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公开(公告)号:US20230204414A1
公开(公告)日:2023-06-29
申请号:US17979149
申请日:2022-11-02
Applicant: SEMES CO., LTD.
Inventor: Hyun YOON , Ki Hoon CHOI , Tae Hee KIM , Ji Hoon JEONG
CPC classification number: G01J1/4257 , G01J1/0271 , G03F7/2053
Abstract: The present invention provides a substrate treating apparatus including: support unit is configured to support and rotate a substrate in a treatment space; a liquid supply unit is configured to supply a liquid to the substrate supported by the support unit; a laser unit including a laser irradiation unit which irradiates laser light to the substrate supported by the support unit; a home port providing a standby position in which the laser unit waits; and a moving unit for moving the laser unit between a process position in which the laser light is irradiated to the substrate and the standby position, in which the home port detects a characteristic of the laser light from the laser light irradiated by the laser unit.
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公开(公告)号:US20210013029A1
公开(公告)日:2021-01-14
申请号:US16920418
申请日:2020-07-02
Applicant: SEMES CO., LTD.
Inventor: Do Yeon KIM , Se Hoon OH , Won Geun KIM , Ju Mi LEE , Ho Jong HWANG , Pil Kyun HEO , Hyun YOON , Choong Hyun LEE , Hyun Goo PARK
Abstract: Provided is a substrate treatment apparatus including a treatment container equipped with a conductive member. The conductive member is made of a material having a lower resistivity than that of the treatment container. The conductive member prevents a rise of an electric potential of the treatment container, which is caused by charging during treatment of a substrate, thereby preventing the substrate from being contaminated and damaged by particles and electrostatic arcing.
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公开(公告)号:US20240216957A1
公开(公告)日:2024-07-04
申请号:US18386914
申请日:2023-11-03
Applicant: SEMES CO., LTD.
Inventor: Sun Wook JUNG , Hyun YOON , Ha Neul YOO , Ho Jong HWANG
CPC classification number: B08B3/022 , B08B13/00 , H01L21/67051
Abstract: According to the present disclosure, provided is a bowl receiving incident droplets and preventing the same from scattering, or causing the same to scatter downwardly, the bowl including: a main body surrounding a substrate support unit; a groove formed in a spiral shape in at least a portion of an inner surface of the main body; and a separation wall disposed between adjacent grooves in a vertical direction on the inner surface of the main body, wherein a thickness at a first position in the main body in which the groove is formed is greater than a thickness at a second position, lower than the first position.
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公开(公告)号:US20240118607A1
公开(公告)日:2024-04-11
申请号:US18183628
申请日:2023-03-14
Applicant: SEMES CO.,LTD.
Inventor: Hyun YOON , Ki Hoon CHOI , Seung Un OH , Young Ho PARK , Sang Hyeon RYU , Tae Hee KIM , Sang Gun LEE
CPC classification number: G03F1/80 , G03F1/82 , G03F7/168 , G03F7/202 , G03F7/3057 , G03F7/70733 , G03F7/70775
Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes pre-treating a substrate by cleaning the substrate; etching the substrate by supplying an etchant and heating a substrate supplied with the etchant; and post-treating the substrate after the etching the substrate, and wherein the pre-treating the substrate, the etching the substrate, and the post-treating the substrate are each performed in different chambers, a substrate on which the pre-treating the substrate is completed is transferred in a dry state to a chamber at which the etching the substrate is performed, and a substrate on which the etching the substrate is completed is transferred in a wetted state with a liquid to a chamber at which the post-treating the substrate is performed.
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公开(公告)号:US20230286713A1
公开(公告)日:2023-09-14
申请号:US17693807
申请日:2022-03-14
Applicant: SEMES CO., LTD.
Inventor: Hyun YOON , Ho Jong HWANG , Young Jin KIM
Abstract: The present invention relates to a bowl including a collection container having an inner surface, and an outer surface disposed opposite to the inner surface, in which a pattern is formed on the inner surface.
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公开(公告)号:US20230084076A1
公开(公告)日:2023-03-16
申请号:US17943452
申请日:2022-09-13
Applicant: SEMES CO., LTD.
Inventor: Hyun YOON , Ki Hoon CHOI , Tae Hee KIM , Hyo Won YANG , Young Dae CHUNG , Ji Hoon JEONG
IPC: H01L21/268 , H01L21/67 , G03F1/70
Abstract: The inventive concept provides a mask treating apparatus. The mask treating apparatus includes a support unit configured to support and rotate a mask, the mask having a first pattern within a plurality of cells thereof and a second pattern outside regions of the plurality of cells; a heating unit including a laser irradiation module and a moving module, the laser irradiation module having a laser irradiator for irradiating a laser light to the second pattern, the moving module configured to change a position of the laser irradiation module; and a controller configured to control the support unit and the heating unit, and wherein when a treating position is divided into four equal parts from a first quadrant to a fourth quadrant based on a center of the mask, the laser irradiator is positioned at the fourth quadrant and the first quadrant in a direction linearly moving from a standby position to the treating position, positioned at the third quadrant in a direction which is perpendicular to the fourth quadrant, and positioned at the second quadrant in a direction which is perpendicular to the first quadrant, and wherein the controller controls a rotation of the support unit so the second pattern is positioned at the fourth quadrant.
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公开(公告)号:US20240152056A1
公开(公告)日:2024-05-09
申请号:US18502628
申请日:2023-11-06
Applicant: SEMES CO., LTD.
Inventor: Sang Gun LEE , Ki Hoon CHOI , Hyun YOON , Seung Un OH , Jin Yeong SUNG , Jang Jin LEE , Tae Shin KIM
Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes supplying a liquid to a substrate; and heating the substrate after the supplying the liquid, and wherein the supplying the liquid includes: supplying a first liquid to the substrate; and supplying a second liquid which is different from the first liquid to a substrate to which the first liquid is supplied, and wherein the second liquid is supplied as a test to the substrate and a contact angle between the second liquid which is supplied and the substrate is measured to determine a degree of hydrophilization of the substrate, and a supply mechanism of the second liquid supplied to the substrate is determined based on the degree of hydrophilization of the substrate which is determined, before the supplying the second liquid is performed.
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公开(公告)号:US20230205091A1
公开(公告)日:2023-06-29
申请号:US18066380
申请日:2022-12-15
Applicant: SEMES CO., LTD.
Inventor: Hyun YOON , Ki Hoon CHOI , Hyo Won YANG , Tae Hee KIM , In Ki JUNG
IPC: G03F7/20
CPC classification number: G03F7/2041
Abstract: Disclosed is a substrate treating apparatus including a support unit that supports and rotates a substrate, a heating unit including a laser irradiator that irradiates laser light in a pattern formed in the substrate, a movement module that changes a location of the laser irradiator by moving the heating unit, and a controller that controls the support unit and the heating unit, the movement module moves the heating unit between a heating location, at which the laser light is irradiated to the substrate, and a standby location that deviates from the substrate, and the movement module rotates and linearly moves the heating unit.
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公开(公告)号:US20230205077A1
公开(公告)日:2023-06-29
申请号:US18146693
申请日:2022-12-27
Applicant: SEMES CO., LTD.
Inventor: Tae Hee KIM , In Ki JUNG , Ki Hoon CHOI , Hyo Won YANG , Won Sik SON , Hyun YOON
IPC: G03F1/72
CPC classification number: G03F1/72
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing; a support unit positioned within the housing and configured to support a substrate; a liquid supply unit configured to supply a treating liquid to the substrate supported on the support unit; and a laser module configured to irradiate a laser to the substrate to which the treating liquid is supplied; and a vision module for monitoring a point at which the laser is irradiated among the substrate.
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公开(公告)号:US20230067973A1
公开(公告)日:2023-03-02
申请号:US17901941
申请日:2022-09-02
Applicant: SEMES CO., LTD.
Inventor: Tae Hee KIM , Ki Hoon CHOI , Hyun YOON , Won Sik SON , Hyo Won YANG , In Ki JUNG
Abstract: The inventive concept provides a mask treating apparatus. The mask treating apparatus includes a support unit configured to support and rotate a mask, the mask having a first pattern within a plurality of cells thereof and a second pattern outside regions of the plurality of cells; and a heating unit having a laser irradiator for irradiating a laser light to a specific region of the mask supported on the support unit, and a controller configured to control the support unit and the heating unit, and wherein the support unit includes: a support part for supporting the mask; and a moving stage part configured to move a position of the support part, and wherein the controller controls the moving stage part so a position of the mask supported on the support part is changed so the second pattern is positioned at the specific region.
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