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1.发明公开公开(公告)号：US20230324229A1
公开(公告)日：2023-10-12
申请号：US18335003
申请日：2023-06-14
IPC分类号： G01J5/16 , G01J5/20 , H01L27/146 , H04N5/33
CPC分类号： G01J5/16 , G01J5/20 , H01L27/14669 , H04N5/33 , G01J2005/0077
摘要： A thermographic sensor is proposed. The thermographic sensor includes a plurality of sensing elements each comprising at least one thermo-couple. The thermographic sensor is integrated on a semiconductor on insulator body that is patterned to define a grid suspended from a substrate; for each sensing element, the grid has a frame with the cold joint of the thermo-couple, a plate with the hot joint of the thermo-couple and one or more arms sustaining the plate from the frame. The frames include one or more conductive layers of thermally conductive material for thermally equalizing the cold joints with the substrate. Moreover, each sensing element may also include a processing circuit for the thermo-couple that is integrated on the corresponding frame. A thermographic device including the thermographic sensor and a corresponding signal processing circuit, and a system including one or more thermographic devices are also proposed.
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公开(公告)号：US20160347606A1
公开(公告)日：2016-12-01
申请号：US14962945
申请日：2015-12-08
发明人： Giuseppe BRUNO , Sebastiano CONTI , Mario CHIRICOSTA , Michele VAIANA , Calogero Marco IPPOLITO , Mario MAIORE , Daniele CASELLA
IPC分类号： B81B7/00
CPC分类号： B81B7/007 , B81B7/02 , B81B2201/0264 , B81B2201/0292 , B81B2207/094 , G01L19/0092 , G01N27/223 , H01L23/3121 , H01L2224/32145 , H01L2224/48091 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： A packaged sensor assembly includes: a packaging structure, having at least one opening; a humidity sensor and a pressure sensor, which are housed inside the packaging structure and communicate fluidically with the outside through the opening, and a control circuit, operatively coupled to the humidity sensor and to the pressure sensor; wherein the humidity sensor and the control circuit are integrated in a first chip, and the pressure sensor is integrated in a second chip distinct from the first chip and bonded to the first chip.
摘要翻译： 包装传感器组件包括：具有至少一个开口的包装结构; 湿度传感器和压力传感器，其容纳在包装结构内并通过开口与外部流体连通;以及控制电路，可操作地耦合到湿度传感器和压力传感器; 其中所述湿度传感器和所述控制电路集成在第一芯片中，并且所述压力传感器集成在与所述第一芯片不同的第二芯片中并且被结合到所述第一芯片。
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公开(公告)号：US20240239648A1
公开(公告)日：2024-07-18
申请号：US18409584
申请日：2024-01-10
发明人： Silvia NICOLI , Lorenzo TENTORI , Giuseppe BRUNO
CPC分类号： B81B7/0067 , B81C1/00317 , B81B2201/0292 , B81B2203/0315 , B81C2203/0118 , B81C2203/0127
摘要： The MEMS device has: a sensor body having a functional structure configured to transduce a physical or chemical quantity into a corresponding electrical quantity; and a cap bonded to the sensor body and having a first cavity overlying the functional structure. The cap has a supporting portion and a cover portion that form the first cavity. The supporting portion is bonded to the sensor body. The cover portion is bonded to the supporting portion and has an inner wall delimiting on a side the first cavity and facing the functional structure. The MEMS device further has a first coating that extends within the first cavity on the inner wall of the cover portion.
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公开(公告)号：US20240036595A1
公开(公告)日：2024-02-01
申请号：US18224897
申请日：2023-07-21
摘要： A low-drop out voltage regulator includes a pass element arranged between an input terminal and an output terminal, a feedback network configured to produce a feedback voltage derived from an output voltage, and an error amplifier configured to drive the pass element as a function of a difference between the feedback voltage and a reference voltage. An output transistor coupled in series with the pass element is controlled by a mode selection circuit. In response to assertion of a mode selection signal, the mode selection circuit turns on the output transistor to sink a current with a controlled magnitude from the output node. In response to de-assertion of the mode selection signal, the mode selection circuit sinks a current with a controlled magnitude from a control terminal of the output transistor to turn off the output transistor at a controlled rate.
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公开(公告)号：US20220170795A1
公开(公告)日：2022-06-02
申请号：US17537074
申请日：2021-11-29
摘要： A thermographic sensor is proposed. The thermographic sensor includes one or more thermo-couples, each for providing a sensing voltage depending on a difference between a temperature of a hot joint and a temperature of a cold joint of the thermo-couple; the thermographic sensor further comprises one or more sensing transistors, each driven according to the sensing voltages of one or more corresponding thermo-couples for providing a sensing electrical signal depending on its temperature and on the corresponding sensing voltages. A thermographic device including the thermographic sensor and a corresponding signal processing circuit, and a system including one or more thermographic devices are also proposed.
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公开(公告)号：US20230236161A1
公开(公告)日：2023-07-27
申请号：US18091470
申请日：2022-12-30
CPC分类号： G01N33/0027 , G01N27/045
摘要： A gas sensor is formed by a thin-film semiconductor metal-oxide gas sensing layer, with a thermally conductive and electrically-insulating layer in direct physical contact with a back of the gas sensing layer to carry the gas sensing layer. Sensing circuitry applies a voltage to the gas sensing layer and measures a current flowing through the gas sensing layer. The current flowing through the gas sensing layer is indicative of whether a gas under detection has been detected by the gas sensing layer, and serves to self-heat the gas sensing layer. A support structure extends from a substrate to make direct physical contact with and carry the thermally conductive and electrically insulating layer about a perimeter of a back face thereof, with the support structure shaped to form an air gap between the back of the thermally conductive and electrically insulating layer and a front of the substrate.
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7.发明公开公开(公告)号：US20230152161A1
公开(公告)日：2023-05-18
申请号：US17513675
申请日：2021-10-28
CPC分类号： G01J5/24 , F24C15/2021 , G01J5/041
摘要： A device including a sensor is disclosed. In one embodiment, the sensor includes a thermal infrared sensor or a sensor based on CMOS-SOI-MEMS technology (also referred to as “TMOS”). The sensor is capable of performing at least two functions at the same time. The first is remote temperature measurement and the second is presence detection. The sensor passively collects infrared information and a microprocessor coupled to the sensor determines the temperature as well as presence.
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公开(公告)号：US20220170794A1
公开(公告)日：2022-06-02
申请号：US17537086
申请日：2021-11-29
IPC分类号： G01J5/16 , H04N5/33 , H01L27/146 , G01J5/20
摘要： A thermographic sensor is proposed. The thermographic sensor includes a plurality of sensing elements each comprising at least one thermo-couple. The thermographic sensor is integrated on a semiconductor on insulator body that is patterned to define a grid suspended from a substrate; for each sensing element, the grid has a frame with the cold joint of the thermo-couple, a plate with the hot joint of the thermo-couple and one or more arms sustaining the plate from the frame. The frames include one or more conductive layers of thermally conductive material for thermally equalizing the cold joints with the substrate. Moreover, each sensing element may also include a processing circuit for the thermo-couple that is integrated on the corresponding frame. A thermographic device including the thermographic sensor and a corresponding signal processing circuit, and a system including one or more thermographic devices are also proposed.
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