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    Electronic device with radio-frequency module
    3.
    发明授权
    Electronic device with radio-frequency module 有权

    公开(公告)号：US11335991B2

    公开(公告)日：2022-05-17

    申请号：US16937981

    申请日：2020-07-24

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Hak Gu Kim ,  Young Sik Hur ,  Yoo Sam Na ,  Won Gi Kim ,  Young Bal Kim ,  Soo Ki Choi ,  Ho Kyung Kang ,  Young Kyoon Im ,  Seong Jong Cheon

    IPC: H01Q1/22 ,  H01Q1/08 ,  H01Q21/28 ,  H04B1/16 ,  H04B1/04

    Abstract: A radio-frequency device includes a radio-frequency module. The radio-frequency module includes a first substrate, a second substrate, a radio-frequency integrated circuit (RFIC), a front-end integrated circuit (FEIC), and a flexible substrate. The RFIC has at least a portion surrounded by a first core member and is configured to input or output a base signal and a first radio-frequency (RF) signal having a frequency higher than a frequency of the base signal. The FEIC has at least a portion surrounded by a second core member and is configured to input or output the first RF signal and a second RF signal having a power different from a power of the first RF signal. The flexible substrate is configured to connect the first and second substrates to each other, provide a transmission path for the first RF signal, and being more flexible than the first and second substrates.

    Fan-out semiconductor package module
    4.
    发明授权
    Fan-out semiconductor package module 有权

    公开(公告)号：US10249601B2

    公开(公告)日：2019-04-02

    申请号：US15928745

    申请日：2018-03-22

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Won Gi Kim

    IPC: H01L25/10 ,  H01L23/367 ,  H01L23/66 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L23/13

    Abstract: A fan-out semiconductor package includes a first connection member having a through-hole, a semiconductor chip with connection pads on its active surface disposed in the through-hole and a first encapsulant encapsulating at least portions of the first connection member and the semiconductor chip. A second connection member is disposed below the first connection member and the semiconductor chip. A first heat dissipation member is formed in the first connection member. A component package is disposed on the fan-out semiconductor package and includes a wiring substrate connected to the first connection member through connection terminals, electronic components disposed on the wiring substrate, a second encapsulant encapsulating at least portions of the electronic components, and a second heat dissipation member formed in the wiring substrate. At least one of the electronic components is connected to the first heat dissipation member through the second heat dissipation member.

    Radio frequency module
    6.
    发明授权
    Radio frequency module 有权

    公开(公告)号：US11380633B2

    公开(公告)日：2022-07-05

    申请号：US15930734

    申请日：2020-05-13

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Myeong Woo Han ,  Young Sik Hur ,  Won Gi Kim ,  Soo Ki Choi

    IPC: H01L23/34 ,  H01L23/66 ,  H01L23/498 ,  H01Q1/38 ,  H01Q21/00 ,  H01Q21/06 ,  H01L23/00 ,  H01Q9/04 ,  H01Q1/22

    Abstract: A radio frequency module includes a radio frequency integrated circuit (RFIC) to input or output a base signal and a radio frequency (RF) signal having a higher frequency than the base signal, a wiring via extending upward from the RFIC and a feed line electrically connected to the wiring via to provide a transmission path of the RF signal, a second ground layer surrounding the feed line, a first ground layer spaced above the second ground layer, a third ground layer between the second ground layer and the RFIC, a feed-line insulating layer disposed between the first and third ground layers, an IC wiring layer between the third ground layer and the RFIC, electrically connected to the RFIC, and providing a transmission path of the base signal, and an IC insulating layer between the third ground layer and the RFIC, having a higher dielectric constant than the feed-line insulating layer.

    Electronic device and rigid-flexible substrate module
    7.
    发明授权
    Electronic device and rigid-flexible substrate module 有权

    公开(公告)号：US10912204B2

    公开(公告)日：2021-02-02

    申请号：US16180104

    申请日：2018-11-05

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Won Gi Kim

    IPC: H05K1/09 ,  H05K3/46 ,  H05K1/03 ,  H05K1/02 ,  B32B9/00 ,  B32B9/04 ,  B32B15/20 ,  H05K7/20 ,  H05K9/00

    Abstract: An electronic device and rigid-flexible substrate module includes a rigid-flexible substrate having a first region and a second region more flexible than the first region and having a first laterally extended region extending in a first lateral direction further than the first region, an integrated circuit (IC) disposed in a position lower than a position of the first region of the rigid-flexible substrate, a signal line electrically connected to the IC and extending to a lateral end of the second region of the rigid-flexible substrate, and a first heat dissipation ground layer including a first portion that overlaps the first region when viewed in a vertical direction, and a second portion different from the portion that overlaps the first laterally extended region when viewed in a vertical direction.

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