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公开(公告)号:US20230306879A1
公开(公告)日:2023-09-28
申请号:US18202417
申请日:2023-05-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyunyong CHOI , Jisu KIM , Hunsung KIM , Boum-Sik KIM , Seungjae KIM , Chul-Yong CHO , Tae-Hun KIM
CPC classification number: G09F9/301 , G06F1/1652 , G06F1/1658
Abstract: A display apparatus includes a display module, a support configured to rotate and support the display module, and a mounting device configured to mount a mobile device on the display module. The mobile device is configured to be paired with the display module. The mounting device includes a mounting portion including a mounting groove having a shape corresponding to a frame forming borders of the display module. The mounting portion is coupled to the frame when the frame is inserted into the mounting groove, and an accommodating portion is positioned below the mounting portion, and accommodates the mobile device such that the mobile device is mounted on the display module.
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公开(公告)号:US20200144285A1
公开(公告)日:2020-05-07
申请号:US16401667
申请日:2019-05-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Bong-Yong LEE , Tae-Hun KIM , Min-Kyung BAE , Myung-Hun WOO
IPC: H01L27/11582 , H01L27/1157
Abstract: A vertical semiconductor device includes a plurality of channel connection patterns, a lower insulation layer, a supporting layer, a stacked structure, and a channel structure. The channel connection patterns, on which the lower insulation layer is formed, contact a substrate. The supporting layer is formed on the lower insulation layer to be spaced apart from the channel connection patterns, and includes polysilicon doped with impurities. The stacked structure is formed on the supporting layer, and includes insulation layers and gate electrodes to form a memory cell string. The channel structure passes through the stacked structure, the supporting layer and the lower insulation layer, and includes a charge storage structure and a channel which contacts the channel connection patterns. The charge storage structure and the channel face the gate electrodes and the supporting layer. The supporting layer serves as a gate of a gate induced drain leakage (GIDL) transistor.
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公开(公告)号:US20180184843A1
公开(公告)日:2018-07-05
申请号:US15858806
申请日:2017-12-29
Applicant: Samsung Electronics Co., Ltd
Inventor: Tae-Hun KIM , Jong-Hoon LEE , Kun-Woo CHOI , Seo Kang KIM , Woo Joo KIM , In Ki JEON , Seong Joo CHO
Abstract: Disclosed herein is a cooking appliance having an improved cooling mechanism. The cooking appliance includes a first cavity forming a first cooking chamber and a second cavity forming a second cooking chamber, and has a cooling mechanism for cooling both the first cavity and the second cavity. A separate third cooling channel is formed to exhaust air from the first cooking chamber. A vent for the first and second cavities may be formed at a lower portion of the second cavity such that air may be exhausted via the vent.
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公开(公告)号:US20240274041A1
公开(公告)日:2024-08-15
申请号:US18643016
申请日:2024-04-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyunyong CHOI , Jisu KIM , Hunsung KIM , Boum-Sik KIM , Seungjae KIM , Chul-Yong CHO , Tae-Hun KIM
CPC classification number: G09F9/301 , G06F1/1652 , G06F1/1658
Abstract: A display apparatus includes a display module, a support configured to rotate and support the display module, and a mounting device configured to mount a mobile device on the display module. The mobile device is configured to be paired with the display module. The mounting device includes a mounting portion including a mounting groove having a shape corresponding to a frame forming borders of the display module. The mounting portion is coupled to the frame when the frame is inserted into the mounting groove, and an accommodating portion is positioned below the mounting portion, and accommodates the mobile device such that the mobile device is mounted on the display module.
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公开(公告)号:US20210209972A1
公开(公告)日:2021-07-08
申请号:US16990480
申请日:2020-08-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyunyong CHOI , Jisu KIM , Hunsung KIM , Boum-Sik KIM , Seungjae KIM , Chul-Yong CHO , Tae-Hun KIM
Abstract: A display apparatus includes a display module, a support configured to rotate and support the display module, and a mounting device configured to mount a mobile device on the display module. The mobile device is configured to be paired with the display module. The mounting device includes a mounting portion including a mounting groove having a shape corresponding to a frame forming borders of the display module. The mounting portion is coupled to the frame when the frame is inserted into the mounting groove, and an accommodating portion is positioned below the mounting portion, and accommodates the mobile device such that the mobile device is mounted on the display module.
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公开(公告)号:US20220319358A1
公开(公告)日:2022-10-06
申请号:US17847567
申请日:2022-06-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyunyong CHOI , Jisu KIM , Hunsung KIM , Boum-Sik KIM , Seungjae KIM , Chul-Yong CHO , Tae-Hun KIM
Abstract: A display apparatus includes a display module, a support configured to rotate and support the display module, and a mounting device configured to mount a mobile device on the display module. The mobile device is configured to be paired with the display module. The mounting device includes a mounting portion including a mounting groove having a shape corresponding to a frame forming borders of the display module. The mounting portion is coupled to the frame when the frame is inserted into the mounting groove, and an accommodating portion is positioned below the mounting portion, and accommodates the mobile device such that the mobile device is mounted on the display module.
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公开(公告)号:US20210329802A1
公开(公告)日:2021-10-21
申请号:US17272485
申请日:2019-08-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hee-Bong KIM , Dong Wook KIM , Ji-Gwang KIM , Tae-Hun KIM , Yong Gu DO , Jeong Woo PARK , Gil Jae LEE , Sang Young LEE , Pil Kwon JUNG , Su-An CHOI
IPC: H05K5/02 , G02F1/1333
Abstract: A display apparatus according to a concept of the disclosure includes: a display panel configured to display an image in a front direction; a top chassis positioned in a front direction of the display panel; a bottom chassis positioned in a rear direction of the display panel; a rear cover covering a rear side of the bottom chassis; and a stand member being accommodatable in the rear cover and selectively coupled with a rear surface of the rear cover, wherein the rear cover includes an accommodating portion in which the stand member is accommodated and a coupling portion coupled with the stand member, and the stand member includes an inserting protrusion which is inserted into the accommodating portion and the coupling portion.
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公开(公告)号:US20180192482A1
公开(公告)日:2018-07-05
申请号:US15860230
申请日:2018-01-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Tae-Hun KIM , Jong-Hoon LEE , Woo Joo KIM , In Ki JEON , Seong Joo CHO , Kun-Woo CHOI
CPC classification number: H05B6/6444 , F24C15/006 , F24C15/008 , F24C15/2007
Abstract: Disclosed herein are a lamp module that includes a double insulation structure and a cooling structure, thus being usable even in a high temperature condition, and a cooking appliance including the same. The cooking appliance includes a cooking compartment, a cooling fan disposed at an upper portion of the cooking compartment to suction outside air, and a lamp module configured to illuminate an inside of the cooking compartment and disposed adjacent to the cooling fan to exchange heat with the outside air suctioned by the cooling fan.
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公开(公告)号:US20140246786A1
公开(公告)日:2014-09-04
申请号:US14279776
申请日:2014-05-16
Applicant: Samsung Electronics Co., Ltd.
Inventor: Tae-Hun KIM , Jin-Woo PARK , Dae-Young CHOI , Mi-Yeon KIM , Sun-Hye LEE
IPC: H01L23/522
CPC classification number: H01L23/5226 , H01L21/78 , H01L23/3128 , H01L23/481 , H01L24/14 , H01L24/81 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/50 , H01L2224/13022 , H01L2224/13025 , H01L2224/14181 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48225 , H01L2224/48227 , H01L2224/73204 , H01L2224/94 , H01L2225/06541 , H01L2225/06565 , H01L2225/1005 , H01L2225/1023 , H01L2225/1052 , H01L2225/1058 , H01L2924/01019 , H01L2924/10253 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2224/11 , H01L2924/00012
Abstract: Provided is a method of forming a package-on-package. An encapsulation is formed to cover a wafer using a wafer level molding process. The wafer includes a plurality of semiconductor chips and a plurality of through silicon vias (TSVs) passing through the semiconductor chips. The encapsulant may have openings aligned with the TSVs. The encapsulant and the semiconductor chips are divided to form a plurality of semiconductor packages. Another semiconductor package is stacked on one selected from the semiconductor packages. The other semiconductor package is electrically connected to the TSVs.
Abstract translation: 提供了一种形成封装封装的方法。 使用晶片级成型工艺形成覆盖晶片的封装。 晶片包括多个半导体芯片和穿过半导体芯片的多个通孔硅通孔(TSV)。 密封剂可以具有与TSV对齐的开口。 密封剂和半导体芯片被分割以形成多个半导体封装。 另一个半导体封装堆叠在从半导体封装中选择的一个上。 另一个半导体封装电连接到TSV。
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