DETECTING UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME

    公开(公告)号:US20230204414A1

    公开(公告)日:2023-06-29

    申请号:US17979149

    申请日:2022-11-02

    CPC classification number: G01J1/4257 G01J1/0271 G03F7/2053

    Abstract: The present invention provides a substrate treating apparatus including: support unit is configured to support and rotate a substrate in a treatment space; a liquid supply unit is configured to supply a liquid to the substrate supported by the support unit; a laser unit including a laser irradiation unit which irradiates laser light to the substrate supported by the support unit; a home port providing a standby position in which the laser unit waits; and a moving unit for moving the laser unit between a process position in which the laser light is irradiated to the substrate and the standby position, in which the home port detects a characteristic of the laser light from the laser light irradiated by the laser unit.

    APPARATUS AND METHOD FOR TREATING SUBSTRATE

    公开(公告)号:US20230084076A1

    公开(公告)日:2023-03-16

    申请号:US17943452

    申请日:2022-09-13

    Abstract: The inventive concept provides a mask treating apparatus. The mask treating apparatus includes a support unit configured to support and rotate a mask, the mask having a first pattern within a plurality of cells thereof and a second pattern outside regions of the plurality of cells; a heating unit including a laser irradiation module and a moving module, the laser irradiation module having a laser irradiator for irradiating a laser light to the second pattern, the moving module configured to change a position of the laser irradiation module; and a controller configured to control the support unit and the heating unit, and wherein when a treating position is divided into four equal parts from a first quadrant to a fourth quadrant based on a center of the mask, the laser irradiator is positioned at the fourth quadrant and the first quadrant in a direction linearly moving from a standby position to the treating position, positioned at the third quadrant in a direction which is perpendicular to the fourth quadrant, and positioned at the second quadrant in a direction which is perpendicular to the first quadrant, and wherein the controller controls a rotation of the support unit so the second pattern is positioned at the fourth quadrant.

    METHOD FOR TREATING A SUBSTRATE
    7.
    发明公开

    公开(公告)号:US20240152056A1

    公开(公告)日:2024-05-09

    申请号:US18502628

    申请日:2023-11-06

    CPC classification number: G03F7/423 G03F7/40

    Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes supplying a liquid to a substrate; and heating the substrate after the supplying the liquid, and wherein the supplying the liquid includes: supplying a first liquid to the substrate; and supplying a second liquid which is different from the first liquid to a substrate to which the first liquid is supplied, and wherein the second liquid is supplied as a test to the substrate and a contact angle between the second liquid which is supplied and the substrate is measured to determine a degree of hydrophilization of the substrate, and a supply mechanism of the second liquid supplied to the substrate is determined based on the degree of hydrophilization of the substrate which is determined, before the supplying the second liquid is performed.

    SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD

    公开(公告)号:US20230205091A1

    公开(公告)日:2023-06-29

    申请号:US18066380

    申请日:2022-12-15

    CPC classification number: G03F7/2041

    Abstract: Disclosed is a substrate treating apparatus including a support unit that supports and rotates a substrate, a heating unit including a laser irradiator that irradiates laser light in a pattern formed in the substrate, a movement module that changes a location of the laser irradiator by moving the heating unit, and a controller that controls the support unit and the heating unit, the movement module moves the heating unit between a heating location, at which the laser light is irradiated to the substrate, and a standby location that deviates from the substrate, and the movement module rotates and linearly moves the heating unit.

    APPARATUS AND METHOD FOR TREATING SUBSTRATE
    9.
    发明公开

    公开(公告)号:US20230205077A1

    公开(公告)日:2023-06-29

    申请号:US18146693

    申请日:2022-12-27

    CPC classification number: G03F1/72

    Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing; a support unit positioned within the housing and configured to support a substrate; a liquid supply unit configured to supply a treating liquid to the substrate supported on the support unit; and a laser module configured to irradiate a laser to the substrate to which the treating liquid is supplied; and a vision module for monitoring a point at which the laser is irradiated among the substrate.

    APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING A SUBSTRATE

    公开(公告)号:US20230067973A1

    公开(公告)日:2023-03-02

    申请号:US17901941

    申请日:2022-09-02

    Abstract: The inventive concept provides a mask treating apparatus. The mask treating apparatus includes a support unit configured to support and rotate a mask, the mask having a first pattern within a plurality of cells thereof and a second pattern outside regions of the plurality of cells; and a heating unit having a laser irradiator for irradiating a laser light to a specific region of the mask supported on the support unit, and a controller configured to control the support unit and the heating unit, and wherein the support unit includes: a support part for supporting the mask; and a moving stage part configured to move a position of the support part, and wherein the controller controls the moving stage part so a position of the mask supported on the support part is changed so the second pattern is positioned at the specific region.

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