公开(公告)号：US20190055649A1

公开(公告)日：2019-02-21

申请号：US16030323

申请日：2018-07-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soyoung Lee ,  Hyunjae LEE ,  lk Soo KIM ,  Jang-Hee LEE

IPC: C23C16/455 ,  C23C16/44 ,  H01L21/02

Abstract: Provided are a precursor supply unit, a substrate processing system, and a method of fabricating a semiconductor device using the same. The precursor supply unit may include an outer container, an inner container provided in the outer container and used to store a precursor source, a gas injection line having an injection port, which is provided below the inner container and in the outer container and is used to provide a carrier gas into the outer container, and a gas exhaust line having an exhaust port, which is provided below the inner container and in the outer container and is used to exhaust the carrier gas in the outer container and a precursor produced from the precursor source.

公开(公告)号：US20170048648A1

公开(公告)日：2017-02-16

申请号：US15307612

申请日：2015-04-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae-Young LEE ,  Jae-Eun KANG ,  Han-Su KANG ,  Sung-ll PARK ,  Seong-Hee PARK ,  Bong-Jhin SHIN ,  Chil-Youl YANG ,  Myoung-Hwan LEE ,  Jang-Hee LEE ,  Chun-Ho LEE

IPC: H04W4/00 ,  G06F3/14 ,  H04L12/12

CPC classification number: H04W4/70 ,  G06F3/14 ,  H04B17/27 ,  H04B17/318 ,  H04L12/12 ,  H04L12/2809 ,  H04L12/282 ,  H04L67/125 ,  H04L67/16 ,  H04L67/18 ,  H04L67/36 ,  H04W4/023 ,  H04W4/029 ,  H04W4/08 ,  H04W4/80 ,  H04W52/0245 ,  Y02D70/1262 ,  Y02D70/142 ,  Y02D70/144 ,  Y02D70/162 ,  Y02D70/164 ,  Y02D70/166 ,  Y02D70/21 ,  Y02D70/26

Abstract: According to an embodiment of the present disclosure, a method for operating an electronic device includes displaying a result of recognizing at least one other electronic device as at least one item, and sending a message requesting the at least one other electronic device to output an identifiable signal.

Abstract translation: 根据本公开的实施例，一种用于操作电子设备的方法包括将至少一个其他电子设备识别为至少一个项目的结果，并且发送请求所述至少一个其他电子设备的消息以输出可识别的 信号。

公开(公告)号：US20140225251A1

公开(公告)日：2014-08-14

申请号：US14134043

申请日：2013-12-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jang-Hee LEE ,  Jongmin BAEK ,  Kyu-Hee HAN ,  Gilheyun CHOI ,  Jongwon HONG

IPC: H01L23/28 ,  H01L23/48

CPC classification number: H01L23/4821 ,  H01L21/764 ,  H01L21/7682 ,  H01L21/76832 ,  H01L21/76834 ,  H01L23/28 ,  H01L23/48 ,  H01L23/5222 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2924/0001

Abstract: Semiconductor devices, and methods of fabricating the same, include first conductive lines on a substrate, and a first molding layer covering the first conductive lines. The first conductive lines have air gaps between adjacent first conductive lines. Sidewalls of the first conductive lines and a bottom surface of the first molding layer collectively define a first gap region of each of the air gaps. The sidewalls of the first conductive lines and a top surface of the first molding layer collectively define a second air gap region of each of the air gaps.

Abstract translation: 半导体器件及其制造方法包括在基板上的第一导线和覆盖第一导线的第一成型层。 第一导线在相邻的第一导线之间具有气隙。 第一导电线的侧壁和第一模制层的底表面共同限定每个气隙的第一间隙区域。 第一导电线的侧壁和第一模制层的顶表面共同限定每个气隙的第二气隙区域。

公开(公告)号：US20200075324A1

公开(公告)日：2020-03-05

申请号：US16385441

申请日：2019-04-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kaoru YAMAMOTO ,  Chang-Hyun KIM ,  Hyun-Jae SONG ,  Keun-Wook SHIN ,  Hyeon-Jin SHIN ,  Sung-Joo AN ,  Chang-Seok LEE ,  Kee-Young JUN ,  Geun-O JEONG ,  Jang-Hee LEE

IPC: H01L21/02 ,  H01L21/67 ,  H01J37/32

Abstract: In a plasma deposition method, a substrate is loaded onto a substrate stage within a chamber. A first plasma is generated at a region separated from the substrate by a first distance. A first process gas is supplied to the first plasma region to perform a pre-treatment process on the substrate. A second plasma is generated at a region separated from the substrate by a second distance different from the first distance. A second process gas is supplied to the second plasma region to perform a deposition process on the substrate.

公开(公告)号：US20150327138A1

公开(公告)日：2015-11-12

申请号：US14707698

申请日：2015-05-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae-Young LEE ,  Jae-Eun KANG ,  Han-Su KANG ,  Sung-II PARK ,  Seong-Hee PARK ,  Bong-Jhin SHIN ,  Chil-Youl YANG ,  Myoung-Hwan LEE ,  Jang-Hee LEE ,  Chun-Ho LEE

IPC: H04W36/14 ,  H04W4/00

CPC classification number: H04W76/34 ,  H04W4/70 ,  H04W4/80 ,  H04W36/0027 ,  H04W36/14 ,  H04W36/18 ,  H04W36/36 ,  H04W76/15 ,  H04W84/12 ,  H04W84/18 ,  H04W88/06 ,  H04W92/18

Abstract: The present disclosure relates to a sensor network, Machine Type Communication (MTC), Machine-to-Machine (M2M) communication, and technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the above technologies, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An electronic device for and a method of performing wireless communication are provided. The electronic device includes a first module configured to transmit signals to another electronic device via a first type of link; a second module configured to transmit signals to the another electronic device via a second type of link; and a controller configured to establish the first type of link and release from the second type of link if a predetermined event occurs.

Abstract translation: 本公开涉及传感器网络，机器类型通信（MTC），机器对机器（M2M）通信和物联网技术（IoT）。 本发明可以应用于智能家居，智能建筑，智能城市，智能汽车，连接车，医疗保健，数字教育，智能零售，安全和安全服务等上述技术的智能化服务。 提供了一种用于执行无线通信的电子设备和方法。 电子设备包括：第一模块，被配置为经由第一类型的链路将信号发送到另一电子设备; 第二模块，被配置为经由第二类型的链路将信号发送到所述另一电子设备; 以及控制器，被配置为如果发生预定事件，则建立所述第一类型的链路并从所述第二类型的链路释放。

公开(公告)号：US20210292900A1

公开(公告)日：2021-09-23

申请号：US17333820

申请日：2021-05-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soyoung LEE ,  Hyunjae LEE ,  Ik Soo KIM ,  Jang-Hee LEE

IPC: C23C16/455 ,  H01L21/02 ,  C23C16/44 ,  C23C16/448

Abstract: Provided are a precursor supply unit, a substrate processing system, and a method of fabricating a semiconductor device using the same. The precursor supply unit may include an outer container, an inner container provided in the outer container and used to store a precursor source, a gas injection line having an injection port, which is provided below the inner container and in the outer container and is used to provide a carrier gas into the outer container, and a gas exhaust line having an exhaust port, which is provided below the inner container and in the outer container and is used to exhaust the carrier gas in the outer container and a precursor produced from the precursor source.

公开(公告)号：US20150365986A1

公开(公告)日：2015-12-17

申请号：US14742058

申请日：2015-06-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae-Young LEE ,  Jae-Eun KANG ,  Han-Su KANG ,  Sung-II PARK ,  Seong-Hee PARK ,  Bong-Jhin SHIN ,  Chil-Youl YANG ,  Myoung-Hwan LEE ,  Jang-Hee LEE ,  Chun-Ho LEE

IPC: H04W76/02 ,  H04W76/04 ,  H04W4/00 ,  H04B1/403 ,  H04W48/18 ,  H04W72/04

CPC classification number: H04W76/16 ,  H04B1/406 ,  H04B1/715 ,  H04B17/309 ,  H04B2001/7154 ,  H04W4/80 ,  H04W16/14 ,  H04W72/085 ,  H04W72/1215 ,  H04W72/1226 ,  H04W76/14 ,  H04W84/12 ,  H04W84/18 ,  H04W88/06

Abstract: The present disclosure relates to a sensor network, Machine Type Communication (MTC), Machine-to-Machine (M2M) communication, and technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the above technologies, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An electronic device, a method of an electronic device, and a method of a terminal apparatus are provided. The electronic device includes a first module configured to transmit/receive a signal through a first transmission interface, a second module configured to transmit/receive a signal through a second transmission interface, and a controller configured to set a channel for transmitting/receiving a signal to/from an other electronic device through the second transmission interface, based on a quality of at least one channel transmitting/receiving a signal to/from the other electronic device through the first transmission interface.

Abstract translation: 本公开涉及传感器网络，机器类型通信（MTC），机器对机器（M2M）通信和物联网技术（IoT）。 本发明可以应用于智能家居，智能建筑，智能城市，智能汽车，连接车，医疗保健，数字教育，智能零售，安全和安全服务等上述技术的智能化服务。 提供电子设备，电子设备的方法和终端设备的方法。 电子设备包括被配置为通过第一传输接口发送/接收信号的第一模块，被配置为通过第二传输接口发送/接收信号的第二模块，以及被配置为设置用于发送/接收信号的信道的控制器 基于通过第一传输接口向/从另一个电子设备发送/接收信号的至少一个信道的质量，通过第二传输接口传送到另一个电子设备/从其他电子设备。