13757913

申请日：2013-02-04

申请人： Yongcai Wang ,  Paul Matthew Hoderlein ,  John Andrew Lebens ,  Hwei-Ling Yau ,  David Paul Trauernicht

发明人： Yongcai Wang ,  Paul Matthew Hoderlein ,  John Andrew Lebens ,  Hwei-Ling Yau ,  David Paul Trauernicht

IPC分类号： H05K3/02 ,  C09D11/52 ,  H05K1/09 ,  H05K3/12 ,  C09D11/322

CPC分类号： C09D11/52 ,  C09D11/322 ,  H05K1/097 ,  H05K3/1258 ,  H05K2201/09036 ,  H05K2201/09681 ,  H05K2203/1361

摘要： A method of making a conductive article includes providing a substrate having a surface with one or more micro-channels having a width of less than 12 μm. A composition is provided over the substrate and in the one or more micro-channels. The composition includes water and silver nanoparticles dispersed in the water and he weight percentage of silver in the composition is greater than 70% and the viscosity of the composition is in a range from 10 to 10,000 centipoise. The composition is removed from the surface of the substrate. The composition provided in the micro-channels is dried and converted to form one or more electrically conductive micro-wires.

摘要翻译： 制造导电制品的方法包括提供具有一个或多个宽度小于12μm的微通道的表面的基底。 组合物提供在衬底上和在一个或多个微通道中。 组合物包括分散在水中的水和银纳米颗粒，组合物中银的重量百分数大于70％，组合物的粘度在10至10,000厘泊的范围内。 从基材的表面除去组合物。 提供在微通道中的组合物被干燥并转化成一个或多个导电微细线。