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    Fingerprint sensor package and smart card having the same
    1.
    发明授权
    Fingerprint sensor package and smart card having the same 有权

    公开(公告)号：US12131571B2

    公开(公告)日：2024-10-29

    申请号：US18134360

    申请日：2023-04-13

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Woojae Kim

    IPC: G06V40/13 ,  G06F3/041 ,  G06F3/044 ,  G06K19/07

    CPC classification number: G06V40/1306 ,  G06F3/04164 ,  G06F3/0445 ,  G06F3/0446 ,  G06K19/0718 ,  G06V40/1329 ,  G06F2203/04103

    Abstract: A fingerprint sensor package includes a first substrate including a core insulating layer including first and second surfaces opposing each other and having a through-hole penetrating through the first surface and the second surface, a first bonding pad along a circumference of the through-hole on the first or second surface, and an external connection pad on an edge of the second surface, a second substrate having a third surface including a sensing region and a peripheral region surrounding the sensing region, and a fourth surface opposing the third surface, the second substrate including a second bonding pad along an edge of the third or fourth surface and bonded to the first bonding pad, and covering the through-hole, a controller chip on the fourth surface, and a molded layer on the second surface of the core insulating layer, covering the controller chip, and spaced apart from the external connection pad.

    Semiconductor packages
    2.
    发明授权
    Semiconductor packages 有权

    公开(公告)号：US12087657B2

    公开(公告)日：2024-09-10

    申请号：US17551710

    申请日：2021-12-15

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Woojae Kim

    IPC: H01L23/367 ,  H01L23/00 ,  H01L23/433

    CPC classification number: H01L23/3675 ,  H01L23/433 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204

    Abstract: A semiconductor package includes a package substrate, a semiconductor chip on the package substrate, a heat dissipation structure on the package substrate, the heat dissipation structure including a center portion and an edge portion, a dam structure on a bottom surface of the center portion of the heat dissipation structure, the dam structure on a top surface of the semiconductor chip, and a heat conductive layer between the center portion of the heat dissipation structure and the semiconductor chip. A top surface of the dam structure is located at a same distance from a top surface of the package substrate in a vertical direction as a top surface of the heat conductive layer, wherein the vertical direction is perpendicular to the top surface of the package substrate.

    DIMPLE PLATE ADJUSTMENT DEVICE
    4.
    发明申请
    DIMPLE PLATE ADJUSTMENT DEVICE 有权

    公开(公告)号：US20250118540A1

    公开(公告)日：2025-04-10

    申请号：US18768778

    申请日：2024-07-10

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Hyunjung Lee ,  Yongjoo Cho ,  Sunho Kim ,  Woojae Kim

    IPC: H01J37/32

    Abstract: A dimple plate precision adjustment device includes a dimple carrier assembled on a cylindrical dimple plate and capable of transporting the cylindrical dimple plate; a dimple spacer capable of mounting the dimple carrier assembled on the dimple plate; and a plurality of gap measurers installed on the dimple spacer to be spaced apart from each other. The dimple carrier, the dimple spacer, and the gap measurers assembled on the dimple plate are installed in a body of a chamber where an antenna electrode is installed, and the gap measurers measure a gap between the gap measurers and the dimple carrier.

    Apparatus and method for fronthaul transmission in wireless communication system
    5.
    发明授权
    Apparatus and method for fronthaul transmission in wireless communication system 有权

    公开(公告)号：US11729668B2

    公开(公告)日：2023-08-15

    申请号：US17278221

    申请日：2019-09-20

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jaeyoel Kim ,  Zhen Li ,  Daejoong Kim ,  Woojae Kim ,  Namryul Jeon

    IPC: H04W28/06 ,  H04L1/00 ,  H04L1/1607 ,  H04L5/00

    CPC classification number: H04W28/06 ,  H04L1/0003 ,  H04L1/1614 ,  H04L5/0094

    Abstract: The present disclosure relates to a 5th (5G) generation) or pre-5G communication system for supporting a higher data transmission rate beyond a 4th (4G) generation communication system such as long term evolution (LTE). An operating method of a base station in a wireless communication system according to various embodiments of the present disclosure includes generating at least one compressed symbol based on modulation compression, transmitting to another base station, control information including position indication information which indicates a position of a subcarrier at which a first subcarrier signal is transmitted in a physical resource block (PRB) to which the at least one compressed symbol is mapped, and power indication information for indicating a transmit power of the first subcarrier signal, and transmitting the at least one compressed symbol to the another base station. Thus, transmission capacity may be optimized, and efficient modulation compression is possible.

    Apparatus and method for transmitting signals using fronthaul in communication system
    6.
    发明授权
    Apparatus and method for transmitting signals using fronthaul in communication system 有权

    公开(公告)号：US11178683B2

    公开(公告)日：2021-11-16

    申请号：US16788512

    申请日：2020-02-12

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Namryul Jeon ,  Daejoong Kim ,  Woojae Kim ,  Jaeyoel Kim

    IPC: H04W72/12 ,  H04W72/08 ,  H04W72/10

    Abstract: A method for transmitting signals by a first device of a base station transmitting and receiving signals of a wireless communication system is provided. The method includes receiving a plurality of uplink signals, identifying uplink transmission shaping information to be applied to the plurality of uplink signals, and transmitting the plurality of uplink signals to a second device by applying the uplink transmission shaping. The uplink transmission shaping information is information indicating for how many time intervals the first device is to transmit the plurality of uplink signals to the second device using a fronthaul. If the plurality of uplink signals are received by the first device for a first time, the plurality of uplink signals to which the uplink transmission shaping is applied are transmitted by the first device to the second device for the first time and a time determined based on the uplink transmission shaping information.

    SDN-BASED LTE NETWORK STRUCTURE AND OPERATION SCHEME
    7.
    发明申请
    SDN-BASED LTE NETWORK STRUCTURE AND OPERATION SCHEME 有权
    基于SDN的LTE网络结构与运行方案

    公开(公告)号：US20160374095A1

    公开(公告)日：2016-12-22

    申请号：US14901465

    申请日：2014-06-25

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Youngki Jeon ,  Seongryong Kang ,  Woojae Kim ,  Jonghyune Kim ,  Jungah Choi

    IPC: H04W72/04 ,  H04W76/04

    CPC classification number: H04W72/0493 ,  H04J11/00 ,  H04L41/04 ,  H04L45/64 ,  H04W8/24 ,  H04W24/04 ,  H04W40/34 ,  H04W76/041 ,  H04W76/12 ,  H04W88/12 ,  H04W88/16

    Abstract: The present invention relates to a network structure for effectively applying a software-defined networking (SDN) technology to an LTE network and an operation of a system on the basis of the same. The present invention therefore provides a method for controlling communication by an SDN controller in an SDN-based wireless communication network, the method comprising the steps of: receiving information on a UE from a gateway controller as the UE initially accesses an eNB; selecting at least one Openflow switch (OFS) for processing traffic of the UE on the basis of the information; and transmitting a request for setting a packet forwarding rule for processing the traffic of the UE to the at least one OFS.

    Abstract translation: 本发明涉及一种用于有效地将软件定义网络（SDN）技术应用于LTE网络和基于该网络的系统的操作的网络结构。 因此，本发明提供了一种用于在基于SDN的无线通信网络中通过SDN控制器进行通信控制的方法，所述方法包括以下步骤：当UE最初访问eNB时，从网关控制器接收关于UE的信息; 根据该信息，选择至少一个Openflow交换机（OFS）来处理UE的业务; 以及发送用于设置用于将所述UE的业务处理到所述至少一个OFS的分组转发规则的请求。

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