公开(公告)号：US11732123B2

公开(公告)日：2023-08-22

申请号：US17788966

申请日：2020-03-31

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Zengbiao Huang ,  Huayong Fan ,  Yongjing Xu ,  Jianlong Huang ,  Naidong She

IPC: B32B3/10 ,  C08L51/06 ,  C08J5/24 ,  B32B5/02 ,  B32B5/26 ,  H05K1/03 ,  H05K3/02

CPC classification number: C08L51/06 ,  B32B5/02 ,  B32B5/26 ,  C08J5/244 ,  H05K1/034 ,  B32B2250/20 ,  B32B2255/02 ,  B32B2255/205 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/204 ,  B32B2307/308 ,  B32B2307/3065 ,  B32B2307/748 ,  B32B2457/08 ,  C08J2351/06 ,  H05K3/02

Abstract: Provided are a thermosetting resin composition, and a prepreg, a laminate and a printed circuit board using same. The thermosetting resin composition comprises a resin component comprising a modified cycloolefin copolymer and other unsaturated resins. The modified cycloolefin copolymer is a reaction product of maleic anhydride and a cycloolefin copolymer; the cycloolefin copolymer is a copolymerization product of a monomer A and a monomer B; the monomer A is selected from one of or a combination of at least two of norbornene, cyclopentadiene, dicyclopentadiene, tricyclopentadiene, and (I); and the monomer B is selected from one of or a combination of at least two of C2-C3 olefins and C2-C3 alkynes. The laminate prepared by using the provided thermosetting resin composition has good dielectric properties, peel strength and thermal resistance, and can satisfy the current requirements of properties for printed circuit board substrates in the field of high-frequency and high-speed communications.

公开(公告)号：US12122904B2

公开(公告)日：2024-10-22

申请号：US17789005

申请日：2020-03-31

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Huayong Fan ,  Zengbiao Huang ,  Yongjing Xu

IPC: C08L47/00 ,  B32B15/20 ,  C08J5/04 ,  B32B5/02 ,  B32B5/26 ,  B32B15/14

CPC classification number: C08L47/00 ,  B32B15/20 ,  C08J5/043 ,  B32B5/022 ,  B32B5/024 ,  B32B5/26 ,  B32B15/14 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/204 ,  B32B2307/3065 ,  B32B2307/7265 ,  B32B2307/748 ,  B32B2457/08 ,  C08J2345/00 ,  C08J2347/00 ,  C08J2445/00 ,  C08J2447/00 ,  C08J2471/12 ,  C08L2201/08 ,  C08L2203/16 ,  C08L2203/20 ,  C08L2205/025 ,  C08L2205/03

Abstract: Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.