Abstract:
A stacked semiconductor device includes at least one upper chip including a plurality of channels each including first and second pseudo-channels; and a plurality of transfer control circuits respectively corresponding to the channels and each configured to output channel commands according to a channel designation signal designating one of the first and second pseudo-channels and a location information signal indicating a location of a corresponding channel of the channels, and transmit first and second data words between the corresponding channel and a lower chip according to the channel commands.
Abstract:
An impedance calibration circuit is disclosed, which relates to a technology for improving precision of pad resistance. The impedance calibration circuit includes: a first On Die Termination (ODT) circuit selected by a first selection signal, configured to tune its own resistance using a first code signal, and output a first resistance value to an output terminal; and a second ODT circuit selected by a second selection signal, configured to tune its own resistance using a second code signal, and output a second resistance value to the output terminal.
Abstract:
A semiconductor device may include a ZQ calibration circuit, a reference code setting circuit, a variable information generating circuit, and an internal circuit. The ZQ calibration circuit may perform a ZQ calibration operation in response to a ZQ calibration enable signal to generate a ZQ calibration code. The reference code generating circuit may output a predetermined code value as a reference code. The variable information generating circuit may compare the ZQ calibration code to the reference code to generate variable information. The internal circuit may determine operation timings based on a difference between the ZQ calibration code and the reference code.
Abstract:
A delay circuit of a semiconductor apparatus includes a control signal generation block configured to output a control signal having an analog voltage level in response to an input signal, and an input/output block configured to delay the input signal by a delay amount based on the analog voltage level of the control signal, and output a resultant signal.
Abstract:
A stacked semiconductor device includes at least one upper chip including first and second channels, each including first and second pseudo-channels; and first and second transfer control circuits respectively corresponding to the first and second channels, each configured to select one of the first and second pseudo-channels according to a channel designation signal designating one of the first and second pseudo-channels and a location information signal indicating a location of a corresponding channel, and transfer a data word between the selected pseudo-channel and a lower chip, wherein the first transfer control circuit transfers the data word in a first order in units of bytes, and the second transfer control circuit transfers the data word in a second order in units of bytes, opposite to the first order.
Abstract:
A semiconductor device includes a group control circuit configured to generate a specified address and a control code in response to a row address and an active command, a comparison control signal generation circuit configured to generate a comparison control signal in response to the active command and a set code, and a target address generation circuit configured to output the specified address as a target address in response to the control code and the comparison control signal.
Abstract:
Various embodiments generally relate to a semiconductor device and a device for a semiconductor device, and more particularly, to a technology relating to a margin of a data retention time. The semiconductor device may include a repair detection unit configured to determine whether an inputted address is a repair address and output a repair detection signal. The semiconductor device may include a refresh control unit configured to simultaneously activate two or more word lines in response to a refresh command signal and sequentially activate the two or more word lines according to the repair detection signal.
Abstract:
A semiconductor integrated circuit device including a variable frequency type probe test pad and a semiconductor system are disclosed. The semiconductor integrated circuit device includes a plurality of probe test pads formed on a semiconductor substrate and configured to induce non-contact electrical coupling with a probe card, and a frequency control unit electrically coupled to each of the plurality of probe test pads, and configured to vary a frequency of each of the plurality of probe test pads.
Abstract:
A stacked semiconductor device includes at least one upper chip including a plurality of channels each including first and second pseudo-channels; and a plurality of transfer control circuits respectively corresponding to the channels and each configured to output channel commands according to a channel designation signal designating one of the first and second pseudo-channels and a location information signal indicating a location of a corresponding channel of the channels, and transmit first and second data words between the corresponding channel and a lower chip according to the channel commands.
Abstract:
An impedance calibration circuit is disclosed, which relates to a technology for improving precision of pad resistance. The impedance calibration circuit includes: a first On Die Termination (ODT) circuit selected by a first selection signal, configured to tune its own resistance using a first code signal, and output a first resistance value to an output terminal; and a second ODT circuit selected by a second selection signal, configured to tune its own resistance using a second code signal, and output a second resistance value to the output terminal.