MEMORY ELEMENT AND MEMORY DEVICE
    1.
    发明申请

    公开(公告)号:US20250008739A1

    公开(公告)日:2025-01-02

    申请号:US18707987

    申请日:2022-11-04

    Abstract: A memory element with a novel structure is provided. The memory element includes a stack of a first electrode, a first insulating layer, a semiconductor layer, a second insulating layer, and a second electrode. The first electrode, the first insulating layer, the semiconductor layer, the second insulating layer, and the second electrode include a region where they overlap with each other. An oxide semiconductor, which is a kind of a metal oxide, is used for the semiconductor layer. For the first insulating layer, a material having anti-ferroelectricity is used.

    EQUIVALENT CIRCUIT MODEL, PROGRAM, RECORDING MEDIUM, AND SIMULATION DEVICE

    公开(公告)号:US20230259681A1

    公开(公告)日:2023-08-17

    申请号:US18025213

    申请日:2021-09-09

    CPC classification number: G06F30/367 G06F30/3323 G06F30/3308

    Abstract: A program for executing a simulation of a circuit including an anti-ferroelectric element is provided. An equivalent circuit model of an anti-ferroelectric element is set in the program. The equivalent circuit model includes, between a first terminal and a second terminal, a ferroelectric element, a linear resistor, a first transistor, and a second transistor. The first terminal is electrically connected to one of a pair of electrodes of the ferroelectric element and a first terminal of the linear resistor; the other of the pair of electrodes of the ferroelectric element is electrically connected to one of a source electrode and a drain electrode of the first transistor; a gate electrode of the first transistor is electrically connected to a gate electrode of the second transistor, one of a source electrode and a drain electrode of the second transistor, and a second terminal of the linear resistor; and the second terminal is electrically connected to the other of the source electrode and the drain electrode of the first transistor and the other of the source electrode and the drain electrode of the second transistor.

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:US20230073146A1

    公开(公告)日:2023-03-09

    申请号:US17889597

    申请日:2022-08-17

    Abstract: A semiconductor device having a large on-state current and high reliability is provided. The semiconductor device includes a first insulator, a first oxide over the first insulator, a second oxide over the first oxide, a third oxide and a fourth oxide over the second oxide, a first conductor over the third oxide, a second conductor over the fourth oxide, a fifth oxide over the second oxide, a second insulator over the fifth oxide, and a third conductor over the second insulator. The fifth oxide is in contact with a top surface of the second oxide, a side surface of the first conductor, a side surface of the second conductor, a side surface of the third oxide, and a side surface of the fourth oxide. The second oxide contains In, an element M, and Zn. The first oxide and the fifth oxide each contain at least one of constituent elements included in the second oxide. The third oxide and the fourth oxide each contain the element M. The third oxide and the fourth oxide include a region where the concentration of the element M is higher than that in the second oxide.

    SEMICONDUCTOR DEVICE
    5.
    发明公开

    公开(公告)号:US20240313121A1

    公开(公告)日:2024-09-19

    申请号:US18575942

    申请日:2022-07-08

    CPC classification number: H01L29/7869

    Abstract: A semiconductor device with a small variation in transistor electrical characteristics is provided. The semiconductor device includes an oxide; a first conductor, a second conductor, and a first insulator over the oxide; a second insulator over the first conductor and the second conductor; a third insulator over the first insulator; a third conductor over the third insulator; and a fourth insulator over the second insulator and the third conductor. The fourth insulator is in contact with a top surface of the second insulator and a top surface of the third conductor. The first insulator includes regions that are in contact with a top surface of the oxide, a side surface of the first conductor, a side surface of the second conductor, and a side surface of the second insulator. The oxide includes indium, gallium, aluminum, and zinc. Each of the first insulator and the fourth insulator includes aluminum and oxygen. The fourth insulator has an amorphous structure. The oxide has a concentration gradient in which an aluminum concentration increases toward the top surface of the oxide from the bottom surface of the oxide.

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:US20240387741A1

    公开(公告)日:2024-11-21

    申请号:US18619261

    申请日:2024-03-28

    Abstract: A semiconductor device having a large on-state current and high reliability is provided. The semiconductor device includes a first insulator, a first oxide over the first insulator, a second oxide over the first oxide, a third oxide and a fourth oxide over the second oxide, a first conductor over the third oxide, a second conductor over the fourth oxide, a fifth oxide over the second oxide, a second insulator over the fifth oxide, and a third conductor over the second insulator. The fifth oxide is in contact with a top surface of the second oxide, a side surface of the first conductor, a side surface of the second conductor, a side surface of the third oxide, and a side surface of the fourth oxide. The second oxide contains In, an element M, and Zn. The first oxide and the fifth oxide each contain at least one of constituent elements included in the second oxide. The third oxide and the fourth oxide each contain the element M. The third oxide and the fourth oxide include a region where the concentration of the element M is higher than that in the second oxide.

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