SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD

    公开(公告)号:US20230205091A1

    公开(公告)日:2023-06-29

    申请号:US18066380

    申请日:2022-12-15

    CPC classification number: G03F7/2041

    Abstract: Disclosed is a substrate treating apparatus including a support unit that supports and rotates a substrate, a heating unit including a laser irradiator that irradiates laser light in a pattern formed in the substrate, a movement module that changes a location of the laser irradiator by moving the heating unit, and a controller that controls the support unit and the heating unit, the movement module moves the heating unit between a heating location, at which the laser light is irradiated to the substrate, and a standby location that deviates from the substrate, and the movement module rotates and linearly moves the heating unit.

    APPARATUS AND METHOD FOR TREATING SUBSTRATE
    2.
    发明公开

    公开(公告)号:US20230205077A1

    公开(公告)日:2023-06-29

    申请号:US18146693

    申请日:2022-12-27

    CPC classification number: G03F1/72

    Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing; a support unit positioned within the housing and configured to support a substrate; a liquid supply unit configured to supply a treating liquid to the substrate supported on the support unit; and a laser module configured to irradiate a laser to the substrate to which the treating liquid is supplied; and a vision module for monitoring a point at which the laser is irradiated among the substrate.

    APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING A SUBSTRATE

    公开(公告)号:US20230067973A1

    公开(公告)日:2023-03-02

    申请号:US17901941

    申请日:2022-09-02

    Abstract: The inventive concept provides a mask treating apparatus. The mask treating apparatus includes a support unit configured to support and rotate a mask, the mask having a first pattern within a plurality of cells thereof and a second pattern outside regions of the plurality of cells; and a heating unit having a laser irradiator for irradiating a laser light to a specific region of the mask supported on the support unit, and a controller configured to control the support unit and the heating unit, and wherein the support unit includes: a support part for supporting the mask; and a moving stage part configured to move a position of the support part, and wherein the controller controls the moving stage part so a position of the mask supported on the support part is changed so the second pattern is positioned at the specific region.

    APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING A SUBSTRATE

    公开(公告)号:US20230185206A1

    公开(公告)日:2023-06-15

    申请号:US17901103

    申请日:2022-09-01

    CPC classification number: G03F7/70875 G03F7/70025

    Abstract: The inventive concept provides a mask treating apparatus. The mask treating apparatus includes a support unit configured to support and rotate a mask, the mask having a first pattern within a plurality of cells thereof and a second pattern outside regions of the plurality of cells; a heating unit including a laser irradiation module and a moving module, the laser irradiation module having a laser irradiator for irradiating a laser light to the second pattern, the moving module configured to change a position of the laser irradiation module; and a controller configured to control the support unit and the heating unit, and wherein when a treating position is divided into four equal parts from a first quadrant to a fourth quadrant based on a center of the mask, the laser irradiator is positioned at the fourth quadrant and the first quadrant in a direction linearly moving from a standby position to the treating position, positioned at the third quadrant in a direction which is perpendicular to the fourth quadrant, and positioned at the second quadrant in a direction which is perpendicular to the first quadrant, and wherein the controller controls a rotation of the support unit so the second pattern is positioned at the fourth quadrant.

    IRRADIATING MODULE, AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME

    公开(公告)号:US20230205100A1

    公开(公告)日:2023-06-29

    申请号:US17864506

    申请日:2022-07-14

    CPC classification number: G03F7/70891

    Abstract: The present invention provides a substrate treating apparatus including: a support unit supporting and rotating the substrate in a treatment space; a liquid supply unit supplying a liquid to the substrate supported by the support unit; and an irradiating module irradiating light to the substrate supported by the support unit, in which the irradiating module includes: a housing having an accommodation space; a laser unit located in the accommodation space, and including a laser irradiation unit irradiating laser light, and an irradiation end having one end protruding from the housing and irradiating the laser light irradiated from the laser irradiation unit to the substrate supported by the support unit; and a cooling unit located in the accommodation space and cooling the laser irradiation unit.

Patent Agency Ranking