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公开(公告)号：US10598690B2
公开(公告)日：2020-03-24
申请号：US14964469
申请日：2015-12-09
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Barbara Simoni , Carlo Valzasina
IPC: G01P15/18 , G01C19/574 , G01P15/125
Abstract: A microelectromechanical device includes: a supporting structure; two sensing masses, movable with respect to the supporting structure according to a first axis and a respective second axis; a driving device for maintaining the sensing masses in oscillation along the first axis in phase opposition; sensing units for supplying sensing signals indicative of displacements respectively of the sensing masses according to the respective second axis; processing components for combining the sensing signals so as to: in a first sensing mode, amplify effects on the sensing signals of concordant displacements and attenuate effects of discordant displacements of the sensing masses; and in a second sensing mode, amplify effects on the sensing signals of discordant displacements and attenuate effects of concordant displacements of the sensing masses.
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2.发明申请公开(公告)号：US20150362522A1
公开(公告)日：2015-12-17
申请号：US13952503
申请日：2013-07-26
Applicant: STMicroelectronics S.r.l. , Politecnico Di Milano
Inventor： Barbara Simoni , Claudia Comi , Alberto Corigliano
IPC: G01P15/097
CPC classification number: G01P15/097 , G01P15/10
Abstract: A MEMS resonant accelerometer is disclosed, having: a proof mass coupled to a first anchoring region via a first elastic element so as to be free to move along a sensing axis in response to an external acceleration; and a first resonant element mechanically coupled to the proof mass through the first elastic element so as to be subject to a first axial stress when the proof mass moves along the sensing axis and thus to a first variation of a resonant frequency. The MEMS resonant accelerometer is further provided with a second resonant element mechanically coupled to the proof mass through a second elastic element so as to be subject to a second axial stress when the proof mass moves along the sensing axis, substantially opposite to the first axial stress, and thus to a second variation of a resonant frequency, opposite to the first variation.
Abstract translation: 公开了一种MEMS谐振加速度计，其具有：经由第一弹性元件耦合到第一锚定区域的检测质量，以便响应于外部加速度沿感测轴线自由移动; 以及第一谐振元件，其通过所述第一弹性元件机械耦合到所述检验质量块，以便当所述检测质量沿着所述感测轴线移动并且因此达到谐振频率的第一变化时，经受第一轴向应力。 MEMS谐振加速度计进一步设置有第二谐振元件，其通过第二弹性元件机械耦合到校准物质，以便当检测质量沿着感测轴线移动时受到第二轴向应力，基本上与第一轴向应力相反 ，从而达到与第一变化相反的谐振频率的第二变化。
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3.发明申请MICROELECTROMECHANICAL SENSOR WITH OUT-OF-PLANE SENSING AND PROCESS FOR MANUFACTURING A MICROELECTROMECHANICAL SENSOR 有权微机电传感器，具有超平面感测和制造微电子传感器的工艺公开(公告)号：US20130220016A1
公开(公告)日：2013-08-29
申请号：US13779002
申请日：2013-02-27
Applicant: STMicroelectronics S.r.l.
Inventor： Barbara Simoni , Carlo Valzasina
IPC: G01P15/125 , B81C1/00
CPC classification number: G01P15/125 , B81B3/0094 , B81B2201/0235 , B81B2201/0242 , B81B2201/033 , B81B2203/04 , B81B2203/058 , B81C1/00198 , G01P15/0802
Abstract: A microelectromechanical sensor that in one embodiment includes a supporting structure, having a substrate and electrode structures anchored to the substrate; and a sensing mass, movable with respect to the supporting structure so that a distance between the sensing mass and the substrate is variable. The sensing mass is provided with movable electrodes capacitively coupled to the electrode structures. Each electrode structure comprises a first fixed electrode and a second fixed electrode mutually insulated by a dielectric region and arranged in succession in a direction substantially perpendicular to a face of the substrate.
Abstract translation: 一种微机电传感器，其在一个实施例中包括支撑结构，其具有衬底和锚定到衬底的电极结构; 以及相对于支撑结构可移动的感测质量，使得感测质量块和衬底之间的距离是可变的。 感测质量体具有与电极结构电容耦合的可动电极。 每个电极结构包括第一固定电极和第二固定电极，所述第一固定电极和第二固定电极通过电介质区域相互绝缘并且在基本上垂直于所述衬底的表面的方向上相继布置。
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4.发明授权公开(公告)号：US09452922B2
公开(公告)日：2016-09-27
申请号：US13922033
申请日：2013-06-19
Applicant: STMicroelectronics S.r.l.
Inventor： Giorgio Allegato , Barbara Simoni , Carlo Valzasina , Lorenzo Corso
CPC classification number: B81B7/0074 , B81B7/007 , B81B7/008 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81B2207/015 , B81B2207/07 , B81B2207/092 , B81B2207/093 , B81B2207/096 , B81B2207/097 , B81C1/0023 , B81C2203/0118 , B81C2203/0792 , H01L2924/0002 , H01L2924/00
Abstract: A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.
Abstract translation: 微机电装置包括：容纳微机电结构的主体; 以及盖，其结合到主体并通过导电接合区域电耦合到微机电结构。 盖包括选择模块，其具有耦合到微机电结构的第一选择端子，第二选择端子和至少一个控制端子，并且可以通过控制端子控制以将第二选择端子耦合到相应的第一选择端子， 选择性地，对应于相应的操作条件的多个耦合配置之一。
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Patent Agency Ranking
公开(公告)号：US09718675B2
公开(公告)日：2017-08-01
申请号：US14971639
申请日：2015-12-16
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Giorgio Allegato , Barbara Simoni , Carlo Valzasina , Lorenzo Corso
CPC classification number: B81B7/0074 , B81B7/007 , B81B7/008 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81B2207/015 , B81B2207/07 , B81B2207/092 , B81B2207/093 , B81B2207/096 , B81B2207/097 , B81C1/0023 , B81C2203/0118 , B81C2203/0792 , H01L2924/0002 , H01L2924/00
Abstract: A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.
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6.发明申请公开(公告)号：US20140230546A1
公开(公告)日：2014-08-21
申请号：US13922033
申请日：2013-06-19
Applicant: STMicroelectronics S.r.l.
Inventor： Giorgio Allegato , Barbara Simoni , Carlo Valzasina , Lorenzo Corso
IPC: B81B7/00
CPC classification number: B81B7/0074 , B81B7/007 , B81B7/008 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81B2207/015 , B81B2207/07 , B81B2207/092 , B81B2207/093 , B81B2207/096 , B81B2207/097 , B81C1/0023 , B81C2203/0118 , B81C2203/0792 , H01L2924/0002 , H01L2924/00
Abstract: A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.
Abstract translation: 微机电装置包括：容纳微机电结构的主体; 以及盖，其结合到主体并通过导电接合区域电耦合到微机电结构。 盖包括选择模块，其具有耦合到微机电结构的第一选择端子，第二选择端子和至少一个控制端子，并且可以通过控制端子控制以将第二选择端子耦合到相应的第一选择端子， 选择性地，对应于相应的操作条件的多个耦合配置之一。
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7.发明授权Microelectromechanical sensor with out-of-plane sensing and process for manufacturing a microelectromechanical sensor 有权具有平面外感测的微机电传感器和用于制造微机电传感器的工艺公开(公告)号：US09383382B2
公开(公告)日：2016-07-05
申请号：US13779002
申请日：2013-02-27
Applicant: STMicroelectronics S.r.l.
Inventor： Barbara Simoni , Carlo Valzasina
IPC: G01P15/125 , B81C1/00 , G01P15/08 , B81B3/00
CPC classification number: G01P15/125 , B81B3/0094 , B81B2201/0235 , B81B2201/0242 , B81B2201/033 , B81B2203/04 , B81B2203/058 , B81C1/00198 , G01P15/0802
Abstract: A microelectromechanical sensor that in one embodiment includes a supporting structure, having a substrate and electrode structures anchored to the substrate; and a sensing mass, movable with respect to the supporting structure so that a distance between the sensing mass and the substrate is variable. The sensing mass is provided with movable electrodes capacitively coupled to the electrode structures. Each electrode structure comprises a first fixed electrode and a second fixed electrode mutually insulated by a dielectric region and arranged in succession in a direction substantially perpendicular to a face of the substrate.
Abstract translation: 一种微机电传感器，其在一个实施例中包括支撑结构，其具有衬底和锚定到衬底的电极结构; 以及相对于支撑结构可移动的感测质量，使得感测质量块和衬底之间的距离是可变的。 感测质量体具有与电极结构电容耦合的可动电极。 每个电极结构包括第一固定电极和第二固定电极，所述第一固定电极和第二固定电极通过电介质区域相互绝缘并且在基本上垂直于衬底的表面的方向上相继布置。
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公开(公告)号：US11274036B2
公开(公告)日：2022-03-15
申请号：US16815883
申请日：2020-03-11
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Giorgio Allegato , Barbara Simoni , Carlo Valzasina , Lorenzo Corso
Abstract: A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.
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9.发明授权公开(公告)号：US08820161B2
公开(公告)日：2014-09-02
申请号：US13888170
申请日：2013-05-06
Applicant: STMicroelectronics S.r.l.
Inventor： Gabriele Cazzaniga , Luca Coronato , Barbara Simoni
IPC: G01P15/125 , G01P15/02 , G01C19/5755 , G01C19/5769 , G01C19/5712
CPC classification number: G01P15/125 , G01C19/5712 , G01C19/5755 , G01C19/5769 , G01P15/02 , G01P2015/0831
Abstract: A MEMS detection structure is provided with: a substrate having a top surface, on which a first fixed-electrode arrangement is set; a sensing mass, extending in a plane and suspended above the substrate and above the first fixed-electrode arrangement at a separation distance; and connection elastic elements that support the sensing mass so that it is free to rotate out of the plane about an axis of rotation, modifying the separation distance, as a function of a quantity to be detected along an axis orthogonal to the plane. The MEMS detection structure also includes: a coupling mass, suspended above the substrate and connected to the sensing mass via the connection elastic elements; and an anchoring arrangement, which anchors the coupling mass to the substrate with a first point of constraint, set at a distance from the axis of rotation and in a position corresponding to the first fixed-electrode arrangement.
Abstract translation: MEMS检测结构设置有：具有顶表面的基板，其上设置有第一固定电极布置; 感测质量块，在平面内延伸并悬挂在衬底上方，并以分隔距离悬挂在第一固定电极装置上方; 以及连接弹性元件，其支撑感测质量，使得其可以围绕旋转轴线自由地旋转离开平面，根据沿着与该平面垂直的轴线被检测的量来修改分离距离。 MEMS检测结构还包括：耦合质量块，悬挂在衬底上并通过连接弹性元件连接到感测质量块; 以及锚定装置，其将耦合质量块固定到具有第一限制点的衬底上，该第一约束点设置在距旋转轴线一定距离处，并且位于对应于第一固定电极装置的位置。
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