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公开(公告)号：US20140239328A1
公开(公告)日：2014-08-28
申请号：US14172408
申请日：2014-02-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sang-hyun LEE , Dong-hyuck KAM , Gam-han YONG , Jin-gi HONG , Seong-deok HWANG
CPC classification number: H01L33/62 , H01L27/153 , H01L33/46 , H01L33/502 , H01L33/505 , H01L33/54 , H01L33/58 , H01L33/60 , H01L2224/13 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H01L2924/0002 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
Abstract: The present application relates to a light emitting device package. The light emitting device package includes a package substrate in which a via hole is formed. An electrode layer extends to both surfaces of the package substrate after passing through the via hole. A light emitting device is arranged on the package substrate and is connected to the electrode layer. A fluorescence film includes a first part that fills at least a part of an internal space of the via hole and a second part that covers at least a part of the light emitting device.
Abstract translation: 本申请涉及发光器件封装。 发光器件封装包括其中形成有通孔的封装衬底。 电极层在通过通孔之后延伸到封装衬底的两个表面。 发光器件布置在封装衬底上并连接到电极层。 荧光膜包括填充通孔的内部空间的至少一部分的第一部分和覆盖发光器件的至少一部分的第二部分。
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公开(公告)号：US20140232293A1
公开(公告)日：2014-08-21
申请号：US14082991
申请日：2013-11-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dong-hyuck KAM , Gam-han YONG , Sang-hyun LEE , Seong-deok HWANG
CPC classification number: H01L33/62 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/83 , H01L24/97 , H01L33/08 , H01L33/54 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83385 , H01L2224/83805 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/0133 , H01L2924/12041 , H01L2924/12042 , H01L2924/15151 , H01L2924/181 , H01L2933/0066 , H05B33/0842 , H01L2224/45099 , H01L2924/0105 , H01L2924/01028 , H01L2924/01032 , H01L2924/01049 , H01L2924/01029 , H01L2924/01079 , H01L2924/01013 , H01L2924/01047 , H01L2924/00 , H01L2924/00012
Abstract: The present application provides a light-emitting device package. The light-emitting device package includes a package substrate includes at least one via hole. A light-emitting device is mounted on the package substrate so as to overlap with the via hole. A bonding layer is formed between the light-emitting device and the package substrate and includes a eutectic bonding material.
Abstract translation: 本发明提供一种发光装置封装。 发光器件封装包括包括至少一个通孔的封装衬底。 发光装置安装在封装基板上以与通孔重叠。 在发光器件和封装衬底之间形成结合层并且包括共晶接合材料。
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公开(公告)号：US20150255694A1
公开(公告)日：2015-09-10
申请号：US14716835
申请日：2015-05-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sang-hyun LEE , Dong-hyuck KAM , Gam-han YONG , Jin-gi HONG , Seong-deok HWANG
CPC classification number: H01L33/62 , H01L27/153 , H01L33/46 , H01L33/502 , H01L33/505 , H01L33/54 , H01L33/58 , H01L33/60 , H01L2224/13 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H01L2924/0002 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
Abstract: The present application relates to a light emitting device package. The light emitting device package includes a package substrate in which a via hole is formed. An electrode layer extends to both surfaces of the package substrate after passing through the via hole. A light emitting device is arranged on the package substrate and is connected to the electrode layer. A fluorescence film includes a first part that fills at least a part of an internal space of the via hole and a second part that covers at least a part of the light emitting device.
Abstract translation: 本申请涉及发光器件封装。 发光器件封装包括其中形成有通孔的封装衬底。 电极层在通过通孔之后延伸到封装衬底的两个表面。 发光器件布置在封装衬底上并连接到电极层。 荧光膜包括填充通孔的内部空间的至少一部分的第一部分和覆盖发光器件的至少一部分的第二部分。
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