公开(公告)号：US20240145417A1

公开(公告)日：2024-05-02

申请号：US18205721

申请日：2023-06-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyeongwoo JIN ,  Myoungchul EUM

IPC: H01L23/00 ,  H01L25/18 ,  H10B80/00

CPC classification number: H01L24/10 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/18 ,  H10B80/00 ,  H01L2224/02175 ,  H01L2224/0219 ,  H01L2224/03002 ,  H01L2224/0382 ,  H01L2224/05555 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/06181 ,  H01L2224/10145 ,  H01L2224/10175 ,  H01L2224/11002 ,  H01L2224/1182 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/27002 ,  H01L2224/27618 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81005 ,  H01L2224/81203 ,  H01L2224/83005 ,  H01L2224/83203 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/014 ,  H01L2924/05442 ,  H01L2924/0665

Abstract: A semiconductor package and a method of fabricating the same. The semiconductor package includes a lower structure including a first lower conductive pad disposed on an upper surface thereof, a first semiconductor chip disposed on the lower structure, the first semiconductor chip including a first chip conductive pad disposed on a lower surface thereof, a solder ball connecting the first lower conductive pad and the first chip conductive pad, a photosensitive insulating layer filling a space between the lower structure and the first semiconductor chip, and a first organic insulating layer covering a side surface of the first chip conductive pad.