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公开(公告)号：US20250093768A1
公开(公告)日：2025-03-20
申请号：US18770090
申请日：2024-07-11
Applicant: SEMES CO., LTD. , SAMSUNG ELECTRONICS CO. LTD.
Inventor： Jin Yeong SUNG , Ki Hoon CHOI , Seung Un OH , Young Ho PARK , Sang Hyeon RYU , Jang Jin LEE , Hyun YOON , Sang Gun LEE , Yu Jin CHO , Ho Jong HWANG , Jong Ju PARK , Jong Keun OH , Yong Woo KIM
Abstract: A substrate processing apparatus is provided and includes: a support unit including a spin chuck and a centering jig that is on the spin chuck, the spin chuck configured to support and rotate a substrate; a spraying unit configured to spray processing liquid onto the substrate; a swing arm including a correction unit that includes a sensor and an emitter, the swing arm configured to move such that the correction unit moves to a target point on the substrate, and the emitter configured to irradiate a beam towards the substrate; and a controller configured to: control the spin chuck and the swing arm; and determine whether a movement trajectory of the swing arm is aligned with a rotation center of the spin chuck based on information acquired by the sensor about the centering jig.
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公开(公告)号：US20230206424A1
公开(公告)日：2023-06-29
申请号：US18075412
申请日：2022-12-06
Applicant: SEMES CO., LTD.
Inventor： Myeong Jun LIM , Kwang Sup KIM , Yeon Chul SONG , Ji Hoon YOO , Jong Min LEE , Jun Ho OH , Young Ho PARK
CPC classification number: G06T7/001 , G06T7/11 , G06T7/187 , B41J2/0451 , B41J2/04586 , G06T2207/20081 , G06T2207/20221 , G06T2207/20021 , G06T2207/30168 , G06T2207/30144
Abstract: Provided are a nozzle inspection unit configured to generate a large amount of defect data to improve detection accuracy of a defective nozzle, and a substrate treatment apparatus including the same. The nozzle inspection unit includes: a data collection module configured to collect a plurality of image data related to nozzles; a data classification module configured to classify the plurality of image data according to predefined classes; a data merging module configured to merge good image data related to a normal nozzle and defect image data related to a defective nozzle from among the plurality of image data; a data training module configured to train a plurality of merged image data obtained through the data merging module; and a defect data generation module configured to generate a plurality of final image data from the plurality of merged image data based on the training result.
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公开(公告)号：US20240153791A1
公开(公告)日：2024-05-09
申请号：US18502531
申请日：2023-11-06
Applicant: SEMES CO., LTD.
Inventor： Jin Yeong SUNG , Ki Hoon CHOI , Hyun YOON , Sang Hyeon RYU , Young Ho PARK
IPC: H01L21/67 , H01L21/687
CPC classification number: H01L21/67069 , H01L21/67115 , H01L21/68764
Abstract: The inventive concept provides a substrate treating method for etching a specific region on a substrate. The substrate treating method includes supplying a treating liquid to the substrate; and irradiating a laser to the specific region to locally heat the specific region; and wherein at the irradiating the laser, the laser is irradiated a plurality of times within the specific region, and the laser is irradiated to a region which does not overlap on the substrate, but which overlaps within the specific region.
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公开(公告)号：US20230203669A1
公开(公告)日：2023-06-29
申请号：US18145138
申请日：2022-12-22
Applicant: SEMES CO., LTD.
Inventor： Shin Hwa KANG , Seung Un OH , Young Ho PARK , Sang Hyeon RYU , Kwang Sup KIM
CPC classification number: C23F1/08 , H01L21/681
Abstract: Disclosed is a method for treating a substrate, on which a plurality of reference marks and a pattern are formed. The method includes a process preparing operation, a location information acquiring operation of acquiring information on an actual location of the pattern, and a process executing operation of supplying a treatment liquid to the substrate, and heating the substrate by irradiating laser light to the pattern on the substrate, to which the treatment liquid is applied, the location information acquiring operation includes acquiring information on actual locations of, among the plurality of reference marks, at least three reference marks, and acquiring information of the actual location of the pattern through the information of the actual locations of the reference marks.
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公开(公告)号：US20230168586A1
公开(公告)日：2023-06-01
申请号：US18059675
申请日：2022-11-29
Applicant: SEMES CO., LTD.
Inventor： Ki Hoon CHOI , In Ki JUNG , Hyo Won YANG , Sang Hyeon RYU , Young Ho PARK , Tae Hee KIM
CPC classification number: G03F7/162 , G03F7/709 , G03F7/7085 , G03F7/70525 , G03F7/70808
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing having a treating space; a support unit configured to support and rotate a substrate at the treating space; a liquid supply unit configured to supply a liquid to a substrate supported on the support unit; a post-treating unit configured to perform a post-treatment on the substrate supported on the support unit; and a monitoring unit configured to inspect a state of a liquid film formed of the liquid supplied onto the substrate.
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Patent Agency Ranking
公开(公告)号：US20230207351A1
公开(公告)日：2023-06-29
申请号：US18147416
申请日：2022-12-28
Applicant: SEMES CO., LTD.
Inventor： Seung Un OH , In Ki JUNG , Shin Hwa KANG , Sang Hyeon RYU , Young Ho PARK
IPC: H01L21/67
CPC classification number: H01L21/67115 , H01L21/6715 , H01L21/67259 , H01L21/67253
Abstract: Provided is an apparatus for treating a substrate, which includes: a support unit supporting a substrate; a liquid supply unit supplying a treatment liquid to the substrate supported on the support unit; a heating unit heating a specific location of the substrate by irradiating a laser to the specific location on the substrate supported on the support unit, and swingably moved between the specific location of the substrate, and a waiting location of deviating from the substrate; a coordinate unit disposed below an irradiation end portion to which the laser is irradiated from the heating unit when the heating unit is positioned at the waiting location; and an image module monitoring the laser irradiated from the heating unit, in which the image module calculates a movement distance in which the heating unit is swingably moved on the coordinate unit to measure a first length in a longitudinal direction of the heating unit.
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公开(公告)号：US20230206415A1
公开(公告)日：2023-06-29
申请号：US18076401
申请日：2022-12-07
Applicant: SEMES CO., LTD.
Inventor： Ji Hoon YOO , Kwang Sup KIM , Jong Min LEE , Yeon Chul SONG , Jun Ho OH , Young Ho PARK , Myeong Jun LIM
IPC: G06T7/00 , H04N1/034 , G06V10/44 , G06V10/762 , G06V10/764
CPC classification number: G06T7/0002 , H04N1/034 , G06V10/44 , G06V10/762 , G06V10/764
Abstract: Provided are a substrate inspecting unit capable of reducing image data labeling work time through training image data set verification and semi-automatic image labeling, and at the same time, improving prediction performance by improving classification accuracy for data sets, and a substrate treating apparatus including the same. The substrate inspecting unit comprises a feature extracting module for extracting a feature from training data included in each class in response to a plurality of training data related to image data of a substrate being classified according to a predefined class, a validity evaluating module for evaluating validity of the feature, a class verifying module for verifying the predefined class, and a data reconstructing module for reconstructing the plurality of training data based on a feature determined as valid and a verified class, wherein reconstructed training data is utilized when inspecting the substrate.
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公开(公告)号：US20230204648A1
公开(公告)日：2023-06-29
申请号：US17837027
申请日：2022-06-10
Applicant: SEMES CO., LTD.
Inventor： Jun Ho OH , Kwang Sup KIM , Jae Hong KIM , Kyung Hun JANG , Young Ho PARK , Jong Min LEE , Yeon Chul SONG , Sang Min HA , Ji Hoon YOO , Myeong Jun LIM
IPC: G01R29/24
CPC classification number: G01R29/24
Abstract: A static electricity visualization apparatus capable of visually identifying a measured level of static electricity is provided. The static electricity visualization apparatus comprises a photographing unit for generating a first photographed image obtained by photographing a measurement target at a first distance from the measurement target in a first mode, and generating a second photographed image obtained by photographing the measurement target at a second distance from the measurement target in a second mode, a static electricity sensor for measuring a static electricity level of the measurement target at the second distance from the measurement target, a processor for matching the second photographed image with the first photographed image, and an output unit for outputting a static electricity visualization image that visualizes a static electricity level measured by the static electricity sensor on the first photographed image, wherein the static electricity visualization image comprises a color corresponding to the static electricity level of the measurement target measured by the static electricity sensor at a position where the second photographed image matches on the first photographed image.
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公开(公告)号：US20220072848A1
公开(公告)日：2022-03-10
申请号：US17467266
申请日：2021-09-05
Applicant: SEMES CO., LTD.
Inventor： Kwang Sup KIM , Dong Ok AHN , Jong Min LEE , Jun Ho OH , Ji Hoon YOO , Young Ho PARK
Abstract: Disclosed are an apparatus and a method for quickly and accurately inspecting a droplet on a substrate. An apparatus for inspecting a droplet on a substrate according to an exemplary embodiment of the present disclosure includes: an ultrasonic sensor configured to apply an ultrasonic wave to a droplet on the substrate and detect an ultrasonic wave reflected from the substrate; and a processor configured to acquire a height of the droplet at each position on the substrate on the basis of a signal of the ultrasonic wave reflected from the droplet on the substrate, calculate a volume of the droplet on the basis of the heights of the droplet at the positions, and store or output data in relation to the volume of the droplet. The embodiment of the present disclosure may calculate the volume of the droplet using the ultrasonic wave, thereby quickly and accurately inspecting the droplet on the substrate.
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公开(公告)号：US20240118607A1
公开(公告)日：2024-04-11
申请号：US18183628
申请日：2023-03-14
Applicant: SEMES CO.,LTD.
Inventor： Hyun YOON , Ki Hoon CHOI , Seung Un OH , Young Ho PARK , Sang Hyeon RYU , Tae Hee KIM , Sang Gun LEE
CPC classification number: G03F1/80 , G03F1/82 , G03F7/168 , G03F7/202 , G03F7/3057 , G03F7/70733 , G03F7/70775
Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes pre-treating a substrate by cleaning the substrate; etching the substrate by supplying an etchant and heating a substrate supplied with the etchant; and post-treating the substrate after the etching the substrate, and wherein the pre-treating the substrate, the etching the substrate, and the post-treating the substrate are each performed in different chambers, a substrate on which the pre-treating the substrate is completed is transferred in a dry state to a chamber at which the etching the substrate is performed, and a substrate on which the etching the substrate is completed is transferred in a wetted state with a liquid to a chamber at which the post-treating the substrate is performed.
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