公开(公告)号：US12290876B2

公开(公告)日：2025-05-06

申请号：US18341838

申请日：2023-06-27

Applicant: SEMES CO., LTD.

Inventor： Soo Young Park ,  Ohyeol Kwon ,  Jun Keon Ahn ,  Jung Hwan Lee ,  Seong Soo Lee

IPC: B23K26/0622 ,  B23K26/08 ,  B23K26/10 ,  B23K26/40 ,  B23K103/00

Abstract: Disclosed is a method for removing a film from a substrate by irradiating a plurality of unit pulse laser beams to an edge region of the substrate. The method includes a first irradiation operation for irradiating a plurality of unit pulse laser beams onto the substrate while the substrate is rotating, and a second irradiation operation for irradiating a plurality of unit pulse laser beams to regions of the substrate onto which the unit pulse laser beams are not irradiated in the first irradiation operation.

公开(公告)号：US11972939B2

公开(公告)日：2024-04-30

申请号：US16901913

申请日：2020-06-15

Applicant: SEMES CO., LTD.

Inventor： Ohyeol Kwon ,  Jun Keon Ahn ,  Soo Young Park ,  Jung Hwan Lee

IPC: H01L21/02 ,  B23K26/0622 ,  B23K26/36 ,  B23K26/362 ,  H01L21/66 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/02098 ,  B23K26/0624 ,  B23K26/36 ,  B23K26/362 ,  H01L21/02021 ,  H01L21/02087 ,  H01L21/67069 ,  H01L21/67242 ,  H01L21/67253 ,  H01L21/68764 ,  H01L22/12 ,  H01L22/20

Abstract: The inventive concept provides a method for treating a substrate. The method includes removing a film on the substrate by applying a pulsed laser to the rotating substrate, in which thickness of the film to be removed is measured and pulse energy of the pulsed laser is selected based on the measured thickness of the film.

公开(公告)号：US11745291B2

公开(公告)日：2023-09-05

申请号：US16862086

申请日：2020-04-29

Applicant: SEMES CO., LTD.

Inventor： Ohyeol Kwon ,  Jun Keon Ahn ,  Byungsun Bang

IPC: B23K26/362 ,  G02B27/14 ,  G02B27/09 ,  G02B26/10 ,  B23K26/06 ,  B23K26/082 ,  B23K26/402 ,  B23K26/0622 ,  B23K103/00

CPC classification number: B23K26/362 ,  B23K26/0604 ,  B23K26/0622 ,  B23K26/0626 ,  B23K26/082 ,  B23K26/402 ,  G02B26/10 ,  G02B27/09 ,  G02B27/14 ,  B23K2103/42 ,  B23K2103/54

Abstract: An apparatus includes a support unit supporting a substrate including a film, a laser generation unit that generates a laser beam to process the film, a beam splitter that splits the laser beam into a first laser beam travelling along a first path toward an upper edge of the substrate and a second laser beam travelling along a second path toward a lower edge of the substrate, a first beam shaping unit on the first path shaping the first laser beam, a second beam shaping unit on the second path shaping the second laser beam, a first beam scanning unit downstream of the first beam shaping unit that applies the first laser beam to the upper edge in the manner of scanning, and a second beam scanning unit downstream of the second beam shaping unit that applies the second laser beam to the lower edge in the manner of scanning.

公开(公告)号：US11869763B2

公开(公告)日：2024-01-09

申请号：US16861387

申请日：2020-04-29

Applicant: SEMES CO., LTD.

Inventor： Jun Keon Ahn ,  Soo Young Park ,  Ohyeol Kwon ,  Jung Hwan Lee ,  Seungtae Yang

IPC: H01L21/02 ,  B23K26/40 ,  H01L21/67 ,  H01L21/687 ,  B08B7/00 ,  B23K26/08 ,  B23K26/0622 ,  B23K26/073 ,  B23K26/06 ,  B23K26/082 ,  B23K101/40

CPC classification number: H01L21/02098 ,  B08B7/0042 ,  B23K26/0604 ,  B23K26/0622 ,  B23K26/0648 ,  B23K26/0665 ,  B23K26/073 ,  B23K26/082 ,  B23K26/0823 ,  H01L21/02087 ,  H01L21/67115 ,  H01L21/68764 ,  B23K2101/40

Abstract: An apparatus and system for treating a substrate includes a chamber having an inner space, a support unit in the inner space and configured to support and rotate the substrate, and first and second laser irradiation unit configured to irradiate first and second laser beams onto the substrate. The first laser irradiation unit includes a first laser light source configured to generate the first laser beam, and a first wavelength adjusting member configured to adjust a range of a wavelength of the first laser beam received from the first laser light source. The second laser beam, and a second wavelength adjusting member configured to adjust a range of a wavelength of the second laser beam received from the second laser light source.

公开(公告)号：US11679447B2

公开(公告)日：2023-06-20

申请号：US16861709

申请日：2020-04-29

Applicant: SEMES CO., LTD.

Inventor： Soo Young Park ,  Ohyeol Kwon ,  Jun Keon Ahn ,  Jung Hwan Lee

IPC: B23K26/042 ,  B23K26/03 ,  B23K26/08 ,  H01L21/02 ,  H01L21/68 ,  H01L21/66

CPC classification number: B23K26/042 ,  B23K26/032 ,  B23K26/0823 ,  H01L21/02021 ,  H01L21/681 ,  H01L22/12

Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a chamber providing a space in which a substrate is treated, a support unit supporting the substrate inside the chamber, a laser unit irradiating laser to an edge region of the substrate, a vision unit capturing the edge region of the substrate to measure an offset value of the substrate, and an adjustment unit adjusting an irradiation location of the laser based on the offset value of the substrate.