公开(公告)号：US20140103509A1

公开(公告)日：2014-04-17

申请号：US13653242

申请日：2012-10-16

申请人： STATS CHIPPAC, LTD.

发明人： Insang Yoon ,  Flynn Carson ,  Il Kwon Shim ,  SeongHun Mun

IPC分类号： H01L23/495 ,  H01L21/98 ,  H01L21/60

CPC分类号： H01L23/49816 ,  H01L21/568 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2225/0651 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/11 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L2224/19

摘要： A semiconductor device has a semiconductor die with an encapsulant deposited over and around the semiconductor die. An opening is formed in a first surface of the encapsulant by etching or LDA. A plurality of bumps is optionally formed over the semiconductor die. A bump is recessed within the opening of the encapsulant. A conductive ink is formed over the first surface of the encapsulant, bump and sidewall of the opening. The conductive ink can be applied by a printing process. An interconnect structure is formed over a second surface of the encapsulant opposite the first surface of the encapsulant. The interconnect structure is electrically connected to the semiconductor die. A semiconductor package is disposed over the first surface of the encapsulant with a plurality of bumps electrically connected to the conductive ink layer. The semiconductor package may contain a memory device.

摘要翻译： 半导体器件具有沉积在半导体管芯上方和周围的具有密封剂的半导体管芯。 通过蚀刻或LDA在密封剂的第一表面中形成开口。 可选地，在半导体管芯上形成多个凸块。 凹凸凹陷在密封剂的开口内。 导电油墨形成在开口的密封剂，凸起和侧壁的第一表面上。 导电油墨可以通过印刷方法施加。 在密封剂的与密封剂的第一表面相对的第二表面上形成互连结构。 互连结构电连接到半导体管芯。 半导体封装设置在密封剂的第一表面上，多个凸块电连接到导电油墨层。 半导体封装可以包含存储器件。

公开(公告)号：US09331007B2

公开(公告)日：2016-05-03

申请号：US13653242

申请日：2012-10-16

申请人： STATS ChipPAC, Ltd.

发明人： Insang Yoon ,  Flynn Carson ,  Il Kwon Shim ,  SeongHun Mun

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L23/49816 ,  H01L21/568 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2225/0651 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/11 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L2224/19

摘要： A semiconductor device has a semiconductor die with an encapsulant deposited over and around the semiconductor die. An opening is formed in a first surface of the encapsulant by etching or LDA. A plurality of bumps is optionally formed over the semiconductor die. A bump is recessed within the opening of the encapsulant. A conductive ink is formed over the first surface of the encapsulant, bump and sidewall of the opening. The conductive ink can be applied by a printing process. An interconnect structure is formed over a second surface of the encapsulant opposite the first surface of the encapsulant. The interconnect structure is electrically connected to the semiconductor die. A semiconductor package is disposed over the first surface of the encapsulant with a plurality of bumps electrically connected to the conductive ink layer. The semiconductor package may contain a memory device.

摘要翻译： 半导体器件具有沉积在半导体管芯上方和周围的具有密封剂的半导体管芯。 通过蚀刻或LDA在密封剂的第一表面中形成开口。 可选地，在半导体管芯上形成多个凸块。 凹凸凹陷在密封剂的开口内。 导电油墨形成在开口的密封剂，凸起和侧壁的第一表面上。 导电油墨可以通过印刷方法施加。 在密封剂的与密封剂的第一表面相对的第二表面上形成互连结构。 互连结构电连接到半导体管芯。 半导体封装设置在密封剂的第一表面上，多个凸块电连接到导电油墨层。 半导体封装可以包含存储器件。