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    ANTENNA FOR INTER-CHIP WIRELESS POWER TRANSMISSION
    4.
    发明申请
    ANTENNA FOR INTER-CHIP WIRELESS POWER TRANSMISSION 有权
    用于互连无线电力传输的天线

    公开(公告)号：US20150054710A1

    公开(公告)日：2015-02-26

    申请号：US14468330

    申请日：2014-08-26

    申请人： SOONGSIL UNIVERSITY RESEARCH CONSORTIUM TECHNO-PARK

    发明人： Chang Hyun LEE ,  Chang Kun Park

    IPC分类号： H01F38/14 ,  H01Q1/38 ,  H01Q21/28 ,  H02J5/00

    CPC分类号： H01F38/14 ,  H01Q1/2283 ,  H01Q21/28 ,  H02J5/005 ,  H02J50/05 ,  H02J50/10 ,  H02J50/40

    摘要： Disclosed is an antenna for inter-chip wireless power transmission in a 3D-wireless chip package, wherein the 3D-wireless chip package includes: a first chip transmitting AC power through a transmitting antenna; and a plurality of second chips sequentially stacked on or under the first chip and receiving the AC power from the first chip through receiving antennas, respectively, and the receiving antennas are individually formed on the second chips, respectively, and positioned without vertically overlapping each other over or under the transmitting antenna.

    摘要翻译： 公开了一种用于3D无线芯片封装中的芯片间无线电力传输的天线，其中3D无线芯片封装包括：通过发射天线发射AC电力的第一芯片; 以及分别依次堆叠在第一芯片上或下面的多个第二芯片，并且分别通过接收天线从第一芯片接收AC电力，并且接收天线分别形成在第二芯片上并且彼此不垂直重叠地定位 在发射天线之上或之下。

    LEVEL CONVERTER FOR CONTROLLING SWITCH
    5.
    发明申请
    LEVEL CONVERTER FOR CONTROLLING SWITCH 审中-公开
    用于控制开关的电平转换器

    公开(公告)号：US20140125397A1

    公开(公告)日：2014-05-08

    申请号：US13962014

    申请日：2013-08-08

    申请人： Soongsil University Research Consortium Techno-Park

    发明人： Chang Kun Park ,  Chang Hyun Lee ,  Suk Hyeon Yun

    IPC分类号： H03K19/0185

    CPC分类号： H03K19/018521

    摘要： Provided is a power amplifier using a differential structure. The power amplifier includes: first and second transistors whose first terminals are each connected to a first power supply source supplying a first voltage and into which signals having the same size and opposite polarities are input; third and fourth transistors whose first terminals are respectively connected to the first terminals of the first and second transistors; and a fifth transistor whose first terminal is connected to second terminals of the third and fourth transistors and controlling oscillation of the third or fourth transistor.

    摘要翻译： 提供了使用差分结构的功率放大器。 功率放大器包括：第一和第二晶体管，其第一端子各自连接到提供第一电压的第一电源，并且输入具有相同尺寸和相反极性的信号; 第三和第四晶体管，其第一端子分别连接到第一和第二晶体管的第一端子; 以及第五晶体管，其第一端子连接到第三和第四晶体管的第二端子并控制第三或第四晶体管的振荡。

    Antenna for inter-chip wireless power transmission
    7.
    发明授权
    Antenna for inter-chip wireless power transmission 有权
    天线用于芯片间无线电力传输

    公开(公告)号：US09460848B2

    公开(公告)日：2016-10-04

    申请号：US14468330

    申请日：2014-08-26

    申请人： SOONGSIL UNIVERSITY RESEARCH CONSORTIUM TECHNO-PARK

    发明人： Chang Hyun Lee ,  Chang Kun Park

    IPC分类号： H01F27/42 ,  H01F38/14 ,  H02J5/00 ,  H01Q21/28 ,  H01Q1/22

    CPC分类号： H01F38/14 ,  H01Q1/2283 ,  H01Q21/28 ,  H02J5/005 ,  H02J50/05 ,  H02J50/10 ,  H02J50/40

    摘要： Disclosed is an antenna for inter-chip wireless power transmission in a 3D-wireless chip package, wherein the 3D-wireless chip package includes: a first chip transmitting AC power through a transmitting antenna; and a plurality of second chips sequentially stacked on or under the first chip and receiving the AC power from the first chip through receiving antennas, respectively, and the receiving antennas are individually formed on the second chips, respectively, and positioned without vertically overlapping each other over or under the transmitting antenna.

    摘要翻译： 公开了一种用于3D无线芯片封装中的芯片间无线电力传输的天线，其中3D无线芯片封装包括：通过发射天线发射AC电力的第一芯片; 以及分别依次堆叠在第一芯片上或下面的多个第二芯片，并且分别通过接收天线从第一芯片接收AC电力，并且接收天线分别形成在第二芯片上并且彼此不垂直重叠地定位 在发射天线之上或之下。

    DEVICE FOR CHIP-TO-CHIP WIRELESS POWER TRANSMISSION USING OSCILLATOR
    8.
    发明申请
    DEVICE FOR CHIP-TO-CHIP WIRELESS POWER TRANSMISSION USING OSCILLATOR 审中-公开
    使用振荡器进行芯片到芯片无线电力传输的设备

    公开(公告)号：US20160105034A1

    公开(公告)日：2016-04-14

    申请号：US14676831

    申请日：2015-04-02

    申请人： SOONGSIL UNIVERSITY RESEARCH CONSORTIUM TECHNO-PARK

    发明人： Mi Lim LEE ,  Chang Kun Park

    IPC分类号： H02J5/00

    CPC分类号： H02J50/12 ,  H02J50/40

    摘要： Disclosed is a device for chip-to-chip wireless power transmission. The device includes: a first transistor that outputs a first output signal; a second transistor that outputs a second output signal having a phase opposite to that of the first output signal; capacitors that each have a first terminal and a second terminal connected the first transistor and the second transistor, respectively; and a transmitting coil that wirelessly transmits AC power outputted through the first and second transistors to a receiving coil of a power receiver.

    摘要翻译： 公开了一种芯片到芯片无线电力传输的设备。 该装置包括：第一晶体管，其输出第一输出信号; 输出具有与第一输出信号的相位相反的相位的第二输出信号的第二晶体管; 分别具有第一端子和第二端子的电容器，分别连接第一晶体管和第二晶体管; 以及发送线圈，其将通过第一和第二晶体管输出的交流电力无线发送到电力接收器的接收线圈。

    Variable capacitor used in integrated circuit of differential structure
    9.
    发明授权
    Variable capacitor used in integrated circuit of differential structure 有权

    公开(公告)号：US09685908B1

    公开(公告)日：2017-06-20

    申请号：US15207470

    申请日：2016-07-11

    申请人： SOONGSIL UNIVERSITY RESEARCH CONSORTIUM TECHNO-PARK

    发明人： Mi Lim Lee ,  Ga Yeon Ko ,  Chang Kun Park

    IPC分类号： H03B5/12

    CPC分类号： H03B5/124 ,  H03B5/1212 ,  H03B5/1228 ,  H03B5/1243 ,  H03B5/1253

    摘要： The present invention related to a varactor used in an integrated circuit of a differential structure. An exemplary embodiment of the present invention provides a variable capacitor connected between first and second signal lines which are differential signal lines included in an integrated circuit of a differential structure, including: a plurality of N-type semiconductors separately arranged; one or more P-type semiconductors disposed between the N-type semiconductors to make first and second PN junctions with N-type semiconductors contacting upper and lower portions thereof and to receive a control voltage, wherein, among the N-type semiconductors, first N-type semiconductors corresponding to (2n−1)-th (n being a positive integer) are connected with the first signal line, and second N-type semiconductors corresponding to 2n-th are connected with the second signal line, and parasitic capacitances of the first and second PN junctions are varied by adjusting the control voltage.

    LINEAR AMPLIFIER USING NONLINEAR AMPLIFYING STAGE
    10.
    发明申请
    LINEAR AMPLIFIER USING NONLINEAR AMPLIFYING STAGE 有权
    线性放大器使用非线性放大级

    公开(公告)号：US20160204745A1

    公开(公告)日：2016-07-14

    申请号：US14972105

    申请日：2015-12-17

    申请人： SOONGSIL UNIVERSITY RESEARCH CONSORTIUM TECHNO-PARK

    发明人： Chang Kun Park ,  Jong Hoon Park

    IPC分类号： H03F1/02 ,  H03F1/56 ,  H03F3/21 ,  H03F3/193

    CPC分类号： H03F1/56 ,  H03F1/0261 ,  H03F1/3276 ,  H03F3/193 ,  H03F2200/18 ,  H03F2200/411 ,  H03F2200/451 ,  H03G3/3042

    摘要： Disclosed herein is a linear amplifier using a nonlinear amplifying stage which includes a first amplifier and a second amplifier connected in cascade, including: a bias voltage generator in which a first bias voltage is applied to a gate terminal of the first amplifier, and a second bias voltage higher than the first bias voltage is applied to a gate terminal of the second amplifier, wherein the first amplifier and the second amplifier have a nonlinear gain characteristic in a region of arbitrary output power, and as the output power increases in the region of arbitrary output power, a gain of the first amplifier increases, while a gain of the second amplifier decreases.

    摘要翻译： 本文公开了一种使用非线性放大级的线性放大器，其包括级联连接的第一放大器和第二放大器，包括：偏置电压发生器，其中第一偏置电压施加到第一放大器的栅极端子，第二放大器的第二放大器 高于第一偏置电压的偏置电压被施加到第二放大器的栅极端子，其中第一放大器和第二放大器在任意输出功率的区域中具有非线性增益特性，并且随着输出功率在 任意输出功率，第一放大器的增益增加，而第二放大器的增益减小。