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公开(公告)号:US12276025B2
公开(公告)日:2025-04-15
申请号:US18092169
申请日:2022-12-30
Applicant: SEMES CO., LTD.
Inventor: Kwang Ryul Kim , Yun Sang Kim , Jin Hee Hong
IPC: C23C16/46 , C23C16/455 , H01J37/32
Abstract: A substrate processing apparatus includes a processing chamber having a processing space in which a substrate is plasma-processed, and having a transparent window; a gas flow unit supplying and discharging process gas to the processing chamber; and a laser irradiator irradiating a laser for heating the substrate to be selectively atomic layer-processed for each of a plurality of thin films formed on the substrate through the transparent window from an external space of the processing chamber.
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公开(公告)号:US20180337070A1
公开(公告)日:2018-11-22
申请号:US15979956
申请日:2018-05-15
Applicant: SEMES CO., LTD.
Inventor: Byungsun Bang , Buyoung Jung , Jungbong Choi , Bong Joo Kim , Youngil Lee , Gil Hun Song , Gui Su Park , Kwang Ryul Kim , Kwang-Seop Lee , Jin Tack Yu
CPC classification number: H01L21/67028 , B08B3/041 , B08B3/08 , B08B7/0042 , B08B7/04 , B23K26/402 , C03C23/0025 , H01L21/0206 , H01L21/0217
Abstract: Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating method includes removing a portion of the thin film by irradiating a laser to the substrate, and after the removing of the portion of the thin film, removing the remaining portion of the thin film by supplying a chemical to the substrate.
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