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公开(公告)号:US20230205091A1
公开(公告)日:2023-06-29
申请号:US18066380
申请日:2022-12-15
Applicant: SEMES CO., LTD.
Inventor: Hyun YOON , Ki Hoon CHOI , Hyo Won YANG , Tae Hee KIM , In Ki JUNG
IPC: G03F7/20
CPC classification number: G03F7/2041
Abstract: Disclosed is a substrate treating apparatus including a support unit that supports and rotates a substrate, a heating unit including a laser irradiator that irradiates laser light in a pattern formed in the substrate, a movement module that changes a location of the laser irradiator by moving the heating unit, and a controller that controls the support unit and the heating unit, the movement module moves the heating unit between a heating location, at which the laser light is irradiated to the substrate, and a standby location that deviates from the substrate, and the movement module rotates and linearly moves the heating unit.
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公开(公告)号:US20230205077A1
公开(公告)日:2023-06-29
申请号:US18146693
申请日:2022-12-27
Applicant: SEMES CO., LTD.
Inventor: Tae Hee KIM , In Ki JUNG , Ki Hoon CHOI , Hyo Won YANG , Won Sik SON , Hyun YOON
IPC: G03F1/72
CPC classification number: G03F1/72
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing; a support unit positioned within the housing and configured to support a substrate; a liquid supply unit configured to supply a treating liquid to the substrate supported on the support unit; and a laser module configured to irradiate a laser to the substrate to which the treating liquid is supplied; and a vision module for monitoring a point at which the laser is irradiated among the substrate.
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公开(公告)号:US20230067973A1
公开(公告)日:2023-03-02
申请号:US17901941
申请日:2022-09-02
Applicant: SEMES CO., LTD.
Inventor: Tae Hee KIM , Ki Hoon CHOI , Hyun YOON , Won Sik SON , Hyo Won YANG , In Ki JUNG
Abstract: The inventive concept provides a mask treating apparatus. The mask treating apparatus includes a support unit configured to support and rotate a mask, the mask having a first pattern within a plurality of cells thereof and a second pattern outside regions of the plurality of cells; and a heating unit having a laser irradiator for irradiating a laser light to a specific region of the mask supported on the support unit, and a controller configured to control the support unit and the heating unit, and wherein the support unit includes: a support part for supporting the mask; and a moving stage part configured to move a position of the support part, and wherein the controller controls the moving stage part so a position of the mask supported on the support part is changed so the second pattern is positioned at the specific region.
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公开(公告)号:US20240131624A1
公开(公告)日:2024-04-25
申请号:US18480393
申请日:2023-10-02
Applicant: SEMES CO., LTD.
Inventor: Tae Shin KIM , Ki Hoon CHOI , Tae Hee KIM , Sang Gun LEE , Jin Yeong SUNG , Jang Jin LEE
IPC: B23K26/12 , B23K26/08 , B23K26/362 , H01L21/768
CPC classification number: B23K26/128 , B23K26/0884 , B23K26/362 , H01L21/76894 , B23K2101/40
Abstract: Embodiments of the inventive concept provide a substrate treating apparatus and a substrate treating method for not letting an irradiation region of a laser deviate from a target region, even if a shaking angle of a chemical deviates from an allowable range due to a vibration or an airflow. The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes: a substrate support unit configured to support a substrate having a chemical coated thereon; a laser generation unit configured to irradiate a laser to the substrate; and a light-transmitter positioned along a path at which the laser is irradiated.
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公开(公告)号:US20230185206A1
公开(公告)日:2023-06-15
申请号:US17901103
申请日:2022-09-01
Applicant: SEMES CO., LTD.
Inventor: Tae Hee KIM , Ki Hoon CHOI , Hyun YOON , Won Sik SON , Hyo Won YANG , In Ki JUNG
IPC: G03F7/20
CPC classification number: G03F7/70875 , G03F7/70025
Abstract: The inventive concept provides a mask treating apparatus. The mask treating apparatus includes a support unit configured to support and rotate a mask, the mask having a first pattern within a plurality of cells thereof and a second pattern outside regions of the plurality of cells; a heating unit including a laser irradiation module and a moving module, the laser irradiation module having a laser irradiator for irradiating a laser light to the second pattern, the moving module configured to change a position of the laser irradiation module; and a controller configured to control the support unit and the heating unit, and wherein when a treating position is divided into four equal parts from a first quadrant to a fourth quadrant based on a center of the mask, the laser irradiator is positioned at the fourth quadrant and the first quadrant in a direction linearly moving from a standby position to the treating position, positioned at the third quadrant in a direction which is perpendicular to the fourth quadrant, and positioned at the second quadrant in a direction which is perpendicular to the first quadrant, and wherein the controller controls a rotation of the support unit so the second pattern is positioned at the fourth quadrant.
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公开(公告)号:US20220390848A1
公开(公告)日:2022-12-08
申请号:US17834154
申请日:2022-06-07
Applicant: SEMES CO., LTD.
Inventor: Ki Hoon CHOI , Se Hoon OH , Young Dae CHUNG , Tae Hee KIM , Young Eun JEON
Abstract: The present invention provides a substrate treating apparatus including: a support unit for supporting and rotating a substrate on which a first pattern and a second pattern different from the first pattern are formed; a liquid supply unit for supplying a treatment liquid to the substrate supported on the support unit; and a heating unit for heating any one of the first pattern and the second pattern.
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公开(公告)号:US20240227075A9
公开(公告)日:2024-07-11
申请号:US18480393
申请日:2023-10-03
Applicant: SEMES CO., LTD.
Inventor: Tae Shin KIM , Ki Hoon CHOI , Tae Hee KIM , Sang Gun LEE , Jin Yeong SUNG , Jang Jin LEE
IPC: B23K26/12 , B23K26/08 , B23K26/362 , H01L21/768
CPC classification number: B23K26/128 , B23K26/0884 , B23K26/362 , H01L21/76894 , B23K2101/40
Abstract: Embodiments of the inventive concept provide a substrate treating apparatus and a substrate treating method for not letting an irradiation region of a laser deviate from a target region, even if a shaking angle of a chemical deviates from an allowable range due to a vibration or an airflow. The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes: a substrate support unit configured to support a substrate having a chemical coated thereon; a laser generation unit configured to irradiate a laser to the substrate; and a light-transmitter positioned along a path at which the laser is irradiated.
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公开(公告)号:US20230205100A1
公开(公告)日:2023-06-29
申请号:US17864506
申请日:2022-07-14
Applicant: SEMES CO., LTD.
Inventor: Won Sik SON , Hyun YOON , Ki Hoon CHOI , Hyo Won YANG , Tae Hee KIM , In Ki JUNG
IPC: G03F7/20
CPC classification number: G03F7/70891
Abstract: The present invention provides a substrate treating apparatus including: a support unit supporting and rotating the substrate in a treatment space; a liquid supply unit supplying a liquid to the substrate supported by the support unit; and an irradiating module irradiating light to the substrate supported by the support unit, in which the irradiating module includes: a housing having an accommodation space; a laser unit located in the accommodation space, and including a laser irradiation unit irradiating laser light, and an irradiation end having one end protruding from the housing and irradiating the laser light irradiated from the laser irradiation unit to the substrate supported by the support unit; and a cooling unit located in the accommodation space and cooling the laser irradiation unit.
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公开(公告)号:US20230168586A1
公开(公告)日:2023-06-01
申请号:US18059675
申请日:2022-11-29
Applicant: SEMES CO., LTD.
Inventor: Ki Hoon CHOI , In Ki JUNG , Hyo Won YANG , Sang Hyeon RYU , Young Ho PARK , Tae Hee KIM
CPC classification number: G03F7/162 , G03F7/709 , G03F7/7085 , G03F7/70525 , G03F7/70808
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing having a treating space; a support unit configured to support and rotate a substrate at the treating space; a liquid supply unit configured to supply a liquid to a substrate supported on the support unit; a post-treating unit configured to perform a post-treatment on the substrate supported on the support unit; and a monitoring unit configured to inspect a state of a liquid film formed of the liquid supplied onto the substrate.
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公开(公告)号:US20240118607A1
公开(公告)日:2024-04-11
申请号:US18183628
申请日:2023-03-14
Applicant: SEMES CO.,LTD.
Inventor: Hyun YOON , Ki Hoon CHOI , Seung Un OH , Young Ho PARK , Sang Hyeon RYU , Tae Hee KIM , Sang Gun LEE
CPC classification number: G03F1/80 , G03F1/82 , G03F7/168 , G03F7/202 , G03F7/3057 , G03F7/70733 , G03F7/70775
Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes pre-treating a substrate by cleaning the substrate; etching the substrate by supplying an etchant and heating a substrate supplied with the etchant; and post-treating the substrate after the etching the substrate, and wherein the pre-treating the substrate, the etching the substrate, and the post-treating the substrate are each performed in different chambers, a substrate on which the pre-treating the substrate is completed is transferred in a dry state to a chamber at which the etching the substrate is performed, and a substrate on which the etching the substrate is completed is transferred in a wetted state with a liquid to a chamber at which the post-treating the substrate is performed.
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