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公开(公告)号：US20240318900A1
公开(公告)日：2024-09-26
申请号：US18732398
申请日：2024-06-03
发明人： Yonghyun KANG , Donghwa KIM , Hyoseok NOH , Sungcheul PARK , Seungmin LEE
IPC分类号： F25D23/06
CPC分类号： F25D23/064 , F25D23/065 , F25D2327/00
摘要： A refrigerator including: an inner case forming a storage compartment with an open front side and comprising a plurality of plates formed by injection molding; an outer case coupled to an outside of the inner case; and an insulation material between the inner case and the outer case. The plurality of plates includes an upper plate and a plurality of lateral plates coupled to the upper plate. The upper plate includes an upper plate body and an upper plate coupler. The each of the plurality of lateral plates includes a lateral plate body and a lateral plate coupler. The upper plate coupler includes an upward extension portion extending upward from the upper plate body and spaced from the lateral plate body. The inner case includes a groove recessed upward extending in a front and rear direction between the upward extension portion and the lateral plate body.
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2.发明公开公开(公告)号：US20230336970A1
公开(公告)日：2023-10-19
申请号：US18340410
申请日：2023-06-23
发明人： Sanghwi LEE , Youcheol MOON , Seungmin LEE
摘要： An electronic device is provided. The electronic device includes at least one processor and at least one embedded subscriber identity module (eSIM), wherein the at least one processor can be set to check an eSIM for testing among the at least one eSIM, obtain a profile for writing to the eSIM from a memory of the electronic device and/or an external device different from a SM-DP+ server, write the profile to the eSIM, activate the profile, perform an operation for associating, with the eSIM, a protocol stack corresponding to a port for testing among a plurality of ports associated with the at least one processor, perform a test operation using the profile and the protocol stack associated with the eSIM, upon completion of the performance of the test operation, deactivate the profile, and delete the profile.
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公开(公告)号：US20230217661A1
公开(公告)日：2023-07-06
申请号：US17961070
申请日：2022-10-06
发明人： Youngbum WOO , Joonsung LIM , Junhyoung KIM , Seungmin LEE
IPC分类号： H01L27/11573 , H01L27/11582 , H01L27/1157 , H01L23/528 , H01L23/522
CPC分类号： H01L27/11573 , H01L23/5226 , H01L23/5283 , H01L27/1157 , H01L27/11582
摘要： A semiconductor device includes a contact plug forming a signal path electrically connecting a bitline or wordlines and an upper connection pattern to each other, a lower insulating structure includes first and second insulating portions; the contact plug penetrates through the second insulating portion and contacts the upper connection pattern; the first insulating portion includes first and second lower layers, the second lower layer having a thickness smaller than the first lower layer; the second insulating portion includes a first upper layer contacting the second lower layer and covering a portion of an upper surface of the upper connection pattern, and a second upper layer on the first upper layer, the second upper layer having a thickness greater than the first upper layer; and materials of the second lower layer and first upper layer is different from materials of the first lower layer and the second upper layer.
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4.发明申请公开(公告)号：US20210184070A1
公开(公告)日：2021-06-17
申请号：US16883363
申请日：2020-05-26
发明人： Kyungwook HWANG , Jungel RYU , Sungjin KANG , Jongmyeong KIM , Jehong OH , Euijoon YOON , Seungmin LEE , Junsik HWANG
摘要： A method of aligning micro LEDs and a method of manufacturing a micro LED display using the same are provided. The method of aligning micro LEDs includes providing micro LEDs, each having a first surface that has a first maximum width and a second surface opposite to the first surface and has a second maximum width that is greater than the first maximum width, providing a transfer substrate including a transfer mold that has an array of openings, each of the openings being configured to accommodate the first surface of a corresponding micro LED and not accommodate the second surface of the corresponding micro LED and aligning the micro LEDs in one direction in the openings of the transfer mold by inserting the micro LEDs into the openings of the transfer mold so that the first surface of each of the micro LEDs is positioned within a corresponding opening.
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5.发明申请公开(公告)号：US20210159361A1
公开(公告)日：2021-05-27
申请号：US16845457
申请日：2020-04-10
发明人： Kyungwook HWANG , Sungjin KANG , Euijoon YOON , Junsik HWANG , Jongmyeong KIM , Jehong OH , Jungel RYU , Seungmin LEE
摘要： Provided are a light-emitting diode (LED) device, a method of manufacturing the LED device, and a display apparatus including the LED device. The LED device includes a light-emitting layer having a core-shell structure, a passivation layer provided to cover a portion of a top surface of the first semiconductor layer, a first electrode provided on the light-emitting layer, and a second electrode provided under the light-emitting layer. The light-emitting layer includes a first semiconductor layer, an active layer, and a second semiconductor layer. The first electrode is provided to contact the first semiconductor layer, and the second electrode is provided to contact the second semiconductor layer.
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6.发明公开公开(公告)号：US20240130122A1
公开(公告)日：2024-04-18
申请号：US18206785
申请日：2023-06-07
发明人： Seungmin LEE , Daeyeong LEE , Sunyi LEE , Jaeho CHOI
IPC分类号： H10B43/27 , H01L23/522 , H01L23/528 , H01L25/065 , H10B43/10 , H10B43/35 , H10B43/40 , H10B80/00
CPC分类号： H10B43/27 , H01L23/5226 , H01L23/5283 , H01L25/0652 , H10B43/10 , H10B43/35 , H10B43/40 , H10B80/00 , H01L2225/06541
摘要： A three-dimensional semiconductor memory device may include a substrate, a stack including interlayer insulating layers and gate electrodes alternatingly stacked on the substrate, a dummy pad on a pad portion of each gate electrode, a source structure between the substrate and the stack, and first vertical channel structures that penetrate the stack and the source structure. The pad portions may include a first pad portion vertically overlapped with the dummy pad and a second pad portion horizontally overlapped with the dummy pad. The first and second pad portions may be spaced apart from the dummy pad, and one of the interlayer insulating layers may be interposed between the first pad portion and the dummy pad. The one of the interlayer insulating layers may extend continuously from a first portion to a second portion via a connection portion.
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公开(公告)号：US20230299234A1
公开(公告)日：2023-09-21
申请号：US18303423
申请日：2023-04-19
发明人： Euijoon YOON , Jehong OH , Jungel RYU , Seungmin LEE , Jongmyeong KIM
IPC分类号： H01L33/24 , H01L25/075 , H01L33/16 , H01L33/00 , H01L33/32
CPC分类号： H01L33/24 , H01L25/0753 , H01L33/0095 , H01L33/16 , H01L33/32
摘要： Disclosed are a display device and a manufacturing method thereof. The display device includes a plurality of pixels, a light emitting device provided in each of the plurality of pixels, the light emitting device having a first surface and a second surface, which are opposite to each other, a first electrode electrically connected to the first surface of the light emitting device, a second electrode electrically connected to the second surface of the light emitting device, and a metal oxide pattern interposed between the second surface of the light emitting device and the second electrode. The metal oxide pattern is provided to cover a portion of the second surface and to expose a remaining portion of the second surface. The second electrode is electrically connected to the exposed remaining portion of the second surface, and the metal oxide pattern includes single-crystalline or polycrystalline alumina.
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公开(公告)号：US20230077776A1
公开(公告)日：2023-03-16
申请号：US17860324
申请日：2022-07-08
发明人： Seungmin LEE , Jehun KANG , Joongho KIM , Sungun GO
IPC分类号： F25D23/06
摘要： A refrigerator includes: an inner case including a plurality of plates formed by injection-molding; an outer case couplable with an exterior of the inner case; and an insulation between the inner case and the outer case. A first plate of the plurality of plates includes a first coupling portion formed along an edge of the first plate, and a second plate of the plurality of plates includes a second coupling portion formed along an edge of the second plate and couplable with the first coupling portion. The first coupling portion includes an insertion protrusion. The second coupling portion includes: an accommodating portion forming an accommodating groove in which the insertion protrusion is inserted; and a catching portion configured to prevent the insertion protrusion from departing from the accommodating groove; and an inner rib protruding from an inner surface of the accommodating portion to be inserted in the insertion groove.
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公开(公告)号：US20220173120A1
公开(公告)日：2022-06-02
申请号：US17465412
申请日：2021-09-02
发明人： Seungmin LEE , Junhyoung KIM , Kangmin KIM , Byungkwan YOU
IPC分类号： H01L27/11582 , H01L27/11519 , H01L27/11524 , H01L27/11526 , H01L27/11556 , H01L27/1157 , H01L27/11565 , H01L27/11573 , H01L23/522 , H01L23/528
摘要： A semiconductor device includes: a substrate that includes a first region and a second region; gate electrodes stacked on the first region in a first direction, extend by different lengths in a second direction on the second region, and respectively including a pad region having an upper surface that is upwardly exposed in the second region; interlayer insulating layers alternately stacked with the gate electrodes; channel structures that extend in the first direction and penetrate through the gate electrodes; plug insulating layers alternately disposed with the interlayer insulating layers and parallel to the gate electrodes below the pad region; and contact plugs that extend in the first direction and respectively penetrate through the pad region and the plug insulating layers below the pad region. In each of the gate electrodes, the pad region has physical properties that differ from physical properties of regions other than the pad region.
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公开(公告)号：US20220071503A1
公开(公告)日：2022-03-10
申请号：US17416111
申请日：2019-10-14
发明人： Namseok CHANG , Younghyun KIM , Seungmin LEE
IPC分类号： A61B5/053
摘要： According to various embodiments, an electronic device may comprise: a biological body contact circuit including four electrodes; a current-voltage measurement module including a power supply port, a current measurement port, a first voltage measurement port, a second voltage measurement port, an alternating current signal generator electrically connected to the power supply port, an ammeter electrically connected to the current measurement port, and a voltmeter interposed between and electrically connected to the first voltage measurement port and the second voltage measurement port; a processor; a memory electrically connected to the processor to store the characteristic impedance values of circuit elements interposed between and electrically connected to the current-voltage measurement module and the biological body contact circuit, and to store values for parasitic impedance stemming from parasitic elements existing between the biological body contact circuit and a ground; and a current-voltage path configuration module configured to electrically connect the biological body contact circuit to the power supply port, the current measurement port, the first voltage measurement port, and the second voltage measurement port such that the voltage path and current path of the biological body contact circuit can be changed under control of the processor. Various other embodiments are also possible.
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