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公开(公告)号：US20150041822A1
公开(公告)日：2015-02-12
申请号：US14452309
申请日：2014-08-05
发明人： Kyung Wook HWANG , Jae Hyeok HEO , Joong Kon SON
CPC分类号： H01L33/10 , H01L33/24 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor light emitting device includes a substrate, a reflective layer and a light emitting structure. The reflective layer includes at least two porous layers alternately disposed on the substrate and having different porosities. The light emitting structure is disposed on the reflective layer and includes a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer.
摘要翻译： 半导体发光器件包括衬底，反射层和发光结构。 反射层包括交替地设置在基底上并具有不同孔隙率的至少两个多孔层。 发光结构设置在反射层上，并且包括第一导电型半导体层，有源层和第二导电型半导体层。
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公开(公告)号：US20170084783A1
公开(公告)日：2017-03-23
申请号：US15365102
申请日：2016-11-30
发明人： Kyung Wook HWANG , Joong Kon SON
CPC分类号： H01L33/10 , H01L33/0025 , H01L33/007 , H01L33/12 , H01L33/24 , H01L33/32 , H01L33/42 , H01L33/46
摘要： A semiconductor light-emitting device includes a substrate, a first reflective layer disposed on the substrate and including first openings, a first conductivity-type semiconductor layer grown in and extending from the first openings and connected on the first reflective layer, a second reflective layer disposed on the first conductivity-type semiconductor layer and including second openings having lower surfaces disposed to be spaced apart from upper surfaces of the first openings, and a plurality of light-emitting nanostructures including nanocores extending from the second openings and formed of a first conductivity-type semiconductor material, and active layers and second conductivity-type semiconductor layers sequentially disposed on the nanocores.
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公开(公告)号：US20160056336A1
公开(公告)日：2016-02-25
申请号：US14662149
申请日：2015-03-18
发明人： Kyung Wook HWANG , Joong Kon SON
IPC分类号： H01L33/24
CPC分类号： H01L33/10 , H01L33/0025 , H01L33/007 , H01L33/12 , H01L33/24 , H01L33/32 , H01L33/42 , H01L33/46
摘要： A semiconductor light-emitting device includes a substrate, a first reflective layer disposed on the substrate and including first openings, a first conductivity-type semiconductor layer grown in and extending from the first openings and connected on the first reflective layer, a second reflective layer disposed on the first conductivity-type semiconductor layer and including second openings having lower surfaces disposed to be spaced apart from upper surfaces of the first openings, and a plurality of light-emitting nanostructures including nanocores extending from the second openings and formed of a first conductivity-type semiconductor material, and active layers and second conductivity-type semiconductor layers sequentially disposed on the nanocores.
摘要翻译： 一种半导体发光器件，包括衬底，设置在衬底上并包括第一开口的第一反射层，在第一开口上生长并延伸并连接在第一反射层上的第一导电型半导体层，第二反射层 设置在第一导电型半导体层上，并且包括具有设置成与第一开口的上表面间隔开的下表面的第二开口，以及多个发光纳米结构，包括从第二开口延伸并由第一导电性形成的纳米孔 型半导体材料，以及顺序地设置在纳米孔上的有源层和第二导电型半导体层。
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公开(公告)号：US20150364639A1
公开(公告)日：2015-12-17
申请号：US14602357
申请日：2015-01-22
发明人： Sung Mok HONG , Joong Kon SON
CPC分类号： H01L33/486 , H01L24/97 , H01L33/504 , H01L33/505 , H01L2224/16225 , H01L2933/0033 , H01L2933/0041
摘要： A method of manufacturing a semiconductor light emitting device package includes arranging a plurality of light emitting structures on a support substrate, each light emitting structure including a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer, bonding a light transmissive substrate to the plurality of light emitting structures, the light transmissive substrate having a plurality of wavelength conversion regions corresponding to the plurality of light emitting structures, respectively, removing the support substrate from the plurality of light emitting structures, and separating individual semiconductor light emitting device packages from one another by removing at least a portion of the light transmissive substrate.
摘要翻译： 制造半导体发光器件封装的方法包括在支撑衬底上布置多个发光结构，每个发光结构包括第一导电型半导体层，有源层和第二导电类型半导体层，将 所述透光基板具有分别对应于所述多个发光结构的多个波长转换区域，从所述多个发光结构中去除所述支撑基板，以及分离各个半导体光 通过去除透光性基板的至少一部分，来进行发光装置的封装。
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公开(公告)号：US20130170245A1
公开(公告)日：2013-07-04
申请号：US13731465
申请日：2012-12-31
发明人： Jong Pa HONG , Gwan Su LEE , Jin Hyuk SONG , Joong Kon SON
IPC分类号： F21V8/00
CPC分类号： G02B6/0001 , G02B6/001 , G02B6/0041 , G02B6/0046 , G02B6/0061 , G02B6/0075
摘要： A lighting device improves light distribution uniformity. When a light emitting diode (LED) package module is applied to a straight-tube fluorescent lamp, characteristics of a circular surface light source with the LED may be efficiently embodied by varying a refractive index of a light guide member based on positions of the light guide member.
摘要翻译： 照明装置改善了光分布均匀性。 当将发光二极管（LED）封装模块应用于直管荧光灯时，可以通过基于光的位置改变导光构件的折射率来有效地实现具有LED的圆形面光源的特性 导游会员
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