公开(公告)号：US20220091509A1

公开(公告)日：2022-03-24

申请号：US17469454

申请日：2021-09-08

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Hiroyuki URANO ,  Masashi IIO ,  Katsuya TAKEMURA

IPC: G03F7/075 ,  G03F7/004 ,  G03F7/16 ,  G03F7/40

Abstract: The present invention is a photosensitive resin composition containing: (A) a resin; (B) a photosensitizer; (C) a surfactant containing a structural unit represented by the following average composition formula (1); and (D) a solvent, where Y1 and Y2 each independently represent a hydrogen atom, a methyl group, a phenyl group, or a group represented by the following general formula (2), at least one of Y1 and Y2 is a group represented by the following general formula (2), R1 to R6 are monovalent hydrocarbon groups that may be the same or different and optionally contain a heteroatom, having 1 to 20 carbon atoms, “l” and “n” are each independently integers of 1 to 100, and “m” is an integer of 0 to 100. This provides: a photosensitive resin composition that is excellent in film thickness uniformity at the time of application and that has reduced coating defects when forming a thick film; a patterning process performed using the photosensitive resin composition; a cured film formed by curing the pattern; and an electronic component having the cured film.

公开(公告)号：US20180081272A1

公开(公告)日：2018-03-22

申请号：US15822818

申请日：2017-11-27

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Tsutomu OGIHARA ,  Yusuke BIYAJIMA ,  Hiroyuki URANO

IPC: G03F7/09 ,  G03F7/00 ,  G03F7/075 ,  G03F7/32 ,  C09D183/04 ,  H01L21/311 ,  H01L21/308

CPC classification number: G03F7/094 ,  C09D183/04 ,  G03F7/0002 ,  G03F7/0752 ,  G03F7/325 ,  H01L21/3081 ,  H01L21/31116 ,  H01L21/31138 ,  H01L21/31144 ,  C08K5/55

Abstract: The present invention provides a thermal crosslinking accelerator that can improve an etching selectivity to the upper layer resist thereby improving the pattern form after etching even in a finer pattern than the case of using a conventional silicon-containing resist underlayer film. Thus, provided is a thermal crosslinking accelerator of a polysiloxane compound wherein the thermal crosslinking accelerator of a polysiloxane compound is shown by the following general formula (A-1), wherein R11, R12, R13, and R14 each represents a hydrogen atom, a halogen atom, a linear, a branched, a cyclic alkyl group or the like having 1 to 20 carbon atoms, an optionally substituted aryl group having 6 to 20 carbon atoms, or an aralkyl group or the like having 7 to 20 carbon atoms, wherein a part of or all of hydrogen atoms in these groups may be substituted by an alkoxy group or the like. “a”, “b”, “c”, and “d” represent an integer of 0 to 5; in the case that “a”, “b”, “c”, and “d” are 2 or more, R11, R12, R13, and R14 may form a cyclic structure. Character L represents lithium and the like.

公开(公告)号：US20170255097A1

公开(公告)日：2017-09-07

申请号：US15432127

申请日：2017-02-14

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Katsuya TAKEMURA ,  Masashi IIO ,  Hiroyuki URANO ,  Takashi MIYAZAKI

IPC: G03F7/039 ,  G03F7/11 ,  G03F7/16 ,  G03F7/32 ,  G03F7/38 ,  G03F7/40 ,  C08G77/04 ,  C08G77/06 ,  G03F7/004 ,  G03F7/20

CPC classification number: G03F7/039 ,  C07C39/21 ,  C08G77/04 ,  C08G77/06 ,  C08G77/12 ,  C08G77/52 ,  C08L83/14 ,  C09D183/14 ,  G03F7/0045 ,  G03F7/0757 ,  G03F7/11 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2002 ,  G03F7/2037 ,  G03F7/322 ,  G03F7/38 ,  G03F7/40 ,  H01L21/0271 ,  H01L21/311

Abstract: The present invention provides a positive photosensitive resin composition containing (A) a polymer compound containing a siloxane chain, the polymer compound having a repeating unit shown by the general formula (1) and a weight average molecular weight of 3,000 to 500,000, (B) a photosensitive material capable of generating an acid by light and increasing a dissolution rate in an aqueous alkaline solution, (C) a crosslinking agent, and (D) a solvent. There can be provided a positive photosensitive resin composition that can remedy the problem of delamination caused on a metal wiring such as Cu and Al, an electrode, and a substrate, especially on a substrate such as SiN, and can form a fine pattern having a forward tapered shape without generating a scum and a footing profile in the pattern bottom and on the substrate when a widely used 2.38% TMAH aqueous solution is used as the developer.

公开(公告)号：US20220289911A1

公开(公告)日：2022-09-15

申请号：US17679455

申请日：2022-02-24

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Hiroyuki URANO ,  Masashi IIO ,  Katsuya TAKEMURA

IPC: C08G73/10 ,  G03F7/004 ,  G03F7/32 ,  G03F7/039 ,  G03F7/038 ,  G03F7/20 ,  G03F7/38 ,  G03F7/40 ,  G03F7/11

Abstract: A polymer in the present invention contains a structural unit represented by the following general formula (1), where X1 is a tetravalent organic group, Z1 is a divalent organic group, and “k” is an integer of 1 to 3. Thus, the present invention provides: a positive photosensitive resin composition and a negative photosensitive resin composition which exhibit favorable solvent solubility and are capable of forming a fine pattern with high resolution as a result of solubility in an aqueous alkaline solution; a polyimide-based polymer usable as a base resin for these compositions; and a patterning method and a method for forming a cured film which use the compositions.

公开(公告)号：US20160097973A1

公开(公告)日：2016-04-07

申请号：US14855163

申请日：2015-09-15

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Hiroyuki URANO ,  Masashi IIO ,  Katsuya TAKEMURA ,  Koji HASEGAWA ,  Masahiro FUKUSHIMA ,  Takayuki FUJIWARA

IPC: G03F7/075 ,  G03F7/20 ,  C08G77/18 ,  G03F7/32 ,  G03F7/40 ,  C08G77/16 ,  G03F7/16 ,  G03F7/38

CPC classification number: G03F7/0757 ,  C07C39/21 ,  C08G77/14 ,  C08G77/16 ,  C08G77/18 ,  C08G77/38 ,  C08G77/52 ,  C08K5/09 ,  C08L83/14 ,  C09D183/14 ,  G03F7/038 ,  G03F7/0382 ,  G03F7/11 ,  G03F7/168 ,  G03F7/2002 ,  G03F7/2014 ,  G03F7/2037 ,  G03F7/32 ,  G03F7/38 ,  G03F7/40 ,  H01L21/0274

Abstract: The present invention provides a silicone skeleton-containing polymer compound containing a repeating unit shown by the general formula (1) and having a weight average molecular weight of 3,000 to 500,000. There can be provided a silicone skeleton-containing polymer compound suitable used as a base resin of a chemically amplified negative resist composition that can remedy the problem of delamination generated on a metal wiring such as Cu and Al, an electrode, and a substrate, especially on a substrate such as SiN, and can form a fine pattern without generating a scum and a footing profile in the pattern bottom and on the substrate when the widely used 2.38% TMAH aqueous solution is used as a developer.

Abstract translation: 本发明提供含有通式（1）所示重复单元，重均分子量为3,000〜500,000的含硅氧烷骨架的高分子化合物。 可以提供适合用作化学放大型负性抗蚀剂组合物的基础树脂的含硅氧烷骨架的高分子化合物，其可以解决金属配线如Cu和Al，电极和基材上产生的分层问题，特别是 在诸如SiN的衬底上，当广泛使用的2.38％TMAH水溶液用作显​​影剂时，可以形成精细图案，而不会在图案底部和衬底上产生浮渣和基脚。

公开(公告)号：US20150198883A1

公开(公告)日：2015-07-16

申请号：US14564764

申请日：2014-12-09

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Jun HATAKEYAMA ,  Hiroyuki URANO ,  Masashi IIO

IPC: G03F7/038 ,  G03F7/40 ,  G03F7/30

CPC classification number: G03F7/0384 ,  C08G8/28 ,  G03F7/0382 ,  G03F7/30 ,  G03F7/40 ,  H01L21/0274

Abstract: A negative resist composition containing as base resin a novolak resin having repeating unit “a”, wherein R1 represents a hydrogen atom, a hydroxy group, or any of a linear, a branched, or a cyclic alkyl group, alkoxy group, acyl group, acyloxy group, and alkoxy carbonyl group, these groups having 1 to 6 carbon atoms; and R2 represents a hydrogen atom, any of a linear, a branched, or cyclic alkyl group having 1 to 6 carbon atoms, alkenyl group having 2 to 10 carbon atoms, aryl group having 6 to 10 carbon atoms, which may contain a hydroxy group, an alkoxy group, an ether group, a thioether group, a carboxyl group, an alkoxy carbonyl group, and an acyloxy group. “A” is within the range of 0

Abstract translation: 含有具有重复单元“a”的酚醛清漆树脂作为基础树脂的负型抗蚀剂组合物，其中R1表示氢原子，羟基或直链，支链或环状烷基，烷氧基，酰基， 酰氧基和烷氧基羰基，这些基团具有1至6个碳原子; R2表示氢原子，碳原子数1〜6的直链状，支链状或环状的烷基，碳原子数2〜10的烯基，碳原子数6〜10的芳基，可以含有羟基 烷氧基，醚基，硫醚基，羧基，烷氧基羰基和酰氧基。 “A”在0

公开(公告)号：US20220315676A1

公开(公告)日：2022-10-06

申请号：US17674136

申请日：2022-02-17

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Masashi IIO ,  Hiroyuki URANO ,  Osamu WATANABE ,  Katsuya TAKEMURA

IPC: C08F24/00 ,  G03F7/004 ,  G03F7/32 ,  G03F7/11 ,  G03F7/20 ,  G03F7/039 ,  G03F7/38 ,  G03F7/16

Abstract: The present invention is a positive photosensitive resin composition including: (A) an alkali-soluble resin containing at least one structure selected from a polyimide structure, a polyamide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof; (B) a polymer compound having a structural unit formed by cyclopolymerization; and (C) a compound having a quinonediazide structure for serving as a photosensitizer to generate an acid by light and increase a dissolution speed to an alkaline aqueous solution. An object of the present invention is to provide a positive photosensitive resin composition and a positive photosensitive dry film that are soluble in an alkaline aqueous solution, that can achieve high resolution without damaging excellent features such as the mechanical characteristics of a protective film, adhesiveness, etc., and that have excellent mechanical characteristics and adhesiveness to a substrate even when cured at low temperatures.

公开(公告)号：US20200041903A1

公开(公告)日：2020-02-06

申请号：US16512589

申请日：2019-07-16

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Katsuya TAKEMURA ,  Masashi IIO ,  Hiroyuki URANO ,  Kazuya HONDA

IPC: G03F7/039 ,  C08G73/10 ,  G03F7/004 ,  C08G73/14

Abstract: The present invention is a polymer having a polyamide structural unit, a polyamide-imide structural unit, or a polyimide structural unit, selected from a polyamide, a polyamide-imide, a polyimide, a polyimide precursor, a polybenzoxazole, and a polybenzoxazole precursor, including a reaction product of a diamine containing at least one of a diamine shown by the following general formula (1) and a diamine shown by the following general formula (2), together with at least one of a tetracarboxylic dianhydride shown by the following general formula (3) as well as a dicarboxylic acid and a dicarboxylic halide shown by the following general formula (4). This provides a polymer which is soluble in a safe organic solvent used widely, and is usable as a base resin of a positive photosensitive resin composition that is soluble in an aqueous alkaline solution and capable of forming a fine pattern to give higher resolution.

公开(公告)号：US20180275513A1

公开(公告)日：2018-09-27

申请号：US15918261

申请日：2018-03-12

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Katsuya TAKEMURA ,  Hiroyuki URANO ,  Masashi IIO

IPC: G03F7/023 ,  C08G73/10 ,  G03F7/039 ,  G03F7/038 ,  G03F7/32 ,  G03F7/20 ,  G03F7/40

CPC classification number: G03F7/0233 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1071 ,  C08G73/14 ,  C09D179/08 ,  G03F7/0387 ,  G03F7/0392 ,  G03F7/20 ,  G03F7/322 ,  G03F7/40 ,  C08K5/235

Abstract: This is to provide a polymer of a polyimide precursor which is soluble in an aqueous alkaline solution, and capable of using a base resin of a positive type and negative type photosensitive resin composition which is capable of forming a fine pattern and obtaining high resolution. Also provided is a positive type and negative type photosensitive resin composition using such a polymer of a polyimide precursor. Further provided are a patterning process and a method of forming a cured film using the composition.Provided is a polymer of a polyimide precursor which comprises a structural unit represented by the following general formula (1), wherein, X1, R1, Z, a repeating number “s”, Y1, Rf, a repeating number “n” and “k” represent the same meanings as mentioned in the specification.

公开(公告)号：US20150056545A1

公开(公告)日：2015-02-26

申请号：US14311132

申请日：2014-06-20

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Hiroyuki URANO ,  Masashi IIO ,  Katsuya TAKEMURA ,  Takashi MIYAZAKI

IPC: G03F7/075 ,  G03F7/40 ,  G03F7/20 ,  C08G77/16 ,  G03F7/30

CPC classification number: G03F7/0757 ,  C08G77/16 ,  C08G77/38 ,  C08G77/42 ,  C08G77/448 ,  C08L83/04 ,  C08L83/10 ,  G03F7/038 ,  G03F7/0382 ,  G03F7/11 ,  G03F7/26 ,  G03F7/40 ,  G03G5/05 ,  G03G7/00

Abstract: A polymer compound has a carboxyl group and a siloxane chain and is obtained in the presence of an acid catalyst by condensation of at least; (I) a siloxane compound having phenol groups at both terminals, as shown by formula (1), (II) phenols shown by formula (2) and/or phenols shown by formula (3), and (III) one or more kinds of aldehydes and ketones shown by the following general formula (4). A polymer compound can be used suitably as a base resin of a chemically amplified negative resist composition with which the problem of delamination generated on metal wires, an electrode, and a substrate, can be improved, and with which a fine pattern can be formed without generating a scum and a footing profile in the pattern bottom and on the substrate, using a widely used aqueous 2.38% TMAH solution as a developer.

Abstract translation: 高分子化合物具有羧基和硅氧烷链，并且在酸催化剂存在下通过至少缩合获得; （I）如式（1），（II）所示的式（2）所示的酚和/或式（3）所示的酚和（III）所示的两端具有酚基的硅氧烷化合物，和（III） 的醛和酮，由下列通式（4）表示。 高分子化合物可以适当地用作化学放大型负性抗蚀剂组合物的基础树脂，其可以改善在金属线，电极和基底上产生的分层问题，并且可以形成精细图案而没有 使用广泛使用的2.38％TMAH水溶液作为显影剂，在图案底部和基底上产生浮渣和底脚。