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公开(公告)号：US09680427B2
公开(公告)日：2017-06-13
申请号：US15297159
申请日：2016-10-19
Inventor： Ho Yong Hwang , Chang Kun Park
CPC classification number: H03F3/211 , H03F1/0283 , H03F3/195 , H03F3/213 , H03F3/245 , H03F3/3022 , H03F3/3028 , H03F3/45179 , H03F3/45237 , H03F2200/405 , H03F2200/408 , H03F2200/516 , H03F2203/45481 , H03F2203/45544 , H03F2203/45594 , H03F2203/45631
Abstract: A power amplifier having a stack structure comprises a first driver stage that receives a power voltage from a power supply and receives and amplifies an input signal; a second driver stage that receives the power voltage from the power supply, has an input terminal connected with an output terminal of the first driver stage, and receives and amplifies an output signal from the first driver stage; and a power stage that has a power input terminal connected with a ground terminal of the first driver stage and a ground terminal of the second driver stage and receives a virtual ground voltage, and has an input terminal connected with an output terminal of the second driver stage and receives and amplifies an output signal from the second driver stage.
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Patent Agency Ranking
公开(公告)号：US08866543B2
公开(公告)日：2014-10-21
申请号：US13961067
申请日：2013-08-07
Inventor： Chang Kun Park , Ho Yong Hwang
IPC: H01L25/00 , G05F3/16 , H01L25/065
CPC classification number: H01L25/0657 , G05F3/16 , H01L2924/0002 , H01L2924/00
Abstract: Provided is an integrated circuit (IC) having a stacked structure. The IC includes: a first IC having a power input terminal to which a power supply voltage is applied; and a second IC having a power input terminal connected to a ground terminal of the first IC, having a central node formed as the power input terminal of the second IC and the ground terminal of the first IC are connected to each other and to which a voltage is applied, and having a ground terminal connected to a ground source, wherein the power supply voltage is divided into first and second voltages that are respectively applied to the first and second ICs.
Abstract translation: 提供具有堆叠结构的集成电路（IC）。 IC包括：具有施加电源电压的电源输入端子的第一IC; 以及第二IC，其具有连接到第一IC的接地端子的电力输入端子，具有形成为第二IC的电力输入端子的中心节点和第一IC的接地端子彼此连接，并且其中 电压被施加，并且具有连接到接地源的接地端子，其中电源电压被分成分别施加到第一和第二IC的第一和第二电压。
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公开(公告)号：US09503036B2
公开(公告)日：2016-11-22
申请号：US14407965
申请日：2012-10-19
Inventor： Ho Yong Hwang , Chang Kun Park
CPC classification number: H03F3/211 , H03F1/0283 , H03F3/195 , H03F3/213 , H03F3/245 , H03F3/3022 , H03F3/3028 , H03F3/45179 , H03F3/45237 , H03F2200/405 , H03F2200/408 , H03F2200/516 , H03F2203/45481 , H03F2203/45544 , H03F2203/45594 , H03F2203/45631
Abstract: A power amplifier having a stack structure, including: a first driver stage that receives a power voltage from a power supply and receives and amplifies an input signal; a second driver stage that has a power input terminal connected with a ground terminal of the first driver stage and receiving a virtual power voltage and an input terminal connected with an output terminal of the first driver stage, and receives and amplifies an output signal from the first driver stage; and a power stage that receives the power voltage from the power supply, has an input terminal connected with an output terminal of the second driver stage, and receives and amplifies an output signal from the second driver stage.
Abstract translation: 一种具有堆叠结构的功率放大器，包括：第一驱动级，其从电源接收电源电压并接收并放大输入信号; 第二驱动级，具有与第一驱动级的接地端子连接并接收虚拟电源电压的电源输入端子和与第一驱动级的输出端子连接的输入端子，并且接收并放大来自 第一驱动阶段; 以及从电源接收电力电压的功率级，具有与第二驱动级的输出端连接的输入端，并且接收并放大来自第二驱动级的输出信号。
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公开(公告)号：US20150171804A1
公开(公告)日：2015-06-18
申请号：US14407965
申请日：2012-10-19
Inventor： Ho Yong Hwang , Chang Kun Park
IPC: H03F3/21
CPC classification number: H03F3/211 , H03F1/0283 , H03F3/195 , H03F3/213 , H03F3/245 , H03F3/3022 , H03F3/3028 , H03F3/45179 , H03F3/45237 , H03F2200/405 , H03F2200/408 , H03F2200/516 , H03F2203/45481 , H03F2203/45544 , H03F2203/45594 , H03F2203/45631
Abstract: A power amplifier having a stack structure, including: a first driver stage that receives a power voltage from a power supply and receives and amplifies an input signal; a second driver stage that has a power input terminal connected with a ground terminal of the first driver stage and receiving a virtual power voltage and an input terminal connected with an output terminal of the first driver stage, and receives and amplifies an output signal from the first driver stage; and a power stage that receives the power voltage from the power supply, has an input terminal connected with an output terminal of the second driver stage, and receives and amplifies an output signal from the second driver stage.
Abstract translation: 一种具有堆叠结构的功率放大器，包括：第一驱动级，其从电源接收电源电压并接收并放大输入信号; 第二驱动级，具有与第一驱动级的接地端子连接并接收虚拟电源电压的电源输入端子和与第一驱动级的输出端子连接的输入端子，并且接收并放大来自 第一驱动阶段; 以及从电源接收电力电压的功率级，具有与第二驱动级的输出端连接的输入端，并且接收并放大来自第二驱动级的输出信号。
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公开(公告)号：US08957529B2
公开(公告)日：2015-02-17
申请号：US13961011
申请日：2013-08-07
Inventor： Chang Kun Park , Ho Yong Hwang
IPC: H01L29/40 , H01L23/538 , H01L25/065
CPC classification number: H01L23/5384 , H01L23/481 , H01L23/50 , H01L24/73 , H01L25/0657 , H01L2224/0401 , H01L2224/04042 , H01L2224/0557 , H01L2224/06181 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16245 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73257 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06565 , H01L2924/00014 , H01L2924/30107 , H01L2924/00012 , H01L2924/00 , H01L2224/05552
Abstract: Provided is a power voltage supply apparatus of a 3-dimensional (3D) semiconductor. The power voltage supply apparatus includes a plurality of integrated circuits (ICs) which each include a first through silicon via (TSV) and a second TSV, are stacked such that the first TSVs are connected and second TSVs are connected, and are mounted on a printed circuit board (PCB), wherein a first PCB line formed on the PCB and supplying a first voltage is connected to a bottom of a first TSV of a bottom IC from among the plurality of ICs, and a second PCB line formed on the PCB and supplying a second voltage is connected to a top of a second TSV of a top IC.
Abstract translation: 提供了一种三维（3D）半导体的电源电压供给装置。 电源电压设备包括多个集成电路（IC），每个集成电路（IC）各自包括第一通孔（TSV）和第二TSV，以使得第一TSV连接并且第二TSV连接，并且被安装在 印刷电路板（PCB），其中形成在所述PCB上并提供第一电压的第一PCB线从所述多个IC中的底部IC的第一TSV的底部连接，以及形成在所述PCB上的第二PCB线 并且提供第二电压连接到顶部IC的第二TSV的顶部。
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公开(公告)号：US20140138798A1
公开(公告)日：2014-05-22
申请号：US13961011
申请日：2013-08-07
Inventor： Chang Kun Park , Ho Yong Hwang
IPC: H01L23/538
CPC classification number: H01L23/5384 , H01L23/481 , H01L23/50 , H01L24/73 , H01L25/0657 , H01L2224/0401 , H01L2224/04042 , H01L2224/0557 , H01L2224/06181 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16245 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73257 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06565 , H01L2924/00014 , H01L2924/30107 , H01L2924/00012 , H01L2924/00 , H01L2224/05552
Abstract: Provided is a power voltage supply apparatus of a 3-dimensional (3D) semiconductor. The power voltage supply apparatus includes a plurality of integrated circuits (ICs) which each include a first through silicon via (TSV) and a second TSV, are stacked such that the first TSVs are connected and second TSVs are connected, and are mounted on a printed circuit board (PCB), wherein a first PCB line formed on the PCB and supplying a first voltage is connected to a bottom of a first TSV of a bottom IC from among the plurality of ICs, and a second PCB line formed on the PCB and supplying a second voltage is connected to a top of a second TSV of a top IC.
Abstract translation: 提供了一种三维（3D）半导体的电源电压供给装置。 电源电压设备包括多个集成电路（IC），每个集成电路（IC）各自包括第一通孔（TSV）和第二TSV，以使得第一TSV连接并且第二TSV连接，并且被安装在 印刷电路板（PCB），其中形成在所述PCB上并提供第一电压的第一PCB线从所述多个IC中的底部IC的第一TSV的底部连接，以及形成在所述PCB上的第二PCB线 并且提供第二电压连接到顶部IC的第二TSV的顶部。
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