公开(公告)号：US10854373B2

公开(公告)日：2020-12-01

申请号：US15880003

申请日：2018-01-25

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Tsukasa Nakanishi ,  Kiyokazu Sato ,  Osamu Hoshino

IPC: H01F27/32 ,  H01F27/28 ,  H01F41/04 ,  H01F17/00 ,  H01F27/29

Abstract: An inductor device includes a resin film, a first base conductor layer formed on one surface of the resin film and having a first pad, a second base conductor layer formed on the other surface of the resin film and having a second pad, a through-hole penetrating from the first pad to the second pad, a through conductor filled in the through-hole and provided to connect the first pad and the second pad each other, a first insulating layer formed on the one surface of the resin film and having an opening arranged on the first base conductor layer, and a first conductor part formed on the first base conductor layer in the opening of the first insulating layer. A first conductor pattern layer includes the first base conductor layer and the first conductor part. The first conductor pattern layer has a convex sectional shape.

公开(公告)号：US09997448B1

公开(公告)日：2018-06-12

申请号：US15805660

申请日：2017-11-07

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kiyokazu Sato ,  Mitsuyoshi Imai ,  Osamu Hoshino

IPC: H01L23/52 ,  H01L23/538 ,  H05K1/18 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H05K1/02 ,  H05K1/11 ,  H05K3/06 ,  H05K3/40

CPC classification number: H01L23/49838 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/16 ,  H01L2224/16227 ,  H05K1/028 ,  H05K1/118 ,  H05K1/18 ,  H05K3/061 ,  H05K3/4038 ,  H05K3/427 ,  H05K3/428

Abstract: A wiring substrate includes a flexible insulation substrate, a first wiring layer formed on an upper surface of the insulation substrate, a second wiring layer formed on a lower surface of the insulation substrate, and through wiring bonded to the first wiring layer and the second wiring layer and formed in a through hole extending through the first wiring layer, the insulation substrate, and the second wiring layer. The through wiring includes a projection that extends along a lower surface of the second wiring layer located outside the through hole. An upper surface of the through wiring is flush with an upper surface of the first wiring layer.

公开(公告)号：US09167689B2

公开(公告)日：2015-10-20

申请号：US13773948

申请日：2013-02-22

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Atsushi Nakamura ,  Tsukasa Nakanishi ,  Takayuki Matsumoto ,  Kiyokazu Sato ,  Osamu Hoshino

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K1/03 ,  H05K3/00

CPC classification number: H05K1/0296 ,  H05K1/0206 ,  H05K1/0265 ,  H05K1/0393 ,  H05K1/115 ,  H05K3/0061 ,  H05K3/4038 ,  H05K2201/10106 ,  H05K2203/1545 ,  Y10T29/49165

Abstract: A wiring substrate includes an insulation substrate including a first surface, a second surface on an opposite side of the first surface, and first and second through-holes penetrating the insulation substrate from the first surface to the second surface; a wiring layer formed on the first surface of the insulation substrate; a first via formed in the first through-hole and connected to the wiring layer; a bus line positioned away from the wiring layer and the first via, and formed on the first surface of the insulation substrate; and a second via formed in the second through-hole and connected to the bus line.

Abstract translation: 布线基板包括绝缘基板，其包括第一表面，在第一表面的相对侧上的第二表面以及从第一表面到第二表面穿过绝缘基板的第一和第二通孔; 形成在绝缘基板的第一表面上的布线层; 第一通孔，其形成在第一通孔中并连接到布线层; 位于远离配线层和第一通路的总线，并形成在绝缘基板的第一表面上; 以及形成在第二通孔中并连接到总线的第二通孔。

公开(公告)号：US20180218830A1

公开(公告)日：2018-08-02

申请号：US15880003

申请日：2018-01-25

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Tsukasa Nakanishi ,  Kiyokazu Sato ,  Osamu Hoshino

IPC: H01F27/28 ,  H01F27/32

CPC classification number: H01F27/2852 ,  H01F17/0013 ,  H01F27/2804 ,  H01F27/2828 ,  H01F27/29 ,  H01F27/32 ,  H01F41/046 ,  H01F2027/2809

Abstract: An inductor device includes a resin film, a first base conductor layer formed on one surface of the resin film and having a first pad, a second base conductor layer formed on the other surface of the resin film and having a second pad, a through-hole penetrating from the first pad to the second pad, a through conductor filled in the through-hole and provided to connect the first pad and the second pad each other, a first insulating layer formed on the one surface of the resin film and having an opening arranged on the first base conductor layer, and a first conductor part formed on the first base conductor layer in the opening of the first insulating layer. A first conductor pattern layer includes the first base conductor layer and the first conductor part. The first conductor pattern layer has a convex sectional shape.

公开(公告)号：US09826639B2

公开(公告)日：2017-11-21

申请号：US15351814

申请日：2016-11-15

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Tatsuaki Denda ,  Osamu Hoshino

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/113 ,  H01L23/49534 ,  H05K1/181 ,  H05K3/005 ,  H05K3/244 ,  H05K3/3431 ,  H05K3/427 ,  H05K3/428 ,  H05K2201/09563 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10234 ,  H05K2201/10545 ,  H05K2203/0733

Abstract: A wiring substrate includes an insulating layer, a first wiring layer and a second wiring layer on opposite sides of the insulating layer, and a via piercing through the first wiring layer and the insulating layer to electrically connect to the second wiring layer. The via includes an end portion projecting from a first surface of the first wiring layer facing away from the insulating layer. A surface of the end portion facing in the same direction as the first surface of the first wiring layer is depressed to be deeper in the center than in the periphery.