公开(公告)号：US20230207355A1

公开(公告)日：2023-06-29

申请号：US18145538

申请日：2022-12-22

Applicant: SEMES CO., LTD.

Inventor： Kun Hee PARK ,  Young Joon HAN ,  Cheol Hwan JEONG ,  Dae Hun KIM ,  Seong Hyun YUN ,  Ye Jin CHOI ,  Eun Hyeok CHOI ,  Tae Ho KANG ,  Young Jin KIM

IPC: H01L21/67 ,  H01L21/687 ,  B08B13/00 ,  B08B3/02 ,  B08B1/00 ,  B08B1/02 ,  B25J15/00 ,  B25J11/00

CPC classification number: H01L21/67207 ,  H01L21/67178 ,  H01L21/67196 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/68764 ,  H01L21/68707 ,  B08B13/00 ,  B08B3/022 ,  B08B1/002 ,  B08B1/02 ,  B25J15/0052 ,  B25J11/0085

Abstract: An apparatus for treating a substrate of the present invention includes a buffer unit, an inversion unit, a first transfer chamber, a second transfer chamber, a first cleaning chamber, and a second cleaning chamber. The first transfer chamber, the inversion unit, and the second transfer chamber are sequentially arranged in one direction. The first cleaning chamber is disposed at one side of the first transfer chamber, and the second cleaning chamber is disposed at one side of the second transfer chamber. A first main transfer robot provided in the first transfer chamber directly transfers the substrate between the buffer unit, the inversion unit, and the first cleaning chamber. The second main transfer robot provided in the second transfer chamber directly transfers the substrate between the buffer unit, the inversion unit, and the second cleaning chamber.

公开(公告)号：US20250153208A1

公开(公告)日：2025-05-15

申请号：US18935860

申请日：2024-11-04

Applicant: SEMES CO., LTD.

Inventor： Sang Hu HAN ,  Young Joon HAN ,  Cheol Hwan JEONG ,  Ju Ha WOO

IPC: B05B12/08 ,  B08B3/02

Abstract: Disclosed is an apparatus for processing a substrate, the apparatus including: a cup providing a processing space; a support unit provided in the processing space, and for supporting a substrate; a support unit provided in the processing space, and for supporting a substrate; a liquid supply unit including a nozzle for discharging a liquid to the substrate; a position adjuster coupled to the nozzle and for adjusting a position of the nozzle; and an adjustment unit coupled to the support unit, and for detecting pressure data when the liquid discharged from the nozzle meets the adjustment unit and position information at which the pressure data is generated.

公开(公告)号：US20220379355A1

公开(公告)日：2022-12-01

申请号：US17824169

申请日：2022-05-25

Applicant: SEMES CO., LTD.

Inventor： Ye Jin CHOI ,  Cheol Hwan JEONG ,  Young Jin KIM ,  Jong Won MOON

IPC: B08B13/00 ,  B08B3/02

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a treating container having a treating space; a support unit configured to support and rotate a substrate in the treating space; an exhaust line coupled to the treating container and configured to exhaust an airflow within the treating space; a support frame provided independently of a rotation of the support unit and positioned between the treating container and the support unit; and a guide vane protruding to an outside of the support frame and configured to guide the airflow within the treating space in a downward direction.

公开(公告)号：US20220208596A1

公开(公告)日：2022-06-30

申请号：US17554972

申请日：2021-12-17

Applicant: SEMES CO., LTD.

Inventor： Cheol Hwan JEONG

IPC: H01L21/687

Abstract: A chuck pin assembly includes a body member provided on a circumferential portion of a chuck supporting a substrate and configured to be movable with respect to the chuck, a grip member gripping a lateral portion of the substrate, and a rotational connection member rotatably coupling the grip member to the body member. As the grip member is rotatable, it is possible to prevent the chuck pin from being worn at a specific portion which contacts the substrate, and to improve the life of the chuck pin.

公开(公告)号：US20210129193A1

公开(公告)日：2021-05-06

申请号：US17085988

申请日：2020-10-30

Applicant: SEMES CO., LTD.

Inventor： Cheol Hwan JEONG

IPC: B08B3/10 ,  B08B5/02 ,  B08B7/04

Abstract: Embodiments of the inventive concept provides an apparatus for treating a substrate. The apparatus for treating a substrate comprises a housing having a process space therein, a substrate support unit supporting a substrate in the space, a liquid supply unit supplying a liquid to a substrate supported by the substrate support unit, an air flow generation unit generating an air flow in the process space, and the air flow generation unit comprises a first gas supply unit supplying a descending air flow of a first gas in the process space and a second gas supply unit supplying a second gas having lower humidity than the first gas in the space, and when viewed from above, the first gas supply unit and the second gas supply unit are not overlapped each other.