Abstract:
Disclosed are a packaging substrate and a semiconductor device. The semiconductor device comprises an element unit comprising a semiconductor element and a packaging substrate electrically connected to the element unit. By applying a glass substrate to the packaging substrate as a core substrate, connecting the semiconductor element and a motherboard can be closer to each other, so that electrical signals are transferred through as short a path, and significantly improved electrical properties such as a signal transfer rate could be achieved. Also, it is possible to prevent an occurrence of a parasitic element effect and to apply to a high-speed circuit device without additional insulating process.
Abstract:
A cut-out laminated sheet can be prepared by laminating a protection sheet on a base sheet, followed by a simple two-step shearing process. The cut-out laminated sheet thus prepared features a protruding section that helps improving productivity by making the removal of the protection sheet easy; and thus, can be effectively used in a wide range of industrial applications such as a brittle sheet and a flexible sheet.
Abstract:
Disclosed is a ceramic laminate sheet comprising a ceramic sheet having a plurality of cracks and a polymer resin layer disposed on one side or both sides of the ceramic sheet, wherein the plurality of cracks pass through the ceramic sheet from one side to the other side thereof, the cracks divide the ceramic sheet into a plurality of pieces, grooves for formation of the cracks are not provided in one side and the other side of the ceramic sheet.
Abstract:
An antenna device in which a conductive foil or an antenna pattern directly formed on the magnetic sheet without an insulating substrate such as polyimide, has a reduced thickness and may be prepared simple process. Also, with respect to the antenna device, flexibility may be improved by using a polymer-type magnetic sheet, and, since magnetic properties are excellent, the antenna device may be used for multiple applications such as NFC, WPC, and MST.
Abstract:
A magnetic sheet having improved acid/base-resistant properties, corrosion-resistance, and an excellent magnetic property at NFC, WPC, and MST frequencies, has little changes in weight and thickness even if the environment changes, for example, even after an etching treatment for patterning, or a reflow or soldering process which is performed for its application to a product.
Abstract:
According to a method of preparing a conductive magnetic composite sheet, the method comprising preparing a magnetic sheet comprising a magnetic powder and a binder resin; stacking the magnetic sheet and a first conductive foil; and applying heat and pressure to the obtained stack to bond the magnetic sheet and the first conductive foil, a conductive magnetic composite sheet having excellent interlayer adhesion between the magnetic sheet and the conductive foil can be prepared while having an excellent magnetic property at NFC, WPC, and MST frequencies.