-
公开(公告)号：US20240118607A1
公开(公告)日：2024-04-11
申请号：US18183628
申请日：2023-03-14
Applicant: SEMES CO.,LTD.
Inventor： Hyun YOON , Ki Hoon CHOI , Seung Un OH , Young Ho PARK , Sang Hyeon RYU , Tae Hee KIM , Sang Gun LEE
CPC classification number: G03F1/80 , G03F1/82 , G03F7/168 , G03F7/202 , G03F7/3057 , G03F7/70733 , G03F7/70775
Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes pre-treating a substrate by cleaning the substrate; etching the substrate by supplying an etchant and heating a substrate supplied with the etchant; and post-treating the substrate after the etching the substrate, and wherein the pre-treating the substrate, the etching the substrate, and the post-treating the substrate are each performed in different chambers, a substrate on which the pre-treating the substrate is completed is transferred in a dry state to a chamber at which the etching the substrate is performed, and a substrate on which the etching the substrate is completed is transferred in a wetted state with a liquid to a chamber at which the post-treating the substrate is performed.
-
公开(公告)号：US20230203669A1
公开(公告)日：2023-06-29
申请号：US18145138
申请日：2022-12-22
Applicant: SEMES CO., LTD.
Inventor： Shin Hwa KANG , Seung Un OH , Young Ho PARK , Sang Hyeon RYU , Kwang Sup KIM
CPC classification number: C23F1/08 , H01L21/681
Abstract: Disclosed is a method for treating a substrate, on which a plurality of reference marks and a pattern are formed. The method includes a process preparing operation, a location information acquiring operation of acquiring information on an actual location of the pattern, and a process executing operation of supplying a treatment liquid to the substrate, and heating the substrate by irradiating laser light to the pattern on the substrate, to which the treatment liquid is applied, the location information acquiring operation includes acquiring information on actual locations of, among the plurality of reference marks, at least three reference marks, and acquiring information of the actual location of the pattern through the information of the actual locations of the reference marks.
-
Patent Agency Ranking
公开(公告)号：US20250093768A1
公开(公告)日：2025-03-20
申请号：US18770090
申请日：2024-07-11
Applicant: SEMES CO., LTD. , SAMSUNG ELECTRONICS CO. LTD.
Inventor： Jin Yeong SUNG , Ki Hoon CHOI , Seung Un OH , Young Ho PARK , Sang Hyeon RYU , Jang Jin LEE , Hyun YOON , Sang Gun LEE , Yu Jin CHO , Ho Jong HWANG , Jong Ju PARK , Jong Keun OH , Yong Woo KIM
Abstract: A substrate processing apparatus is provided and includes: a support unit including a spin chuck and a centering jig that is on the spin chuck, the spin chuck configured to support and rotate a substrate; a spraying unit configured to spray processing liquid onto the substrate; a swing arm including a correction unit that includes a sensor and an emitter, the swing arm configured to move such that the correction unit moves to a target point on the substrate, and the emitter configured to irradiate a beam towards the substrate; and a controller configured to: control the spin chuck and the swing arm; and determine whether a movement trajectory of the swing arm is aligned with a rotation center of the spin chuck based on information acquired by the sensor about the centering jig.
-
公开(公告)号：US20250100029A1
公开(公告)日：2025-03-27
申请号：US18975080
申请日：2024-12-10
Applicant: SEMES CO., LTD.
Inventor： Ki-Moon KANG , Seung Un OH
Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes first treating a substrate in a treating space according to a reference recipe; second treating a substrate in the treating space according to the reference recipe after the first treating; and optimizing an inner ambient of the treating space according to the reference recipe, and wherein the optimizing includes a purge operation of supplying and discharging a treating fluid to/from the treating space.
-
公开(公告)号：US20230207351A1
公开(公告)日：2023-06-29
申请号：US18147416
申请日：2022-12-28
Applicant: SEMES CO., LTD.
Inventor： Seung Un OH , In Ki JUNG , Shin Hwa KANG , Sang Hyeon RYU , Young Ho PARK
IPC: H01L21/67
CPC classification number: H01L21/67115 , H01L21/6715 , H01L21/67259 , H01L21/67253
Abstract: Provided is an apparatus for treating a substrate, which includes: a support unit supporting a substrate; a liquid supply unit supplying a treatment liquid to the substrate supported on the support unit; a heating unit heating a specific location of the substrate by irradiating a laser to the specific location on the substrate supported on the support unit, and swingably moved between the specific location of the substrate, and a waiting location of deviating from the substrate; a coordinate unit disposed below an irradiation end portion to which the laser is irradiated from the heating unit when the heating unit is positioned at the waiting location; and an image module monitoring the laser irradiated from the heating unit, in which the image module calculates a movement distance in which the heating unit is swingably moved on the coordinate unit to measure a first length in a longitudinal direction of the heating unit.
-
公开(公告)号：US20240152056A1
公开(公告)日：2024-05-09
申请号：US18502628
申请日：2023-11-06
Applicant: SEMES CO., LTD.
Inventor： Sang Gun LEE , Ki Hoon CHOI , Hyun YOON , Seung Un OH , Jin Yeong SUNG , Jang Jin LEE , Tae Shin KIM
Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes supplying a liquid to a substrate; and heating the substrate after the supplying the liquid, and wherein the supplying the liquid includes: supplying a first liquid to the substrate; and supplying a second liquid which is different from the first liquid to a substrate to which the first liquid is supplied, and wherein the second liquid is supplied as a test to the substrate and a contact angle between the second liquid which is supplied and the substrate is measured to determine a degree of hydrophilization of the substrate, and a supply mechanism of the second liquid supplied to the substrate is determined based on the degree of hydrophilization of the substrate which is determined, before the supplying the second liquid is performed.
-
公开(公告)号：US20230207349A1
公开(公告)日：2023-06-29
申请号：US18068675
申请日：2022-12-20
Applicant: SEMES CO., LTD.
Inventor： Kwang Sup KIM , Seung Un OH , Shin Hwa KANG , Sang Hyeon RYU , Young Ho PARK
CPC classification number: H01L21/67115 , B23K26/0823 , B23K26/0869 , B23K2103/56
Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a body including an irradiation end, from which laser light is irradiated, a shaft coupled to the body, and a driver that supplies power to the shaft, the heating unit is swung about an axis of the shaft, and the controller moves the irradiation end of the heating unit to a target location on a substrate by adjusting a rotation angle of the heating unit and a rotation angle of the support unit.
-
-
-
-
-
-
Search Results
7
records
(took 0.015 seconds)
