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公开(公告)号:US20190355744A1
公开(公告)日:2019-11-21
申请号:US16526139
申请日:2019-07-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kwang-soo KIM , Yong-seok KIM , Tae-hun KIM , Min-kyung BAE , Jae-hoon JANG , Kohji KANAMORI
IPC: H01L27/11582 , H01L29/08 , H01L29/78
Abstract: A semiconductor device includes a plurality of channel structures on a substrate, each channel structure extending in a first direction perpendicular to the substrate, and having a gate insulating layer and a channel layer, a common source extension region including a first semiconductor layer having an n-type conductivity between the substrate and the channel structures, a plurality of gate electrodes on the common source extension region and spaced apart from each other on a sidewall of each of the channel structures in the first direction, and a common source region on the substrate in contact with the common source extension region and including a second semiconductor layer having an n-type conductivity, wherein the gate insulating layer of each of the channel structures extends to cover an upper surface and at least a portion of a bottom surface of the common source extension region.
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2.
公开(公告)号:US20200183778A1
公开(公告)日:2020-06-11
申请号:US16792545
申请日:2020-02-17
Applicant: Samsung Electronics Co., Ltd.
Inventor: Tae-hun KIM , Yong-sang Yu , Man-hwee Jo , Min-young Joe , Ji-woong Kim , Nak-hee Seong
Abstract: According to an aspect of inventive concepts, there is provided a memory controller configured to control a memory device including a plurality of memory pages, the memory controller including an error correction code (ECC) region manager configured to manage the plurality of memory pages by dividing the plurality of memory pages into ECC enable regions and ECC disable regions, and an ECC engine configured to perform an ECC operation on data included in the ECC enable regions.
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公开(公告)号:US20190251038A1
公开(公告)日:2019-08-15
申请号:US16272248
申请日:2019-02-11
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyun-joon KANG , Tae-hun KIM
IPC: G06F12/10 , G06F9/50 , G06F12/0815 , G06N20/00
CPC classification number: G06F12/10 , G06F9/5016 , G06F12/0815 , G06N20/00
Abstract: Provided are a memory controller and an application processor (AP) for controlling utilization and performance of an input/output (I/O) device and a method of operating the memory controller. The memory controller includes an address translator configured to translate a first address received from a host processor into a second address indicating a memory address based on an address translation scheme selected from a plurality of address translation schemes based on memory resource utilization; and an evaluation module configured to evaluate the memory resource utilization of each of the plurality of address translation schemes based on a plurality of memory addresses generated based on each of the plurality of address translation schemes.
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公开(公告)号:US20200053891A1
公开(公告)日:2020-02-13
申请号:US16499694
申请日:2018-10-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Tae-hun KIM , Chul-yong CHO , Se-jin YOON
Abstract: A display device is disclosed. The display device comprises: a display unit for displaying an image; a support for supporting the display unit; and a rotating unit for rotatably connecting the display unit to one surface part of the support; wherein the rotating unit rotates the display unit after tilting the same in a first tilting direction with respect to the one surface part of the support.
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5.
公开(公告)号:US20190050316A1
公开(公告)日:2019-02-14
申请号:US15898784
申请日:2018-02-19
Applicant: Samsung Electronics Co., Ltd.
Inventor: Tae-hun KIM , Yong-sang YU , Man-hwee JO , Min-young JOE , Ji-woong KIM , Nak-hee SEONG
Abstract: According to an aspect of inventive concepts, there is provided a memory controller configured to control a memory device including a plurality of memory pages, the memory controller including an error correction code (ECC) region manager configured to manage the plurality of memory pages by dividing the plurality of memory pages into ECC enable regions and ECC disable regions, and an ECC engine configured to perform an ECC operation on data included in the ECC enable regions.
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公开(公告)号:US20180374869A1
公开(公告)日:2018-12-27
申请号:US15993756
申请日:2018-05-31
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kwang-soo KIM , Yong-seok KIM , Tae-hun KIM , Min-kyung BAE , Jae-hoon JANG , Kohji KANAMORI
IPC: H01L27/11582 , H01L29/78 , H01L29/08
CPC classification number: H01L27/11582 , H01L27/11565 , H01L29/0847 , H01L29/7827
Abstract: A semiconductor device includes a plurality of channel structures on a substrate, each channel structure extending in a first direction perpendicular to the substrate, and having a gate insulating layer and a channel layer, a common source extension region including a first semiconductor layer having an n-type conductivity between the substrate and the channel structures, a plurality of gate electrodes on the common source extension region and spaced apart from each other on a sidewall of each of the channel structures in the first direction, and a common source region on the substrate in contact with the common source extension region and including a second semiconductor layer having an n-type conductivity, wherein the gate insulating layer of each of the channel structures extends to cover an upper surface and at least a portion of a bottom surface of the common source extension region.
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公开(公告)号:US20180176654A1
公开(公告)日:2018-06-21
申请号:US15813532
申请日:2017-11-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yea-seul SONG , Yeon-woo KIM , Tae-hun KIM , Young-jin LEE
IPC: H04N21/482 , H04N21/431 , H04N5/445 , H04N21/488 , H04N21/462
CPC classification number: H04N21/4821 , H04N5/44543 , H04N5/44582 , H04N21/4316 , H04N21/4385 , H04N21/4622 , H04N21/488 , H04N21/8133 , H04N21/8586 , H04N2005/44556
Abstract: Disclosed is an electronic apparatus. The electronic apparatus includes: a first receiver, a second receiver and a controller. The first receiver includes circuitry that receives a first broadcast signal transmitted in a first data transmission mode. The second receiver includes circuitry that receives a second broadcast signal transmitted in a second data transmission mode different from the first data transmission mode. The controller is configured to extract first guide information about a first broadcast program from the first broadcast signal, to extract second guide information about a second broadcast program from the second broadcast signal, and to generate and provide integrated guide information about the first and second broadcast programs. Thus, accurate guide information about content may be provided to a user.
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公开(公告)号:US20170082296A1
公开(公告)日:2017-03-23
申请号:US15265349
申请日:2016-09-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sang-jin JEONG , Woo-joo KIM , Tae-hun KIM , Han-jun SUNG
CPC classification number: F24C15/006 , F24C15/02 , F24C15/28
Abstract: An oven and a control method thereof are provided. The oven includes a case including a cooking chamber in an inside thereof, a door hinge-coupled to the case and configured to open and close the cooking chamber, a cooling fan disposed in an upper portion of the inside of the case and configured to discharge air toward a front of the cooking chamber, and a heat blocking unit configured to form a wind shield which blocks high-temperature heat and water vapor discharged from an inside of the cooking chamber by changing a direction of the air discharged through the cooling fan to a lower side of the cooking chamber. In response to the door being closed, a portion of the heat blocking unit is pressed through an upper portion of the door and non-interferes the air discharged toward the front of the cooking chamber and in response to the door being opened, the portion of the heat blocking unit pressed by the upper portion of the door is released and interferes the air discharged toward the front of the cooking chamber to form the wind shield.
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公开(公告)号:US20130161800A1
公开(公告)日:2013-06-27
申请号:US13674328
申请日:2012-11-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hak-kyoon BYUN , Tae-hun KIM , Ji-hyun PARK , Byung-cheol JEON , Seung-jin CHEON
IPC: H01L23/18
CPC classification number: H01L23/18 , H01L21/561 , H01L21/565 , H01L23/3121 , H01L25/0652 , H01L25/0655 , H01L2224/16145 , H01L2224/16225 , H01L2924/01327 , H01L2924/18161 , H05K3/284 , H05K2203/1316 , H05K2203/1327 , H01L2924/00
Abstract: A printed circuit board (PCB) for molded underfill (MUF) and a PCB molding structure that may expand a range of applying the PCB and may resolve a problem of generation of a void during manufacturing of a semiconductor package. The PCB includes: a molding area on which a plurality of semiconductor chips are mounted and that is sealed; and a peripheral area that is formed around the molding area, contacts a mold for molding during a molding process, and includes a first side adjacent to a portion into which a molding material is injected and a second side that faces the first side that is adjacent to a portion from which air may be discharged, wherein an active area where the semiconductor chips are disposed in the molding area is disposed nearer the first side than to the second side.
Abstract translation: 用于模制底部填充物(MUF)的印刷电路板(PCB)和可以扩大施加PCB的范围的PCB模制结构,并且可以解决在制造半导体封装期间产生空隙的问题。 PCB包括:多个半导体芯片安装在其上并被密封的成型区域; 以及围绕成型区域形成的周边区域,在模制过程中与模具接触,并且包括与模制材料注入的部分相邻的第一侧和面向相邻的第一侧的第二侧 到可以排出空气的部分,其中在模制区域中设置半导体芯片的有源区域设置在比第二侧更靠近第一侧的位置。
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