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公开(公告)号：US20230204414A1
公开(公告)日：2023-06-29
申请号：US17979149
申请日：2022-11-02
Applicant: SEMES CO., LTD.
Inventor： Hyun YOON , Ki Hoon CHOI , Tae Hee KIM , Ji Hoon JEONG
CPC classification number: G01J1/4257 , G01J1/0271 , G03F7/2053
Abstract: The present invention provides a substrate treating apparatus including: support unit is configured to support and rotate a substrate in a treatment space; a liquid supply unit is configured to supply a liquid to the substrate supported by the support unit; a laser unit including a laser irradiation unit which irradiates laser light to the substrate supported by the support unit; a home port providing a standby position in which the laser unit waits; and a moving unit for moving the laser unit between a process position in which the laser light is irradiated to the substrate and the standby position, in which the home port detects a characteristic of the laser light from the laser light irradiated by the laser unit.
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公开(公告)号：US20240118607A1
公开(公告)日：2024-04-11
申请号：US18183628
申请日：2023-03-14
Applicant: SEMES CO.,LTD.
Inventor： Hyun YOON , Ki Hoon CHOI , Seung Un OH , Young Ho PARK , Sang Hyeon RYU , Tae Hee KIM , Sang Gun LEE
CPC classification number: G03F1/80 , G03F1/82 , G03F7/168 , G03F7/202 , G03F7/3057 , G03F7/70733 , G03F7/70775
Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes pre-treating a substrate by cleaning the substrate; etching the substrate by supplying an etchant and heating a substrate supplied with the etchant; and post-treating the substrate after the etching the substrate, and wherein the pre-treating the substrate, the etching the substrate, and the post-treating the substrate are each performed in different chambers, a substrate on which the pre-treating the substrate is completed is transferred in a dry state to a chamber at which the etching the substrate is performed, and a substrate on which the etching the substrate is completed is transferred in a wetted state with a liquid to a chamber at which the post-treating the substrate is performed.
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公开(公告)号：US20230350304A1
公开(公告)日：2023-11-02
申请号：US17732565
申请日：2022-04-29
Applicant: SEMES CO, LTD.
Inventor： Hae Won CHOI , Joon Ho WON , Koriakin ANTON , Ki Hoon CHOI , Eung Su KIM , Pil Kyun HEO , Min Woo KIM , Jin Yeong SUNG , Hyo Soo KIM
CPC classification number: G03F7/3021 , G03F7/327
Abstract: There are provided an apparatus and a method for providing a substrate, which can suppress any additional reaction between a developing solution and a photoresist (PR) film and prevent any PR remnants from being generated from such additional reaction. The method includes: supplying an organic developing solution onto a substrate while rotating the substrate at a first revolutions per minute (rpm); substituting the organic developing solution with a nonpolar rinse solution by supplying the nonpolar rinse solution onto the substrate while rotating the substrate at a second rpm, which is lower than the first rpm; continuing to supply the nonpolar rinse solution while rotating the substrate at a third rpm, which is higher than the second rpm; and continuing to supply the nonpolar rinse solution while rotating the substrate at a fourth rpm, which is between the second rpm and the third rpm.
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公开(公告)号：US20230084076A1
公开(公告)日：2023-03-16
申请号：US17943452
申请日：2022-09-13
Applicant: SEMES CO., LTD.
Inventor： Hyun YOON , Ki Hoon CHOI , Tae Hee KIM , Hyo Won YANG , Young Dae CHUNG , Ji Hoon JEONG
IPC: H01L21/268 , H01L21/67 , G03F1/70
Abstract: The inventive concept provides a mask treating apparatus. The mask treating apparatus includes a support unit configured to support and rotate a mask, the mask having a first pattern within a plurality of cells thereof and a second pattern outside regions of the plurality of cells; a heating unit including a laser irradiation module and a moving module, the laser irradiation module having a laser irradiator for irradiating a laser light to the second pattern, the moving module configured to change a position of the laser irradiation module; and a controller configured to control the support unit and the heating unit, and wherein when a treating position is divided into four equal parts from a first quadrant to a fourth quadrant based on a center of the mask, the laser irradiator is positioned at the fourth quadrant and the first quadrant in a direction linearly moving from a standby position to the treating position, positioned at the third quadrant in a direction which is perpendicular to the fourth quadrant, and positioned at the second quadrant in a direction which is perpendicular to the first quadrant, and wherein the controller controls a rotation of the support unit so the second pattern is positioned at the fourth quadrant.
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公开(公告)号：US20220290921A1
公开(公告)日：2022-09-15
申请号：US17692395
申请日：2022-03-11
Applicant: SEMES CO., LTD.
Inventor： Hae-Won CHOI , Anton KORIAKIN , Joon Ho WON , Min Woo KIM , Ki Hoon CHOI , Eung Su KIM , Tae Hee KIM , Pil Kyun HEO , Jang Jin LEE , Jin Yeong SUNG
IPC: F26B5/00
Abstract: The inventive concept provides a method for treating a substrate. The method for treating a substrate comprises: a pressurization step for increasing a pressure of an inner space of a chamber by supplying a treating fluid to the inner space, after taking the substrate into the inner space; a flow step for generating a flow of the treating fluid by combination of supplying and discharging the treating fluid to and from the inner space; and a depressurization step of decreasing the pressure of the inner space by discharging the treating fluid from the inner space, and wherein the pressurization step comprises: a bottom side supply process for increasing the pressure of the inner space by supplying the treating fluid to a backside of the substrate taken into the inner space;
and a top side supply process of increasing the pressure of the inner space by supplying the treating fluid to a top side of the substrate taken into the inner space.-
Patent Agency Ranking
公开(公告)号：US20240227075A9
公开(公告)日：2024-07-11
申请号：US18480393
申请日：2023-10-03
Applicant: SEMES CO., LTD.
Inventor： Tae Shin KIM , Ki Hoon CHOI , Tae Hee KIM , Sang Gun LEE , Jin Yeong SUNG , Jang Jin LEE
IPC: B23K26/12 , B23K26/08 , B23K26/362 , H01L21/768
CPC classification number: B23K26/128 , B23K26/0884 , B23K26/362 , H01L21/76894 , B23K2101/40
Abstract: Embodiments of the inventive concept provide a substrate treating apparatus and a substrate treating method for not letting an irradiation region of a laser deviate from a target region, even if a shaking angle of a chemical deviates from an allowable range due to a vibration or an airflow. The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes: a substrate support unit configured to support a substrate having a chemical coated thereon; a laser generation unit configured to irradiate a laser to the substrate; and a light-transmitter positioned along a path at which the laser is irradiated.
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公开(公告)号：US20240153791A1
公开(公告)日：2024-05-09
申请号：US18502531
申请日：2023-11-06
Applicant: SEMES CO., LTD.
Inventor： Jin Yeong SUNG , Ki Hoon CHOI , Hyun YOON , Sang Hyeon RYU , Young Ho PARK
IPC: H01L21/67 , H01L21/687
CPC classification number: H01L21/67069 , H01L21/67115 , H01L21/68764
Abstract: The inventive concept provides a substrate treating method for etching a specific region on a substrate. The substrate treating method includes supplying a treating liquid to the substrate; and irradiating a laser to the specific region to locally heat the specific region; and wherein at the irradiating the laser, the laser is irradiated a plurality of times within the specific region, and the laser is irradiated to a region which does not overlap on the substrate, but which overlaps within the specific region.
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公开(公告)号：US20230211618A1
公开(公告)日：2023-07-06
申请号：US17947084
申请日：2022-09-17
Applicant: SEMES CO., LTD.
Inventor： Jang Mi WOO , Ki Hoon CHOI , Young Hoon JEONG , Myung Jin KIM
IPC: B41J25/34
CPC classification number: B41J25/34
Abstract: The present disclosure provides a droplet discharging device capable of minimizing misalignment of a plurality of heads. The droplet discharging device comprises a base including a head fixing region to which a plurality of heads are fixed; a pack holder disposed on the base and including an opening penetrated by the plurality of heads installed on the base; a guide pin installed on the pack holder and protruding towards the base; a guide holder installed on the base and fastened to the guide pin; a first fastening part installed on the pack holder and protruding towards the base; and a second fastening part installed on the base and fastened to the first fastening part, wherein a lock air is supplied to one of the first fastening part and the second fastening part, thus fastening the first fastening part and the second fastening part.
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公开(公告)号：US20230205100A1
公开(公告)日：2023-06-29
申请号：US17864506
申请日：2022-07-14
Applicant: SEMES CO., LTD.
Inventor： Won Sik SON , Hyun YOON , Ki Hoon CHOI , Hyo Won YANG , Tae Hee KIM , In Ki JUNG
IPC: G03F7/20
CPC classification number: G03F7/70891
Abstract: The present invention provides a substrate treating apparatus including: a support unit supporting and rotating the substrate in a treatment space; a liquid supply unit supplying a liquid to the substrate supported by the support unit; and an irradiating module irradiating light to the substrate supported by the support unit, in which the irradiating module includes: a housing having an accommodation space; a laser unit located in the accommodation space, and including a laser irradiation unit irradiating laser light, and an irradiation end having one end protruding from the housing and irradiating the laser light irradiated from the laser irradiation unit to the substrate supported by the support unit; and a cooling unit located in the accommodation space and cooling the laser irradiation unit.
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公开(公告)号：US20230168586A1
公开(公告)日：2023-06-01
申请号：US18059675
申请日：2022-11-29
Applicant: SEMES CO., LTD.
Inventor： Ki Hoon CHOI , In Ki JUNG , Hyo Won YANG , Sang Hyeon RYU , Young Ho PARK , Tae Hee KIM
CPC classification number: G03F7/162 , G03F7/709 , G03F7/7085 , G03F7/70525 , G03F7/70808
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing having a treating space; a support unit configured to support and rotate a substrate at the treating space; a liquid supply unit configured to supply a liquid to a substrate supported on the support unit; a post-treating unit configured to perform a post-treatment on the substrate supported on the support unit; and a monitoring unit configured to inspect a state of a liquid film formed of the liquid supplied onto the substrate.
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