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公开(公告)号：US20190139876A1
公开(公告)日：2019-05-09
申请号：US15988541
申请日：2018-05-24
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jeong Il LEE , Jeong Ho LEE , Jin Su KIM , Bong Ju CHO
IPC: H01L23/498 , H01L23/00 , H01L21/48
Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion having a stopper layer; a semiconductor chip having connection pads and disposed in the recess portion so that an inactive surface is connected to the stopper layer; first metal bumps disposed on the connection pads; second metal bumps disposed on an uppermost wiring layer of the wiring layers; an encapsulant covering at least portions of each of the frame, the semiconductor chip, and the first and second metal bumps and filling at least portions of the recess portion; and a connection member disposed on the frame and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads and the uppermost wiring layer through the first and second metal bumps.
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公开(公告)号：US20170179919A1
公开(公告)日：2017-06-22
申请号：US15073851
申请日：2016-03-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jeong Suong YANG , Jeong Il LEE , Yun Sung KANG , Kwang Su KIM , Pil Joong KANG
CPC classification number: H03H9/02007 , H03H3/02 , H03H9/0504 , H03H9/1014 , H03H9/17 , H03H9/173
Abstract: An acoustic resonator and a method of manufacturing the same are provided. An acoustic resonator includes a resonating part disposed on a substrate, a cap accommodating the resonating part and bonded to the substrate, and a bonded part bonding the cap and the substrate to each other, the bonding part including at least one block disposed between a bonding surface of the cap and a bonding surface of the substrate to block a leakage of a bonding material that forms the bonded part during a bonding operation.
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公开(公告)号：US20170237410A1
公开(公告)日：2017-08-17
申请号：US15271646
申请日：2016-09-21
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Yun Sung KANG , Ji Hye NAM , Kwang Su KIM , Pil Joong KANG , Jeong Il LEE
CPC classification number: H03H9/54 , H01L41/29 , H03H9/1014 , H03H9/1064 , H03H9/64
Abstract: An acoustic wave filter device includes a base comprising an acoustic wave filter part formed on one surface thereof and including a bonding part formed to surround the acoustic wave filter part, and a cap including a depression groove formed therein and a bonding counterpart formed to correspond to the bonding part. The depression groove is positioned over the acoustic wave filter part. The bonding part and the bonding counterpart receive a voltage to deform and bond the bonding part and the bonding counterpart to each other.
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公开(公告)号：US20190131270A1
公开(公告)日：2019-05-02
申请号：US15988647
申请日：2018-05-24
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jeong Ho LEE , Bong Ju CHO , Young Gwan KO , Jin Su KIM , Shang Hoon SEO , Jeong Il LEE
IPC: H01L23/00 , H01L21/48 , H01L21/56 , H01L23/498 , H01L23/31
Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion having a stopper layer; a semiconductor chip having connection pads, an active surface on which the connection pads are disposed, and an inactive surface opposing the active surface, and disposed in the recess portion so that the inactive surface is connected to the stopper layer; an encapsulant covering at least portions of the semiconductor chip and filling at least portions of the recess portion; and a connection member disposed on the frame and the active surface of the semiconductor chip and including a redistribution layer electrically connecting the wiring layers of the frame and the connection pads of the semiconductor chip to each other, wherein the stopper layer includes an insulating material.
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公开(公告)号：US20170230032A1
公开(公告)日：2017-08-10
申请号：US15276986
申请日：2016-09-27
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Yun Sung KANG , Pil Joong KANG , Kwang Su KIM , Ji Hye NAM , Jeong Suong YANG , Jeong Il LEE , Jong Hyeong SONG
CPC classification number: H03H9/56 , H03H3/02 , H03H3/08 , H03H9/1014 , H03H9/1071 , H03H9/64
Abstract: An acoustic wave filter device includes a base having an acoustic wave filter part and a bonding part disposed thereon, the bonding part surrounding the acoustic wave filter part, and a cap having a bonding counterpart disposed thereon, the bonding counterpart being bonded to the bonding part of the base, and the bonding part includes a first bonding layer including gold, and the bonding counterpart includes a second bonding layer bonded to the first bonding layer and including tin.
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Patent Agency Ranking
公开(公告)号：US20190172781A1
公开(公告)日：2019-06-06
申请号：US15988893
申请日：2018-05-24
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jeong Il LEE , Jeong Ho LEE , Jin Su KIM , Bong Ju CHO
IPC: H01L23/498 , H01L23/00 , H01L23/495
Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers disposed on the insulating layers, and connection via layers penetrating through the insulating layers and electrically connecting the wiring layers to each other, and having a recess portion; a semiconductor chip having connection pads and disposed in the recess portion so that an inactive surface is connected to the stopper layer; an encapsulant covering at least portions of the semiconductor chip and filling at least portions of the recess portion; and a connection member disposed on the frame and an active surface of the semiconductor chip and including one or more redistribution layers electrically connecting the wiring layers and the connection pads to each other, in which the recess portion includes walls having different inclined angles.
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公开(公告)号：US20170271573A1
公开(公告)日：2017-09-21
申请号：US15272618
申请日：2016-09-22
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Pil Joong KANG , Kwang Su KIM , Jeong Il LEE , Jong Hyeong SONG , Hyun Kee LEE , Yun Sung KANG , Seung Joo SHIN , Jeong Suong YANG
IPC: H01L41/053 , H03H9/54 , H03H9/17
Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, a cap enclosing the element, a bonding portion bonding the substrate to the cap, and blocking portions disposed on both sides of the bonding portion.
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公开(公告)号：US20170271222A1
公开(公告)日：2017-09-21
申请号：US15275603
申请日：2016-09-26
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Pil Joong KANG , Kwang Su KIM , Ji Hye NAM , Jeong Il LEE , Jong Hyeong SONG , Yun Sung KANG , Seung Joo SHIN , Nam Jung LEE
CPC classification number: H01L23/10 , H01L21/4817 , H01L23/055 , H01L23/13 , H01L23/49816 , H01L23/49827 , H03H3/02 , H03H9/02007 , H03H9/1014 , H03H9/13 , H03H2003/021
Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.
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公开(公告)号：US20190131226A1
公开(公告)日：2019-05-02
申请号：US15978727
申请日：2018-05-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jeong Ho LEE , Myung Sam KANG , Young Gwan KO , Jin Su KIM , Shang Hoon SEO , Jeong Il LEE
IPC: H01L23/498 , H01L23/00 , H01L23/31
CPC classification number: H01L23/49822 , H01L23/3157 , H01L23/49811 , H01L24/09 , H01L24/19 , H01L24/20 , H01L24/32 , H01L2224/02375 , H01L2224/02377 , H01L2224/0401 , H01L2224/18 , H01L2224/221 , H01L2224/32225 , H01L2224/73267 , H01L2924/15153 , H01L2924/15311 , H01L2924/18161 , H01L2924/3511 , H05K1/185 , H01L2924/0001
Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion and a stopper layer disposed on a bottom surface of the recess portion; a semiconductor chip disposed in the recess portion, and having connection pads, an active surface on which the connection pads are disposed, and an inactive surface opposing the active surface and disposed on the stopper layer; an encapsulant covering at least portions of the semiconductor chip and filling at least portions of the recess portion; and a connection member disposed on the frame and the active surface of the semiconductor chip and including a redistribution layer electrically connecting the plurality of wiring layers of the frame and the connection pads of the semiconductor chip to each other. The active surface of the semiconductor chip and an upper surface of the encapsulant have a step portion therebetween.
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公开(公告)号：US20180068915A1
公开(公告)日：2018-03-08
申请号：US15807805
申请日：2017-11-09
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Pil Joong KANG , Kwang Su KIM , Ji Hye NAM , Jeong Il LEE , Jong Hyeong SONG , Yun Sung KANG , Seung Joo SHIN , Nam Jung LEE
CPC classification number: H01L23/10 , H01L21/4817 , H01L23/055 , H01L23/13 , H01L23/49816 , H01L23/49827 , H03H3/02 , H03H9/02007 , H03H9/1014 , H03H9/13 , H03H2003/021
Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.
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