公开(公告)号：US09392697B2

公开(公告)日：2016-07-12

申请号：US14327713

申请日：2014-07-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin O Yoo

IPC: H05K1/11 ,  H05K1/18 ,  H01L25/00

CPC classification number: H05K1/185 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/81 ,  H01L24/96 ,  H01L25/00 ,  H01L25/50 ,  H01L2224/1146 ,  H01L2224/12105 ,  H01L2224/13005 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13186 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2924/01018 ,  H01L2924/19105 ,  H05K1/0296 ,  H05K1/11 ,  H05K3/3473 ,  H05K2203/1461

Abstract: A method of manufacturing a package may include forming a package module by disposing a plurality of components on an insulating plate filled with a viscous insulating liquid and curing the viscous insulating liquid, exposing at least portions of terminals of the plurality of components by polishing the insulating plate to have a predetermined thickness and then etching at least one portion of the insulating plate, forming a conductive stud on the at least exposed portions of the terminals and cutting the package module into predetermined unit packages, and examining reliability of a printed circuit board and bonding the unit package to the printed circuit board having confirmed reliability using the conductive stud.

Abstract translation: 制造封装的方法可以包括通过在填充有粘性绝缘液体的绝缘板上设置多个部件并固化粘性绝缘液体来形成封装模块，通过抛光绝缘材料来暴露多个部件的端部的至少一部分 板以具有预定厚度，然后蚀刻绝缘板的至少一部分，在端子的至少暴露部分上形成导电柱，并将封装模块切割成预定单元封装，并且检查印刷电路板的可靠性和 使用导电柱将单元封装结合到具有确认可靠性的印刷电路板。

公开(公告)号：US20150173197A1

公开(公告)日：2015-06-18

申请号：US14453289

申请日：2014-08-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Suk Hyeon Cho ,  Yong Sam Lee ,  Jin O Yoo

IPC: H05K1/18 ,  H05K3/10 ,  H05K3/00

CPC classification number: H05K1/185 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/255 ,  H01F41/046 ,  H05K3/4602 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49075

Abstract: A printed circuit board having an inductor embedded therein may include a conductive coil part embedded in an insulating layer; and a magnetic material part integrally formed so as to enclose a vicinity of the conductive coil part. In the printed circuit board having the inductor embedded therein, a gap between coils is narrowed and coils having a high height and a narrow width are formed, whereby resistance may be decreased and a higher inductance value may be implemented in a narrow area.

Abstract translation: 具有嵌入其中的电感器的印刷电路板可以包括嵌入在绝缘层中的导电线圈部分; 以及整体形成为包围导电线圈部分附近的磁性材料部分。 在具有嵌入其中的电感器的印刷电路板中，线圈之间的间隙变窄，并且形成具有高高度和窄宽度的线圈，从而可以减小电阻并且可以在较窄的区域中实现更高的电感值。

公开(公告)号：US12087510B2

公开(公告)日：2024-09-10

申请号：US17840000

申请日：2022-06-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hwi Dae Kim ,  Won Chul Sim ,  Taek Jung Lee ,  Jin O Yoo ,  Young Ghyu Ahn

IPC: H01G4/30 ,  C04B35/468 ,  C04B35/64 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232

CPC classification number: H01G4/30 ,  C04B35/468 ,  C04B35/64 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/232 ,  C04B2235/3206

Abstract: A multilayer capacitor includes a body including a dielectric layer and first and second internal electrodes stacked on each other and having the dielectric layer interposed therebetween; a pair of first external electrodes respectively disposed on first and second corners of the body, which are not adjacent to each other, and connected to the first internal electrode; a pair of second external electrodes respectively disposed on third and fourth corners of the body, which are not adjacent to each other, and connected to the second internal electrode; and a reinforcing portion disposed on a surface of the body, not covered by at least one of the first and second external electrodes, and including a sintered ceramic body.

公开(公告)号：US09793223B2

公开(公告)日：2017-10-17

申请号：US15275853

申请日：2016-09-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin O Yoo

IPC: H01L23/31 ,  H01L23/552 ,  H01L25/065 ,  H05K9/00 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/315 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/19105 ,  H05K9/0024

Abstract: There are provided a semiconductor package and a method of manufacturing the same. The semiconductor package includes: a substrate having a ground electrode formed on one surface thereof; at least one electronic component mounted on one surface of the substrate; an insulation layer including an exposed part exposing the ground electrode and a cover part covering the electronic component; and a shielding layer electrically connected to the ground electrode and covering the insulation layer.

公开(公告)号：US20240055186A1

公开(公告)日：2024-02-15

申请号：US18142682

申请日：2023-05-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ghyu Ahn ,  Hwi Dae Kim ,  Jin O Yoo

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/12

Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers disposed in a first direction, a plurality of first internal electrodes disposed in the first direction, and a plurality of second internal electrodes disposed in the first direction. At least a portion of the plurality of first internal electrodes and the plurality of second internal electrodes are spaced apart from each other on a same dielectric layer among the plurality of dielectric layers to have a gap, and among at least three gaps adjacent in the first direction, a gap having a greater distance in the first direction from a reference of the body in the first direction has a greater distance in one direction from a reference of the body in the one direction.

公开(公告)号：US20230091278A1

公开(公告)日：2023-03-23

申请号：US17840000

申请日：2022-06-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hwi Dae Kim ,  Won Chul Sim ,  Taek Jung Lee ,  Jin O Yoo ,  Young Ghyu Ahn

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/012 ,  C04B35/468 ,  C04B35/64 ,  H01G4/008 ,  H01G4/232

Abstract: A multilayer capacitor includes a body including a dielectric layer and first and second internal electrodes stacked on each other and having the dielectric layer interposed therebetween; a pair of first external electrodes respectively disposed on first and second corners of the body, which are not adjacent to each other, and connected to the first internal electrode; a pair of second external electrodes respectively disposed on third and fourth corners of the body, which are not adjacent to each other, and connected to the second internal electrode; and a reinforcing portion disposed on a surface of the body, not covered by at least one of the first and second external electrodes, and including a sintered ceramic body.