Substrate processing apparatus and substrate processing method

    公开(公告)号:US12276025B2

    公开(公告)日:2025-04-15

    申请号:US18092169

    申请日:2022-12-30

    Abstract: A substrate processing apparatus includes a processing chamber having a processing space in which a substrate is plasma-processed, and having a transparent window; a gas flow unit supplying and discharging process gas to the processing chamber; and a laser irradiator irradiating a laser for heating the substrate to be selectively atomic layer-processed for each of a plurality of thin films formed on the substrate through the transparent window from an external space of the processing chamber.

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